CN118715619A - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN118715619A
CN118715619A CN202380021941.0A CN202380021941A CN118715619A CN 118715619 A CN118715619 A CN 118715619A CN 202380021941 A CN202380021941 A CN 202380021941A CN 118715619 A CN118715619 A CN 118715619A
Authority
CN
China
Prior art keywords
conductor
transistor
insulator
semiconductor device
memory cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380021941.0A
Other languages
English (en)
Chinese (zh)
Inventor
大贯达也
国武宽司
中岛基
山崎舜平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of CN118715619A publication Critical patent/CN118715619A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B10/00Static random access memory [SRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/02Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/05Making the transistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B41/00Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/70Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the floating gate being an electrode shared by two or more components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
CN202380021941.0A 2022-03-04 2023-02-21 半导体装置 Pending CN118715619A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-033577 2022-03-04
JP2022033577 2022-03-04
PCT/IB2023/051550 WO2023166378A1 (ja) 2022-03-04 2023-02-21 半導体装置

Publications (1)

Publication Number Publication Date
CN118715619A true CN118715619A (zh) 2024-09-27

Family

ID=87883161

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380021941.0A Pending CN118715619A (zh) 2022-03-04 2023-02-21 半导体装置

Country Status (5)

Country Link
US (1) US20250185229A1 (https=)
JP (1) JPWO2023166378A1 (https=)
CN (1) CN118715619A (https=)
TW (1) TW202339129A (https=)
WO (1) WO2023166378A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12592275B2 (en) * 2024-01-09 2026-03-31 Macronix International Co., Ltd. Memory structure and control method for reducing layout area of memory device
WO2025163445A1 (ja) * 2024-01-31 2025-08-07 株式会社半導体エネルギー研究所 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100626036B1 (ko) * 2004-11-17 2006-09-20 삼성에스디아이 주식회사 유기 발광 소자 및 상기 유기 발광 소자의 제조방법
WO2012121265A1 (en) * 2011-03-10 2012-09-13 Semiconductor Energy Laboratory Co., Ltd. Memory device and method for manufacturing the same
TWI685113B (zh) * 2015-02-11 2020-02-11 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法
WO2018203181A1 (ja) * 2017-05-01 2018-11-08 株式会社半導体エネルギー研究所 半導体装置

Also Published As

Publication number Publication date
WO2023166378A1 (ja) 2023-09-07
TW202339129A (zh) 2023-10-01
US20250185229A1 (en) 2025-06-05
JPWO2023166378A1 (https=) 2023-09-07

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