JPWO2023120631A1 - - Google Patents
Info
- Publication number
- JPWO2023120631A1 JPWO2023120631A1 JP2023538684A JP2023538684A JPWO2023120631A1 JP WO2023120631 A1 JPWO2023120631 A1 JP WO2023120631A1 JP 2023538684 A JP2023538684 A JP 2023538684A JP 2023538684 A JP2023538684 A JP 2023538684A JP WO2023120631 A1 JPWO2023120631 A1 JP WO2023120631A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C14/00—Alloys based on titanium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
- C22F1/18—High-melting or refractory metals or alloys based thereon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2200/00—Crystalline structure
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Metal Rolling (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021210993 | 2021-12-24 | ||
| JP2021210993 | 2021-12-24 | ||
| PCT/JP2022/047311 WO2023120631A1 (ja) | 2021-12-24 | 2022-12-22 | チタン合金箔及びディスプレーパネル、並びにディスプレーパネルの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023120631A1 true JPWO2023120631A1 (https=) | 2023-06-29 |
| JP7447362B2 JP7447362B2 (ja) | 2024-03-11 |
Family
ID=86902723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023538684A Active JP7447362B2 (ja) | 2021-12-24 | 2022-12-22 | チタン合金箔及びディスプレーパネル、並びにディスプレーパネルの製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250143139A1 (https=) |
| JP (1) | JP7447362B2 (https=) |
| KR (1) | KR20240113520A (https=) |
| CN (1) | CN118414447A (https=) |
| WO (1) | WO2023120631A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6274062A (ja) * | 1985-09-27 | 1987-04-04 | Mitsubishi Metal Corp | Ｔｉ合金箔材の製造法 |
| JP2007501903A (ja) * | 2003-05-09 | 2007-02-01 | エイティーアイ・プロパティーズ・インコーポレーテッド | チタン−アルミニウム−バナジウム合金の加工及びそれによって製造した製品 |
| CN109371284A (zh) * | 2018-12-17 | 2019-02-22 | 河南师范大学 | 一种高性能立方织构金属基带及其制备方法 |
| CN113578967A (zh) * | 2021-06-27 | 2021-11-02 | 中国科学院金属研究所 | 一种550℃~650℃高温钛合金箔材的制备方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4316558B2 (ja) | 2005-06-28 | 2009-08-19 | 三星モバイルディスプレイ株式會社 | 有機発光表示装置 |
| CN102026743B (zh) | 2008-05-16 | 2015-02-11 | 新日铁住金高新材料株式会社 | 柔性显示器用不锈钢箔 |
| US9588549B2 (en) | 2014-02-28 | 2017-03-07 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device |
-
2022
- 2022-12-22 US US18/722,658 patent/US20250143139A1/en active Pending
- 2022-12-22 CN CN202280083666.0A patent/CN118414447A/zh active Pending
- 2022-12-22 WO PCT/JP2022/047311 patent/WO2023120631A1/ja not_active Ceased
- 2022-12-22 JP JP2023538684A patent/JP7447362B2/ja active Active
- 2022-12-22 KR KR1020247020415A patent/KR20240113520A/ko active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6274062A (ja) * | 1985-09-27 | 1987-04-04 | Mitsubishi Metal Corp | Ｔｉ合金箔材の製造法 |
| JP2007501903A (ja) * | 2003-05-09 | 2007-02-01 | エイティーアイ・プロパティーズ・インコーポレーテッド | チタン−アルミニウム−バナジウム合金の加工及びそれによって製造した製品 |
| CN109371284A (zh) * | 2018-12-17 | 2019-02-22 | 河南师范大学 | 一种高性能立方织构金属基带及其制备方法 |
| CN113578967A (zh) * | 2021-06-27 | 2021-11-02 | 中国科学院金属研究所 | 一种550℃~650℃高温钛合金箔材的制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023120631A1 (ja) | 2023-06-29 |
| KR20240113520A (ko) | 2024-07-22 |
| JP7447362B2 (ja) | 2024-03-11 |
| CN118414447A (zh) | 2024-07-30 |
| US20250143139A1 (en) | 2025-05-01 |
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