KR20240113520A - 티타늄 합금박 및 디스플레이 패널, 그리고 디스플레이 패널의 제조 방법 - Google Patents

티타늄 합금박 및 디스플레이 패널, 그리고 디스플레이 패널의 제조 방법 Download PDF

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Publication number
KR20240113520A
KR20240113520A KR1020247020415A KR20247020415A KR20240113520A KR 20240113520 A KR20240113520 A KR 20240113520A KR 1020247020415 A KR1020247020415 A KR 1020247020415A KR 20247020415 A KR20247020415 A KR 20247020415A KR 20240113520 A KR20240113520 A KR 20240113520A
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KR
South Korea
Prior art keywords
titanium alloy
alloy foil
bending
foil
display panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247020415A
Other languages
English (en)
Korean (ko)
Inventor
나루미 곤도
게이이치 기무라
가즈히로 다카하시
다쿠야 히라가
Original Assignee
닛폰세이테츠 가부시키가이샤
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛폰세이테츠 가부시키가이샤, 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 filed Critical 닛폰세이테츠 가부시키가이샤
Publication of KR20240113520A publication Critical patent/KR20240113520A/ko
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C14/00—Alloys based on titanium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
    • C22F1/18—High-melting or refractory metals or alloys based thereon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2200/00—Crystalline structure
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Metal Rolling (AREA)
KR1020247020415A 2021-12-24 2022-12-22 티타늄 합금박 및 디스플레이 패널, 그리고 디스플레이 패널의 제조 방법 Pending KR20240113520A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-210993 2021-12-24
JP2021210993 2021-12-24
PCT/JP2022/047311 WO2023120631A1 (ja) 2021-12-24 2022-12-22 チタン合金箔及びディスプレーパネル、並びにディスプレーパネルの製造方法

Publications (1)

Publication Number Publication Date
KR20240113520A true KR20240113520A (ko) 2024-07-22

Family

ID=86902723

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247020415A Pending KR20240113520A (ko) 2021-12-24 2022-12-22 티타늄 합금박 및 디스플레이 패널, 그리고 디스플레이 패널의 제조 방법

Country Status (5)

Country Link
US (1) US20250143139A1 (https=)
JP (1) JP7447362B2 (https=)
KR (1) KR20240113520A (https=)
CN (1) CN118414447A (https=)
WO (1) WO2023120631A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007011256A (ja) 2005-06-28 2007-01-18 Samsung Sdi Co Ltd 平板表示装置及びその駆動方法
WO2009139495A1 (ja) 2008-05-16 2009-11-19 新日鉄マテリアルズ株式会社 フレキシブルディスプレイ用ステンレス箔
JP2016075884A (ja) 2014-02-28 2016-05-12 株式会社半導体エネルギー研究所 電子機器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6274062A (ja) * 1985-09-27 1987-04-04 Mitsubishi Metal Corp Ｔｉ合金箔材の製造法
US20040221929A1 (en) 2003-05-09 2004-11-11 Hebda John J. Processing of titanium-aluminum-vanadium alloys and products made thereby
CN109371284B (zh) 2018-12-17 2020-11-03 河南师范大学 一种高性能立方织构金属基带及其制备方法
CN113578967B (zh) 2021-06-27 2022-05-31 中国科学院金属研究所 一种550℃～650℃高温钛合金箔材的制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007011256A (ja) 2005-06-28 2007-01-18 Samsung Sdi Co Ltd 平板表示装置及びその駆動方法
WO2009139495A1 (ja) 2008-05-16 2009-11-19 新日鉄マテリアルズ株式会社 フレキシブルディスプレイ用ステンレス箔
JP2016075884A (ja) 2014-02-28 2016-05-12 株式会社半導体エネルギー研究所 電子機器

Also Published As

Publication number Publication date
WO2023120631A1 (ja) 2023-06-29
JPWO2023120631A1 (https=) 2023-06-29
JP7447362B2 (ja) 2024-03-11
CN118414447A (zh) 2024-07-30
US20250143139A1 (en) 2025-05-01

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Date Code Title Description
PA0105 International application

Patent event date: 20240619

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination
PG1501 Laying open of application