CN118541448A - 树脂组合物、预浸料、具有树脂的膜、具有树脂的金属箔片材、覆金属层压体和印刷线路板 - Google Patents

树脂组合物、预浸料、具有树脂的膜、具有树脂的金属箔片材、覆金属层压体和印刷线路板 Download PDF

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Publication number
CN118541448A
CN118541448A CN202380017124.8A CN202380017124A CN118541448A CN 118541448 A CN118541448 A CN 118541448A CN 202380017124 A CN202380017124 A CN 202380017124A CN 118541448 A CN118541448 A CN 118541448A
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CN
China
Prior art keywords
resin composition
resin
compound
composition according
molybdenum compound
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Pending
Application number
CN202380017124.8A
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English (en)
Chinese (zh)
Inventor
石川雄一
井上博晴
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication of CN118541448A publication Critical patent/CN118541448A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
CN202380017124.8A 2022-01-28 2023-01-12 树脂组合物、预浸料、具有树脂的膜、具有树脂的金属箔片材、覆金属层压体和印刷线路板 Pending CN118541448A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-012410 2022-01-28
JP2022012410 2022-01-28
PCT/JP2023/000640 WO2023145471A1 (ja) 2022-01-28 2023-01-12 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板

Publications (1)

Publication Number Publication Date
CN118541448A true CN118541448A (zh) 2024-08-23

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CN202380017124.8A Pending CN118541448A (zh) 2022-01-28 2023-01-12 树脂组合物、预浸料、具有树脂的膜、具有树脂的金属箔片材、覆金属层压体和印刷线路板

Country Status (5)

Country Link
US (1) US20250108582A1 (https=)
JP (1) JPWO2023145471A1 (https=)
CN (1) CN118541448A (https=)
TW (1) TW202336127A (https=)
WO (1) WO2023145471A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250087553A (ko) * 2022-10-12 2025-06-16 가부시끼가이샤 레조낙 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지
WO2025206152A1 (ja) * 2024-03-29 2025-10-02 パナソニックＩｐマネジメント株式会社 プリプレグ、並びに、それを用いた金属張積層板及び配線板
WO2025206156A1 (ja) * 2024-03-29 2025-10-02 パナソニックＩｐマネジメント株式会社 プリプレグ、並びに、それを用いた金属張積層板及び配線板
WO2025206169A1 (ja) * 2024-03-29 2025-10-02 パナソニックＩｐマネジメント株式会社 プリプレグ、並びに、それを用いた金属張積層板及び配線板

Family Cites Families (14)

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EP2518115B1 (en) * 2009-12-25 2017-10-18 Hitachi Chemical Company, Ltd. Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
JP5397717B2 (ja) * 2011-09-26 2014-01-22 三菱瓦斯化学株式会社 モリブデン化合物粉体、プリプレグ及び積層板
KR101996113B1 (ko) * 2012-03-30 2019-07-03 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그 및 적층판
JP2016074871A (ja) * 2014-03-04 2016-05-12 四国化成工業株式会社 ビスマレイミド樹脂組成物およびその利用
CN103980706B (zh) * 2014-05-16 2017-01-11 广东生益科技股份有限公司 一种热固性树脂组合物及其用途
CN106459558B (zh) * 2014-06-13 2019-03-08 Dic株式会社 固化性树脂组合物、其固化物、半导体密封材料、半导体装置、预浸料、电路基板、积层膜
CN107849361B (zh) * 2015-07-06 2020-10-16 三菱瓦斯化学株式会社 树脂组合物、预浸料、树脂片、覆金属箔层叠板和印刷电路板
JPWO2017170643A1 (ja) * 2016-03-31 2019-02-07 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、金属張積層板、樹脂基板、プリント配線基板および半導体装置
JP6851573B2 (ja) * 2016-09-02 2021-03-31 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、積層樹脂シート、樹脂シート、及びプリント配線板
JP2019099755A (ja) * 2017-12-07 2019-06-24 信越化学工業株式会社 熱硬化性樹脂組成物
CN109825081B (zh) * 2019-01-30 2021-06-04 广东生益科技股份有限公司 一种热固性树脂组合物、包含其的预浸料以及覆金属箔层压板和印制电路板
JP7088105B2 (ja) * 2019-03-27 2022-06-21 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置
CN115335433B (zh) * 2020-03-25 2024-08-09 三菱瓦斯化学株式会社 树脂组合物、预浸料、树脂片、层叠板、覆金属箔层叠板、及印刷电路板
CN113736255B (zh) * 2020-05-27 2023-07-14 台光电子材料(昆山)有限公司 一种树脂组合物及其制品

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Publication number Publication date
TW202336127A (zh) 2023-09-16
JPWO2023145471A1 (https=) 2023-08-03
US20250108582A1 (en) 2025-04-03
WO2023145471A1 (ja) 2023-08-03

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