TWI867482B - 基板搬送系統及移載機器人 - Google Patents

基板搬送系統及移載機器人 Download PDF

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Publication number
TWI867482B
TWI867482B TW112112160A TW112112160A TWI867482B TW I867482 B TWI867482 B TW I867482B TW 112112160 A TW112112160 A TW 112112160A TW 112112160 A TW112112160 A TW 112112160A TW I867482 B TWI867482 B TW I867482B
Authority
TW
Taiwan
Prior art keywords
arm
loading
section
aforementioned
transfer robot
Prior art date
Application number
TW112112160A
Other languages
English (en)
Chinese (zh)
Other versions
TW202402482A (zh
Inventor
金澤敬冶
Original Assignee
日商平田機工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商平田機工股份有限公司 filed Critical 日商平田機工股份有限公司
Publication of TW202402482A publication Critical patent/TW202402482A/zh
Application granted granted Critical
Publication of TWI867482B publication Critical patent/TWI867482B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/06—Program-controlled manipulators characterised by multi-articulated arms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW112112160A 2022-03-30 2023-03-30 基板搬送系統及移載機器人 TWI867482B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2022/016244 2022-03-30
PCT/JP2022/016244 WO2023188181A1 (ja) 2022-03-30 2022-03-30 基板搬送システム及び移載ロボット

Publications (2)

Publication Number Publication Date
TW202402482A TW202402482A (zh) 2024-01-16
TWI867482B true TWI867482B (zh) 2024-12-21

Family

ID=88199748

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112112160A TWI867482B (zh) 2022-03-30 2023-03-30 基板搬送系統及移載機器人

Country Status (5)

Country Link
US (1) US20250018578A1 (cg-RX-API-DMAC7.html)
JP (1) JP7818692B2 (cg-RX-API-DMAC7.html)
CN (1) CN118974905A (cg-RX-API-DMAC7.html)
TW (1) TWI867482B (cg-RX-API-DMAC7.html)
WO (2) WO2023188181A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102862151B1 (ko) * 2022-12-13 2025-09-18 세메스 주식회사 지지 유닛, 라인 스토리지 유닛 및 이를 포함하는 반송 시스템

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002522238A (ja) * 1998-08-04 2002-07-23 ジェンマーク・オートメーション・インコーポレーテッド 多自由度を有するロボット
JP2013065894A (ja) * 2010-03-31 2013-04-11 Yaskawa Electric Corp 基板搬送システム、基板処理システムおよび基板搬送ロボット
CN103707285A (zh) * 2012-10-04 2014-04-09 平田机工株式会社 搬入搬出机器人

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4852719B2 (ja) * 2005-12-05 2012-01-11 日本電産サンキョー株式会社 多関節型ロボット
JP4746027B2 (ja) * 2007-12-10 2011-08-10 川崎重工業株式会社 基板搬送方法
JP5462064B2 (ja) * 2010-04-28 2014-04-02 日本電産サンキョー株式会社 産業用ロボット
JP5621796B2 (ja) * 2012-01-31 2014-11-12 株式会社安川電機 搬送システム
KR20160055010A (ko) 2014-11-07 2016-05-17 삼성전자주식회사 웨이퍼 이송 로봇 및 그 제어 방법
US10580682B2 (en) * 2017-02-15 2020-03-03 Persimmon Technologies, Corp. Material-handling robot with multiple end-effectors
US10155309B1 (en) * 2017-11-16 2018-12-18 Lam Research Corporation Wafer handling robots with rotational joint encoders

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002522238A (ja) * 1998-08-04 2002-07-23 ジェンマーク・オートメーション・インコーポレーテッド 多自由度を有するロボット
JP2013065894A (ja) * 2010-03-31 2013-04-11 Yaskawa Electric Corp 基板搬送システム、基板処理システムおよび基板搬送ロボット
CN103707285A (zh) * 2012-10-04 2014-04-09 平田机工株式会社 搬入搬出机器人

Also Published As

Publication number Publication date
WO2023188181A1 (ja) 2023-10-05
TW202402482A (zh) 2024-01-16
WO2023190868A1 (ja) 2023-10-05
KR20240155934A (ko) 2024-10-29
CN118974905A (zh) 2024-11-15
JPWO2023190868A1 (cg-RX-API-DMAC7.html) 2023-10-05
US20250018578A1 (en) 2025-01-16
JP7818692B2 (ja) 2026-02-20
TW202516668A (zh) 2025-04-16

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