JPWO2023100853A5 - - Google Patents

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Publication number
JPWO2023100853A5
JPWO2023100853A5 JP2023564995A JP2023564995A JPWO2023100853A5 JP WO2023100853 A5 JPWO2023100853 A5 JP WO2023100853A5 JP 2023564995 A JP2023564995 A JP 2023564995A JP 2023564995 A JP2023564995 A JP 2023564995A JP WO2023100853 A5 JPWO2023100853 A5 JP WO2023100853A5
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JP
Japan
Prior art keywords
conductor
line
via conductor
line conductor
opening
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Application number
JP2023564995A
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English (en)
Japanese (ja)
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JP7770421B2 (ja
JPWO2023100853A1 (https=
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Priority claimed from PCT/JP2022/043914 external-priority patent/WO2023100853A1/ja
Publication of JPWO2023100853A1 publication Critical patent/JPWO2023100853A1/ja
Publication of JPWO2023100853A5 publication Critical patent/JPWO2023100853A5/ja
Application granted granted Critical
Publication of JP7770421B2 publication Critical patent/JP7770421B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023564995A 2021-11-30 2022-11-29 配線基板、電子装置及び電子モジュール Active JP7770421B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021193727 2021-11-30
JP2021193727 2021-11-30
PCT/JP2022/043914 WO2023100853A1 (ja) 2021-11-30 2022-11-29 配線基板、電子装置及び電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2023100853A1 JPWO2023100853A1 (https=) 2023-06-08
JPWO2023100853A5 true JPWO2023100853A5 (https=) 2024-08-14
JP7770421B2 JP7770421B2 (ja) 2025-11-14

Family

ID=86612364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023564995A Active JP7770421B2 (ja) 2021-11-30 2022-11-29 配線基板、電子装置及び電子モジュール

Country Status (4)

Country Link
JP (1) JP7770421B2 (https=)
KR (1) KR20240093974A (https=)
CN (1) CN118303139A (https=)
WO (1) WO2023100853A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2755906Y (zh) * 2004-12-06 2006-02-01 威盛电子股份有限公司 讯号传输结构
JP2010161093A (ja) * 2009-01-06 2010-07-22 Sumitomo Metal Electronics Devices Inc セラミックパッケージ
JP2011066223A (ja) * 2009-09-17 2011-03-31 Kawasaki Microelectronics Inc 回路基板
JP5565958B2 (ja) * 2010-10-30 2014-08-06 京セラＳｌｃテクノロジー株式会社 配線基板
JP5586441B2 (ja) * 2010-11-30 2014-09-10 京セラＳｌｃテクノロジー株式会社 配線基板
JP5887537B2 (ja) * 2011-04-25 2016-03-16 パナソニックＩｐマネジメント株式会社 回路基板
JP5897820B2 (ja) * 2011-05-31 2016-03-30 京セラ株式会社 配線基板
WO2016075730A1 (ja) * 2014-11-10 2016-05-19 株式会社日立製作所 高速信号伝送向け基板の構造

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