CN118974905A - 基板搬运系统及移载机器人 - Google Patents

基板搬运系统及移载机器人 Download PDF

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Publication number
CN118974905A
CN118974905A CN202380030876.8A CN202380030876A CN118974905A CN 118974905 A CN118974905 A CN 118974905A CN 202380030876 A CN202380030876 A CN 202380030876A CN 118974905 A CN118974905 A CN 118974905A
Authority
CN
China
Prior art keywords
arm
support portion
transfer robot
substrate
placement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380030876.8A
Other languages
English (en)
Chinese (zh)
Inventor
金泽敬冶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hirata Corp
Original Assignee
Hirata Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corp filed Critical Hirata Corp
Publication of CN118974905A publication Critical patent/CN118974905A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/06—Program-controlled manipulators characterised by multi-articulated arms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN202380030876.8A 2022-03-30 2023-03-30 基板搬运系统及移载机器人 Pending CN118974905A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2022/016244 WO2023188181A1 (ja) 2022-03-30 2022-03-30 基板搬送システム及び移載ロボット
JPPCT/JP2022/016244 2022-03-30
PCT/JP2023/013176 WO2023190868A1 (ja) 2022-03-30 2023-03-30 基板搬送システム及び移載ロボット

Publications (1)

Publication Number Publication Date
CN118974905A true CN118974905A (zh) 2024-11-15

Family

ID=88199748

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380030876.8A Pending CN118974905A (zh) 2022-03-30 2023-03-30 基板搬运系统及移载机器人

Country Status (5)

Country Link
US (1) US20250018578A1 (cg-RX-API-DMAC7.html)
JP (1) JP7818692B2 (cg-RX-API-DMAC7.html)
CN (1) CN118974905A (cg-RX-API-DMAC7.html)
TW (1) TWI867482B (cg-RX-API-DMAC7.html)
WO (2) WO2023188181A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102862151B1 (ko) * 2022-12-13 2025-09-18 세메스 주식회사 지지 유닛, 라인 스토리지 유닛 및 이를 포함하는 반송 시스템

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6121743A (en) * 1996-03-22 2000-09-19 Genmark Automation, Inc. Dual robotic arm end effectors having independent yaw motion
JP4852719B2 (ja) * 2005-12-05 2012-01-11 日本電産サンキョー株式会社 多関節型ロボット
JP4746027B2 (ja) * 2007-12-10 2011-08-10 川崎重工業株式会社 基板搬送方法
JP5316521B2 (ja) * 2010-03-31 2013-10-16 株式会社安川電機 基板搬送システム、基板処理システムおよび基板搬送ロボット
JP5462064B2 (ja) * 2010-04-28 2014-04-02 日本電産サンキョー株式会社 産業用ロボット
JP5621796B2 (ja) * 2012-01-31 2014-11-12 株式会社安川電機 搬送システム
JP5990359B2 (ja) * 2012-10-04 2016-09-14 平田機工株式会社 搬入出ロボット
KR20160055010A (ko) 2014-11-07 2016-05-17 삼성전자주식회사 웨이퍼 이송 로봇 및 그 제어 방법
US10580682B2 (en) * 2017-02-15 2020-03-03 Persimmon Technologies, Corp. Material-handling robot with multiple end-effectors
US10155309B1 (en) * 2017-11-16 2018-12-18 Lam Research Corporation Wafer handling robots with rotational joint encoders

Also Published As

Publication number Publication date
WO2023188181A1 (ja) 2023-10-05
TW202402482A (zh) 2024-01-16
WO2023190868A1 (ja) 2023-10-05
TWI867482B (zh) 2024-12-21
KR20240155934A (ko) 2024-10-29
JPWO2023190868A1 (cg-RX-API-DMAC7.html) 2023-10-05
US20250018578A1 (en) 2025-01-16
JP7818692B2 (ja) 2026-02-20
TW202516668A (zh) 2025-04-16

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