CN118303139A - 布线基板、电子装置、以及电子模块 - Google Patents

布线基板、电子装置、以及电子模块 Download PDF

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Publication number
CN118303139A
CN118303139A CN202280078518.XA CN202280078518A CN118303139A CN 118303139 A CN118303139 A CN 118303139A CN 202280078518 A CN202280078518 A CN 202280078518A CN 118303139 A CN118303139 A CN 118303139A
Authority
CN
China
Prior art keywords
conductor
line
via conductor
line conductor
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280078518.XA
Other languages
English (en)
Chinese (zh)
Inventor
泽晋一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN118303139A publication Critical patent/CN118303139A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202280078518.XA 2021-11-30 2022-11-29 布线基板、电子装置、以及电子模块 Pending CN118303139A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021193727 2021-11-30
JP2021-193727 2021-11-30
PCT/JP2022/043914 WO2023100853A1 (ja) 2021-11-30 2022-11-29 配線基板、電子装置及び電子モジュール

Publications (1)

Publication Number Publication Date
CN118303139A true CN118303139A (zh) 2024-07-05

Family

ID=86612364

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280078518.XA Pending CN118303139A (zh) 2021-11-30 2022-11-29 布线基板、电子装置、以及电子模块

Country Status (4)

Country Link
JP (1) JP7770421B2 (https=)
KR (1) KR20240093974A (https=)
CN (1) CN118303139A (https=)
WO (1) WO2023100853A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2755906Y (zh) * 2004-12-06 2006-02-01 威盛电子股份有限公司 讯号传输结构
JP2010161093A (ja) * 2009-01-06 2010-07-22 Sumitomo Metal Electronics Devices Inc セラミックパッケージ
JP2011066223A (ja) * 2009-09-17 2011-03-31 Kawasaki Microelectronics Inc 回路基板
JP5565958B2 (ja) * 2010-10-30 2014-08-06 京セラＳｌｃテクノロジー株式会社 配線基板
JP5586441B2 (ja) * 2010-11-30 2014-09-10 京セラＳｌｃテクノロジー株式会社 配線基板
JP5887537B2 (ja) * 2011-04-25 2016-03-16 パナソニックＩｐマネジメント株式会社 回路基板
JP5897820B2 (ja) * 2011-05-31 2016-03-30 京セラ株式会社 配線基板
WO2016075730A1 (ja) * 2014-11-10 2016-05-19 株式会社日立製作所 高速信号伝送向け基板の構造

Also Published As

Publication number Publication date
KR20240093974A (ko) 2024-06-24
JP7770421B2 (ja) 2025-11-14
WO2023100853A1 (ja) 2023-06-08
JPWO2023100853A1 (https=) 2023-06-08

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