CN118414447A - 钛合金箔和显示面板和显示面板的制造方法 - Google Patents

钛合金箔和显示面板和显示面板的制造方法 Download PDF

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Publication number
CN118414447A
CN118414447A CN202280083666.0A CN202280083666A CN118414447A CN 118414447 A CN118414447 A CN 118414447A CN 202280083666 A CN202280083666 A CN 202280083666A CN 118414447 A CN118414447 A CN 118414447A
Authority
CN
China
Prior art keywords
titanium alloy
alloy foil
bending
foil
display panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280083666.0A
Other languages
English (en)
Chinese (zh)
Inventor
近藤成美
木村圭一
高桥一浩
平贺拓也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel and Sumikin Chemical Co Ltd
Nippon Steel and Sumitomo Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel and Sumikin Chemical Co Ltd, Nippon Steel and Sumitomo Metal Corp filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Publication of CN118414447A publication Critical patent/CN118414447A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C14/00—Alloys based on titanium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
    • C22F1/18—High-melting or refractory metals or alloys based thereon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2200/00—Crystalline structure
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Metal Rolling (AREA)
CN202280083666.0A 2021-12-24 2022-12-22 钛合金箔和显示面板和显示面板的制造方法 Pending CN118414447A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-210993 2021-12-24
JP2021210993 2021-12-24
PCT/JP2022/047311 WO2023120631A1 (ja) 2021-12-24 2022-12-22 チタン合金箔及びディスプレーパネル、並びにディスプレーパネルの製造方法

Publications (1)

Publication Number Publication Date
CN118414447A true CN118414447A (zh) 2024-07-30

Family

ID=86902723

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280083666.0A Pending CN118414447A (zh) 2021-12-24 2022-12-22 钛合金箔和显示面板和显示面板的制造方法

Country Status (5)

Country Link
US (1) US20250143139A1 (https=)
JP (1) JP7447362B2 (https=)
KR (1) KR20240113520A (https=)
CN (1) CN118414447A (https=)
WO (1) WO2023120631A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6274062A (ja) * 1985-09-27 1987-04-04 Mitsubishi Metal Corp Ｔｉ合金箔材の製造法
US20040221929A1 (en) 2003-05-09 2004-11-11 Hebda John J. Processing of titanium-aluminum-vanadium alloys and products made thereby
JP4316558B2 (ja) 2005-06-28 2009-08-19 三星モバイルディスプレイ株式會社 有機発光表示装置
CN102026743B (zh) 2008-05-16 2015-02-11 新日铁住金高新材料株式会社 柔性显示器用不锈钢箔
US9588549B2 (en) 2014-02-28 2017-03-07 Semiconductor Energy Laboratory Co., Ltd. Electronic device
CN109371284B (zh) 2018-12-17 2020-11-03 河南师范大学 一种高性能立方织构金属基带及其制备方法
CN113578967B (zh) 2021-06-27 2022-05-31 中国科学院金属研究所 一种550℃～650℃高温钛合金箔材的制备方法

Also Published As

Publication number Publication date
WO2023120631A1 (ja) 2023-06-29
JPWO2023120631A1 (https=) 2023-06-29
KR20240113520A (ko) 2024-07-22
JP7447362B2 (ja) 2024-03-11
US20250143139A1 (en) 2025-05-01

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