CN1185319C - 按双点法和粘贴法固定夹层的交联基底层 - Google Patents
按双点法和粘贴法固定夹层的交联基底层 Download PDFInfo
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Abstract
本发明描述了用于涂敷和/或层压所形成表面的可交联的热熔粘合剂化合物的制备方法,其中的交联组分被微囊包封于硅烷化的聚丁二烯中。
Description
技术领域
本发明涉及微囊包封的可交联的热熔粘合剂涂层的制备方法,该涂层是基于包含微囊包封的聚异氰酸酯分散体和市售的胺端基的共聚多酰胺或共聚多酯的水性糊,用于制备双点涂层中作为回击屏障的基点。上点包含胺调节的共聚多酰胺以确保其良好结合于下点上。本发明特别涉及用于服装工业,尤其是外衣中可固定的夹层材料的网状涂层的热熔粘合剂化合物。也可用基于对苯二甲酸、间苯二甲酸和丁二醇或丁二醇与最高达12摩尔%的少量,优选6~10摩尔%的其他二醇,如已二醇或聚乙二醇联用的端基为OH、熔点为100~150℃的共多聚酯代替共聚多酰胺。
背景技术
为了解决洗涤和干洗稳定性低以及粘附力弱的问题,开发了改进的热熔粘合剂化合物以及改进的涂敷技术。二-或双点涂敷如专利DE-B 22 14 236,DE-B 22 31 723,DE-B 25 36 911和DE-B 32 30579中所描述。
涂敷载体按现有技术状况通过应用包括细旦单纤维包括微纤维范围的较细纱及合成纱,例如高膨体丙烯酸-或聚酯纱而得以改进。早期所用的织物已广泛地被缝编织物代替,其中后一种材料是无纺布和纺织纤维的混纺制品。这种新型纺织品尽管是松散结构但很软,这就对涂敷方法和热熔粘合剂化合物有较高要求,尤其是热熔粘合剂化合物的回击和渗透(Rueckschlag und durchschlag)。
由于成本和质量的原因,用于每平米夹层材料的涂敷物的量明显减少,而从前的常用量为15~20g/m2现在为7~12g/m2。
尽管这么小的用量但必须保证足够的粘合力和牢度,即热熔粘合剂不能渗入夹层,否则将不再起真正的粘合作用。
发明内容
因此,本发明的目的是找到一种很有效的回击屏障,其在涂敷用量减少的情况下具有高的粘结强度,良好的结合于基底层上点上,并且具有高的洗涤和干洗稳定性及杀菌能力。另一个优点是获得高热稳定性。
根据现有技术状况,一系列回击屏障是已知的,如交联丙烯酸酯-或聚氨酯分散体或基于高熔点的共聚多酰胺和聚乙烯或高黏度热塑性聚氨酯粉末的填粉糊。
所有这些体系在用于粗糙、多毛的夹层和在其结合到上点时或者其洗涤稳定性方面或多或少都有大的缺点。
在涂敷自交联的丙烯酸酯-或聚氨酯分散时常遇到在涂敷过程中就部分交联,这将导致在模板上成膜并由此堵塞模板孔,需要对设备进行彻底清洗。此外,当遇到与产品有关的停车时,会产生很大困难和干扰,甚至模板报废。当涂这种材料时,上点结合到基底层也有问题。基于聚酰胺、聚乙烯和聚氨酯的高粘度填粉体系大多不能满足所需要的回击可靠性。
至今还没有成功制成用于这种基点的稳定的可交联体系。优选使用的异氰酸酯类对水(涂敷糊的基质)不稳定或交联的活化温度太高(高于150℃)。
对于活化温度可以较高(高于150℃)的特殊应用,例如,衬衫领子定型,也可应用内衬,聚异氰酸酯,如二聚聚异氰酸酯。这种聚异氰酸酯和胺端基的共聚多酰胺或共聚多酯的粉末混合物也可用其它应用技术加工,如粉末分散或粉末点。根据现有技术状况熔点为110~120℃的聚乙烯或熔程为130~160℃的较高熔点的聚酰胺可用于衬衫领子定型。
异氰酸酯必须对水或对潮气扩散稳定以保证其在较低温度下的可活化性。
本发明的目的是找到一种很有效的回击屏障,其在涂敷用量减少的情况下具有高的粘结强度,良好的结合于基底层上点上,甚至是粗糙的基底上,并且具有高的洗涤和干洗稳定性及杀菌能力。另一个目的是达到热熔粘合涂层的较高热稳定性和使分散体容易加工以及避免堵塞模板。此外,本发明的目的是明显改善异氰酸酯对潮气的敏感性。
如权利要求书中所提到的,这一任务通过将带有多于2个游离NCO基团、熔程为110~130℃的异氰酸酯,例如三聚聚异氰酸酯产品,加入到微囊包封的糊状制剂中而完成。
能形成在与水接触或在潮湿蒸气气氛中稳定并且水不能透过的胶囊的硅烷化的聚丁二烯适合用作胶囊材料。众所周知,硅烷化的聚丁二烯类可用于制备微胶囊,但令人吃惊的是其与异氰酸酯类和胺联合的可用性。原认为异氰酸酯或胺与硅烷相互反应,以致在制备热熔粘合剂时要将异氰酸酯去活化或者破坏掉,并不再适合用作需要的热熔粘合剂。原来也认为,异氰酸酯与就地交联或形成硅烷化的聚丁二烯胶囊结构所需要的潮湿介质,由于对异氰酸酯的快速水解有破坏作用。
按照本发明的溶液,令人吃惊的是,异氰酸酯类对硅烷的反应很慢并可形成微胶囊。此外,微胶囊包封显然很快进行,这使异氰酸酯水解完全受阻并阻止了能破坏异氰酸酯的潮气进入微胶囊。
微胶囊包封的异氰酸酯类是通过异氰酸酯组分与硅烷化的聚丁二烯混合制得的。混合温度取决于组份的熔点,一般为100~150℃。所加交联组分与硅烷化的聚丁二烯的比例为4∶2~4∶1,优选4∶1。该聚丁二烯中硅含量应为2~10%(重量)、摩尔质量为1500~2500g/mol、粘度为1000~3000mPas且固含量大于60%。混合过程在高剪切下进行。还应该向混合物中加入约0.5~1.5%的市售表面活性剂(例如Intrasol)、0.05~0.1%的催化性酸(例如,甲苯磺酸)和1.5~5%的增稠剂(例如,丙烯酸酯增稠剂)以及若需要,其它的辅料。
用于涂层和/或层压所形成的表面的按发明的可交联热熔粘合剂化合物的特征在于在热熔粘合剂化合物中存在的反应性组分首先在熔体中经交联才反应。交联组分以微囊包封的聚异氰酸酯分散体的形式加到涂层糊中。在此优选的初始状态中,将通过微囊包封使之对水不敏感的带三聚二异氰酸酯的氨端基的市售共聚多酰胺加到糊中,然后将要加工的材料经旋转筛印刷涂敷。也可以用共聚多酯代替共聚多酰胺。在随后于烘箱内的干燥中,在约120℃下几秒钟内完成交联,以得到用于双点的交联回击屏障。由此,包含异氰酸酯的体系的一般问题可以绕过,例如其中包含的包封异氰酸酯类(己内酰胺或肟作为包封剂)需要太高的活化温度。在固化过程中无低沸可燃性溶剂释放也是有利的,因为使用的是水性悬浮体。
具体实施方式
实施例1:
160g 70%的三聚IPDI的聚异氰酸酯溶液与40g摩尔质量为1500~2500、粘度为1000~3000mPas且固含量>60%的硅烷化聚丁二烯相互混合形成一均匀、透明的混合物。借助于能产生高剪切力的搅拌器(Ultra Thurrax),在高剪切搅拌下将这一混合物慢慢加到包含500g水、10g Intrasol、0.5g对甲苯磺酸、1g消泡剂和30g市售水性增稠剂的水性溶液中。在水解条件下,这种能形成胶囊的材料立即通过形成防水的壳包封聚异氰酸酯,并在应用时通过压力或加热而破坏或者释放。
用这种方法制得的悬浮体或印刷糊具有以下特殊优点:
作为所述的双点的基点(回击屏障)印刷的糊在附属的热气通道内干燥期间交联并与分散的胺端基的共聚多酰胺(上点)熔融。因此结合特别牢固,因为上点中的胺端基在和基点的界面上可与交联成分反应,由此形成从交联的基底层到热塑性上点的流动过渡以保证真正的粘合。
为了使上点能够很牢固的结合到基点上,建议使用胺调节的共聚多酰胺作为上点材料。适合于用作基点和上点的产品是低粘度和低熔点型产品。熔点应为90~150℃,优选115~130℃,溶液粘度为1.2~1.7mPas,优选1.25~1.4mPas。通过接界层与异氰酸酯糊的反应使两点形成稳定的结合。用于基点的涂敷量应为2~5g/m2,优选2.5~4g/m2,用于上点的量按用途为4~8g/m2,特别是5~7g/m2。糊状基点可以涂成网状。
内衬的聚异氰酸酯(例如,二聚聚异氰酸酯)也可不用包封到糊中,因为它是耐水的。但这种体系的应用限制在150℃以上温度范围,例如用于衬衫领子,因为所用纺织品大多为棉织品,能经受高温。一种糊剂配方,VESTAMELT X 1316-P1(Degussa Huels)适合用作热熔粘合剂。
实施例2:
将Degussa Huels AG(VESTAMELT X 1027-P1)的氨基终端化的共聚多酰胺和一种按上述方法制备的包封聚异氰酸酯分散体与市售分散剂和增稠剂,例如,Stockhausen公司的Intrasol 12/18/5和Mirox TX,如在DE-B 20 07 971,DE-B 22 29 308,DE-B24 07 505和DE-B25 07 504中所描述,加工成一种可印刷的糊并用旋转筛印刷设备用CP66模板印刷在35g高膨松纱的聚酯纤维上。涂层为2g/m2。将VESTAMELT X 1027-P816分散在未干的糊点上,吸去剩余物,于130℃的干燥箱中干燥并熔结。上点涂层为5g/m2,因此总量为7g/m2。
基点的糊剂配方:
1500g 水
35g Mirox TX(聚丙烯酸衍生物)
40g Intrasol 12/18/5(乙氧基化的脂肪醇)
200g源于实施例1的聚异氰酸酯分散体(约5%的三聚IPDI)
600g VESTAMELT X 1027-P1
Degussa-Huels AG的胺端化VESTAMELT X 1027-P816作为分散材料被分散。
结果:
在127℃的接合温度下、10秒钟和4N的均匀压力下,将5cm宽的夹层条固定到由棉/聚酯混合物制成的硅烷化的上衣材料上,然后使所得复合材料在60℃下洗涤。
初始粘合力:16N/5cm
60℃下洗涤后:14N/5cm
背面铆接:0.1N/10cm
关于实施例II:与现有技术状况比较
将基于共聚多酰胺聚乙烯的糊状体系用于同样的夹层基质上,并用相同的上点材料分散,干燥和粘结。用于基点和上点的量相同。糊剂配方:
1500g 水
35g Mirox TX
40g Intrasol 12/18/5
400g Schaettifix 1820(ND-聚乙烯)
200g VESTAMELT 751-PI
Schaettfix 1820为低压聚乙烯,熔点为128~130℃,MFR值为20g/10min。
结果:
初始粘合力:9N/5cm
60℃下洗涤后:5N/5cm
背面铆接:0.9N/10cm
本发明方法的优点是在干燥条件下下点已经交联,并在熔融过程中上点由于其与下点的端基作用而交联,由此达到最佳粘合。由于涂敷后下点的分子量大大增加,它将不能渗入织物中。在随后的固定化过程中,上点低粘度的聚酰胺被强迫流到要固定的上点材料上,由于它不能向下流,因此用最少量的热熔粘合剂就能达到很强的粘合。上点和基点之间的、至此还为体系的弱点的分离层,尤其时在洗涤过程中,不会象在此前已知的体系中受到如此强的水解性侵蚀,因此表现出较高的稳定性。
所用产品:
VESTAMELT X 1027-P1是Degussa-Huels AG的一种基于LL、CL和DDS/MPD的具有氨基端基的三元共聚多酰胺,熔点120℃,氨基端基100~400mVal/kg,优选250~350mVal/kg。
三聚异氰酸酯是带3~4个官能团的聚异氰酸酯,熔点为100~115℃,这是Degussa-Huels AG的产品。
实施例3:
1500g 水
35g Mirox TX
40g Intrasol 12/18/5
400g VESTAMELT X 1316-P1
200g VESTAMELT X 1310-P1
结果:
在155℃的接合温度下、16秒且衬衫压床的均匀压力为4kg/m2的条件下,将带CP66网目和16g/m2涂层的5cm宽的夹层条(75g/m2棉)固定于由棉-聚酯混合物制成的硅烷化外衣材料上,然后使所得复合材料在60℃下洗涤。
粘合力:21N/5cm
60℃下洗涤后:19N/5cm
试验3a:与现有技术状况比较
与试验3一样,将市售的16g/m2的涂层按下述配方应用到相同的夹层上:
1500g 水
35g Mirox TX
40g Intrasol 12/18/5
600g VESTAMELT 250-P1
在相同的固定条件下得到下列粘合:
初始粘合力:16N/5cm
60℃下洗涤后:10N/5cm
结果:
通过交联(分子量升高)水解稳定性大大提高,这从水洗稳定性可清楚看出。在固定过程中通过分子量的逐步增加,回击倾向明显降低,因此有效提高了粘合力。
Claims (10)
1.一种用于涂敷和/或层压所形成的表面的可交联热熔粘合剂化合物的制备方法,其特征是,将交联组分微囊包封于硅烷化的聚丁二烯中,其中所述的硅烷化的聚丁二烯的硅含量为2~10wt%,摩尔质量为1500~2500g/mol以及粘度为1000~3000mPas,并且反应性组分首先在熔体中经交联来引发反应。
2.按照权利要求1的制备方法,其特征是,将交联组分用硅烷化的聚丁二烯按4∶1重量%的比例微囊包封。
3.按照前面任一权利要求的制备方法,其特征是,交联组分源于异氰酸酯并且每个分子中含有多于2个反应基团。
4.按照权利要求1或2的制备方法,其特征是,异氰酸酯的熔点为110~130℃。
5.按照权利要求1或2的制备方法,其特征是,将作为交联组分的异氰酸酯用硅烷化的聚丁二烯微囊包封并与第二种组分反应,该第二组分是共聚多酰胺或共聚多酯。
6.按照权利要求1或2的制备方法,其特征是,第二种组分是熔点为90~150℃、溶液粘度eta rel为1.2~1.7的胺调节的共聚多酰胺。
7.按照权利要求1或2的制备方法,其特征是,第二种组分是基于对苯二甲酸、间苯二甲酸和丁二醇或丁二醇与最高达12摩尔%的少量的其它二醇一起的、熔点为100~150℃的OH端化的共聚多酯。
8.按照权利要求1或2的制备方法,其特征是,微囊包封的聚异氰酸酯分散在水性糊中并通过旋转筛印刷到所形成的表面上。
9.按照权利要求1或2的制备方法,其特征是,将反应性混合物用作作为回击屏障的双点技术中的基点。
10.按照权利要求1或2的制备方法,其特征是,上点由胺调节的共聚多酰胺组成。
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US5264515A (en) * | 1989-04-10 | 1993-11-23 | Rheox, Inc. | Moisture curable compositions and method of curing moisture curable compositions |
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-
2000
- 2000-10-11 DE DE10050231A patent/DE10050231A1/de not_active Withdrawn
-
2001
- 2001-08-21 ES ES01120060T patent/ES2211707T3/es not_active Expired - Lifetime
- 2001-08-21 AT AT01120060T patent/ATE258582T1/de not_active IP Right Cessation
- 2001-08-21 EP EP01120060A patent/EP1197541B1/de not_active Expired - Lifetime
- 2001-08-21 TR TR2004/00214T patent/TR200400214T4/xx unknown
- 2001-08-21 DE DE50101386T patent/DE50101386D1/de not_active Expired - Fee Related
- 2001-09-28 JP JP2001303117A patent/JP2002201403A/ja active Pending
- 2001-10-04 MX MXPA01010030A patent/MXPA01010030A/es active IP Right Grant
- 2001-10-09 PL PL01350043A patent/PL350043A1/xx not_active Application Discontinuation
- 2001-10-09 TW TW090124934A patent/TW562830B/zh not_active IP Right Cessation
- 2001-10-09 MY MYPI20014690A patent/MY141570A/en unknown
- 2001-10-09 CA CA002358375A patent/CA2358375A1/en not_active Abandoned
- 2001-10-10 CN CNB01135402XA patent/CN1185319C/zh not_active Expired - Fee Related
- 2001-10-11 CZ CZ20013669A patent/CZ20013669A3/cs unknown
- 2001-10-11 US US09/973,890 patent/US6784227B2/en not_active Expired - Fee Related
- 2001-10-11 KR KR1020010062681A patent/KR20020034864A/ko not_active Application Discontinuation
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2002
- 2002-10-16 HK HK02107501.5A patent/HK1046294B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE10050231A1 (de) | 2002-04-25 |
HK1046294B (zh) | 2005-08-26 |
TR200400214T4 (tr) | 2004-03-22 |
TW562830B (en) | 2003-11-21 |
CZ20013669A3 (cs) | 2002-05-15 |
KR20020034864A (ko) | 2002-05-09 |
MY141570A (en) | 2010-05-14 |
CA2358375A1 (en) | 2002-04-11 |
EP1197541B1 (de) | 2004-01-28 |
PL350043A1 (en) | 2002-04-22 |
US20020042455A1 (en) | 2002-04-11 |
HK1046294A1 (en) | 2003-01-03 |
ES2211707T3 (es) | 2004-07-16 |
MXPA01010030A (es) | 2003-08-20 |
CN1346862A (zh) | 2002-05-01 |
EP1197541A1 (de) | 2002-04-17 |
ATE258582T1 (de) | 2004-02-15 |
JP2002201403A (ja) | 2002-07-19 |
US6784227B2 (en) | 2004-08-31 |
DE50101386D1 (de) | 2004-03-04 |
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