JP7818692B2 - 基板搬送システム及び移載ロボット - Google Patents

基板搬送システム及び移載ロボット

Info

Publication number
JP7818692B2
JP7818692B2 JP2024512795A JP2024512795A JP7818692B2 JP 7818692 B2 JP7818692 B2 JP 7818692B2 JP 2024512795 A JP2024512795 A JP 2024512795A JP 2024512795 A JP2024512795 A JP 2024512795A JP 7818692 B2 JP7818692 B2 JP 7818692B2
Authority
JP
Japan
Prior art keywords
arm
placement
support portion
unit
transfer robot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024512795A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023190868A5 (cg-RX-API-DMAC7.html
JPWO2023190868A1 (cg-RX-API-DMAC7.html
Inventor
敬冶 金澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hirata Corp
Original Assignee
Hirata Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corp filed Critical Hirata Corp
Publication of JPWO2023190868A1 publication Critical patent/JPWO2023190868A1/ja
Publication of JPWO2023190868A5 publication Critical patent/JPWO2023190868A5/ja
Application granted granted Critical
Publication of JP7818692B2 publication Critical patent/JP7818692B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/06—Program-controlled manipulators characterised by multi-articulated arms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2024512795A 2022-03-30 2023-03-30 基板搬送システム及び移載ロボット Active JP7818692B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2022/016244 WO2023188181A1 (ja) 2022-03-30 2022-03-30 基板搬送システム及び移載ロボット
JPPCT/JP2022/016244 2022-03-30
PCT/JP2023/013176 WO2023190868A1 (ja) 2022-03-30 2023-03-30 基板搬送システム及び移載ロボット

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2026017665A Division JP2026071332A (ja) 2022-03-30 2026-02-05 移載ロボット及び基板搬送システム

Publications (3)

Publication Number Publication Date
JPWO2023190868A1 JPWO2023190868A1 (cg-RX-API-DMAC7.html) 2023-10-05
JPWO2023190868A5 JPWO2023190868A5 (cg-RX-API-DMAC7.html) 2024-12-20
JP7818692B2 true JP7818692B2 (ja) 2026-02-20

Family

ID=88199748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024512795A Active JP7818692B2 (ja) 2022-03-30 2023-03-30 基板搬送システム及び移載ロボット

Country Status (5)

Country Link
US (1) US20250018578A1 (cg-RX-API-DMAC7.html)
JP (1) JP7818692B2 (cg-RX-API-DMAC7.html)
CN (1) CN118974905A (cg-RX-API-DMAC7.html)
TW (1) TWI867482B (cg-RX-API-DMAC7.html)
WO (2) WO2023188181A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102862151B1 (ko) * 2022-12-13 2025-09-18 세메스 주식회사 지지 유닛, 라인 스토리지 유닛 및 이를 포함하는 반송 시스템

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002522238A (ja) 1998-08-04 2002-07-23 ジェンマーク・オートメーション・インコーポレーテッド 多自由度を有するロボット
JP2007152490A (ja) 2005-12-05 2007-06-21 Nidec Sankyo Corp 多関節型ロボット
JP2008103755A (ja) 2007-12-10 2008-05-01 Kawasaki Heavy Ind Ltd 基板搬送方法
JP2011230256A (ja) 2010-04-28 2011-11-17 Nidec Sankyo Corp 産業用ロボット
JP2013157562A (ja) 2012-01-31 2013-08-15 Yaskawa Electric Corp 搬送システム
US20160133502A1 (en) 2014-11-07 2016-05-12 Jung-min Won Wafer transfer robot, method of controlling the same, and method of manufacturing a semiconductor device using the same
JP2021503720A (ja) 2017-11-16 2021-02-12 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 回転関節エンコーダを備えるウエハハンドリングロボット

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5316521B2 (ja) * 2010-03-31 2013-10-16 株式会社安川電機 基板搬送システム、基板処理システムおよび基板搬送ロボット
JP5990359B2 (ja) * 2012-10-04 2016-09-14 平田機工株式会社 搬入出ロボット
US10580682B2 (en) * 2017-02-15 2020-03-03 Persimmon Technologies, Corp. Material-handling robot with multiple end-effectors

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002522238A (ja) 1998-08-04 2002-07-23 ジェンマーク・オートメーション・インコーポレーテッド 多自由度を有するロボット
JP2007152490A (ja) 2005-12-05 2007-06-21 Nidec Sankyo Corp 多関節型ロボット
JP2008103755A (ja) 2007-12-10 2008-05-01 Kawasaki Heavy Ind Ltd 基板搬送方法
JP2011230256A (ja) 2010-04-28 2011-11-17 Nidec Sankyo Corp 産業用ロボット
JP2013157562A (ja) 2012-01-31 2013-08-15 Yaskawa Electric Corp 搬送システム
US20160133502A1 (en) 2014-11-07 2016-05-12 Jung-min Won Wafer transfer robot, method of controlling the same, and method of manufacturing a semiconductor device using the same
JP2021503720A (ja) 2017-11-16 2021-02-12 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 回転関節エンコーダを備えるウエハハンドリングロボット

Also Published As

Publication number Publication date
WO2023188181A1 (ja) 2023-10-05
TW202402482A (zh) 2024-01-16
WO2023190868A1 (ja) 2023-10-05
TWI867482B (zh) 2024-12-21
KR20240155934A (ko) 2024-10-29
CN118974905A (zh) 2024-11-15
JPWO2023190868A1 (cg-RX-API-DMAC7.html) 2023-10-05
US20250018578A1 (en) 2025-01-16
TW202516668A (zh) 2025-04-16

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