CN118591575A - 环氧化合物、环氧树脂、环氧树脂组合物、固化物、预浸料、纤维增强复合材料及它们的制造方法、密封材料、半导体装置、密封半导体元件的方法以及用作密封材料的方法 - Google Patents

环氧化合物、环氧树脂、环氧树脂组合物、固化物、预浸料、纤维增强复合材料及它们的制造方法、密封材料、半导体装置、密封半导体元件的方法以及用作密封材料的方法 Download PDF

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Publication number
CN118591575A
CN118591575A CN202380019775.0A CN202380019775A CN118591575A CN 118591575 A CN118591575 A CN 118591575A CN 202380019775 A CN202380019775 A CN 202380019775A CN 118591575 A CN118591575 A CN 118591575A
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CN
China
Prior art keywords
fluorine
epoxy resin
containing epoxy
group
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380019775.0A
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English (en)
Chinese (zh)
Inventor
铃木聪太
细井健史
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Central Glass Co Ltd
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Central Glass Co Ltd
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Filing date
Publication date
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Publication of CN118591575A publication Critical patent/CN118591575A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/36—Compounds containing oxirane rings with hydrocarbon radicals, substituted by nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D301/00—Preparation of oxiranes
    • C07D301/27—Condensation of epihalohydrins or halohydrins with compounds containing active hydrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/10—Polycondensates containing more than one epoxy group per molecule of polyamines with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3227—Compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C08G59/329—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202380019775.0A 2022-03-25 2023-03-16 环氧化合物、环氧树脂、环氧树脂组合物、固化物、预浸料、纤维增强复合材料及它们的制造方法、密封材料、半导体装置、密封半导体元件的方法以及用作密封材料的方法 Pending CN118591575A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022050334 2022-03-25
JP2022-050334 2022-03-25
PCT/JP2023/010318 WO2023182141A1 (ja) 2022-03-25 2023-03-16 エポキシ化合物、エポキシ樹脂、エポキシ樹脂組成物、硬化物、プリプレグ、繊維強化複合材料、およびこれらの製造方法、封止材、半導体装置、半導体素子を封止する方法、並びに封止材として使用する方法

Publications (1)

Publication Number Publication Date
CN118591575A true CN118591575A (zh) 2024-09-03

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CN202380019775.0A Pending CN118591575A (zh) 2022-03-25 2023-03-16 环氧化合物、环氧树脂、环氧树脂组合物、固化物、预浸料、纤维增强复合材料及它们的制造方法、密封材料、半导体装置、密封半导体元件的方法以及用作密封材料的方法

Country Status (5)

Country Link
JP (1) JPWO2023182141A1 (https=)
KR (1) KR20240166466A (https=)
CN (1) CN118591575A (https=)
TW (1) TW202337948A (https=)
WO (1) WO2023182141A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3268037D1 (en) * 1981-10-01 1986-01-30 Secr Defence Brit Epoxy compounds
JP5019064B2 (ja) 2008-03-26 2012-09-05 Ｊｓｒ株式会社 液晶配向剤および液晶表示素子
CN102527265B (zh) * 2010-12-15 2013-11-27 华东理工大学 含六氟异丙醇基团的膜功能单体及其纳滤膜制备方法
KR20150037376A (ko) 2013-09-30 2015-04-08 주식회사 엘지화학 감광성 수지 조성물
JP7343794B2 (ja) * 2019-02-06 2023-09-13 セントラル硝子株式会社 ポリアミド酸およびポリイミド、光学フィルムおよび表示装置、ならびにそれらの製造方法
KR20220149694A (ko) * 2020-02-28 2022-11-08 샌트랄 글래스 컴퍼니 리미티드 경화성 수지, 경화성 수지 조성물, 경화물, 전자 디바이스, 적층판 재료, 전자 부품 밀봉재 및 경화성 수지의 제조 방법
CN116075424A (zh) * 2020-07-10 2023-05-05 中央硝子株式会社 聚苯并恶唑、聚酰胺、聚酰胺溶液、高频电子部件用绝缘材料、高频电子部件、高频设备、高频电子部件制造用绝缘材料、聚酰胺的制造方法、聚苯并恶唑的制造方法、高频电子部件用绝缘材料的制造方法、及二胺或其盐
WO2022014425A1 (ja) * 2020-07-13 2022-01-20 セントラル硝子株式会社 ポリアミド、ポリアミドイミド及びこれらの誘導体、光学フィルム及び表示装置、ならびにこれらの製造方法
WO2022030447A1 (ja) * 2020-08-05 2022-02-10 セントラル硝子株式会社 含フッ素ジアミンまたはその塩、含フッ素ジアミンまたはその塩の製造方法、ポリアミド、ポリアミドの製造方法、ポリアミド溶液、ポリアミド環化体、ポリアミド環化体の製造方法、高周波電子部品用絶縁材、高周波電子部品用絶縁材の製造方法、高周波電子部品、高周波機器および高周波電子部品製造用絶縁材料
JP2023126997A (ja) * 2020-08-05 2023-09-13 セントラル硝子株式会社 感光性樹脂組成物、感光性樹脂膜、パターン樹脂膜、硬化物、パターン硬化物、電子装置の製造方法、および電子装置
JP2022122814A (ja) * 2021-02-10 2022-08-23 東ソー株式会社 ポリウレタンウレア樹脂形成性組成物、接着剤及びイソシアネート用硬化剤

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KR20240166466A (ko) 2024-11-26
JPWO2023182141A1 (https=) 2023-09-28
WO2023182141A1 (ja) 2023-09-28
TW202337948A (zh) 2023-10-01

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