JPWO2023100853A1 - - Google Patents

Info

Publication number
JPWO2023100853A1
JPWO2023100853A1 JP2023564995A JP2023564995A JPWO2023100853A1 JP WO2023100853 A1 JPWO2023100853 A1 JP WO2023100853A1 JP 2023564995 A JP2023564995 A JP 2023564995A JP 2023564995 A JP2023564995 A JP 2023564995A JP WO2023100853 A1 JPWO2023100853 A1 JP WO2023100853A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023564995A
Other languages
Japanese (ja)
Other versions
JP7770421B2 (ja
JPWO2023100853A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023100853A1 publication Critical patent/JPWO2023100853A1/ja
Publication of JPWO2023100853A5 publication Critical patent/JPWO2023100853A5/ja
Application granted granted Critical
Publication of JP7770421B2 publication Critical patent/JP7770421B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023564995A 2021-11-30 2022-11-29 配線基板、電子装置及び電子モジュール Active JP7770421B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021193727 2021-11-30
JP2021193727 2021-11-30
PCT/JP2022/043914 WO2023100853A1 (ja) 2021-11-30 2022-11-29 配線基板、電子装置及び電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2023100853A1 true JPWO2023100853A1 (https=) 2023-06-08
JPWO2023100853A5 JPWO2023100853A5 (https=) 2024-08-14
JP7770421B2 JP7770421B2 (ja) 2025-11-14

Family

ID=86612364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023564995A Active JP7770421B2 (ja) 2021-11-30 2022-11-29 配線基板、電子装置及び電子モジュール

Country Status (4)

Country Link
JP (1) JP7770421B2 (https=)
KR (1) KR20240093974A (https=)
CN (1) CN118303139A (https=)
WO (1) WO2023100853A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2755906Y (zh) * 2004-12-06 2006-02-01 威盛电子股份有限公司 讯号传输结构
JP2010161093A (ja) * 2009-01-06 2010-07-22 Sumitomo Metal Electronics Devices Inc セラミックパッケージ
JP2011066223A (ja) * 2009-09-17 2011-03-31 Kawasaki Microelectronics Inc 回路基板
JP2012099587A (ja) * 2010-10-30 2012-05-24 Kyocer Slc Technologies Corp 配線基板
JP2012119473A (ja) * 2010-11-30 2012-06-21 Kyocer Slc Technologies Corp 配線基板
JP2012238848A (ja) * 2011-04-25 2012-12-06 Panasonic Corp 回路基板
JP2012248797A (ja) * 2011-05-31 2012-12-13 Kyocera Corp 配線基板
WO2016075730A1 (ja) * 2014-11-10 2016-05-19 株式会社日立製作所 高速信号伝送向け基板の構造

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2755906Y (zh) * 2004-12-06 2006-02-01 威盛电子股份有限公司 讯号传输结构
JP2010161093A (ja) * 2009-01-06 2010-07-22 Sumitomo Metal Electronics Devices Inc セラミックパッケージ
JP2011066223A (ja) * 2009-09-17 2011-03-31 Kawasaki Microelectronics Inc 回路基板
JP2012099587A (ja) * 2010-10-30 2012-05-24 Kyocer Slc Technologies Corp 配線基板
JP2012119473A (ja) * 2010-11-30 2012-06-21 Kyocer Slc Technologies Corp 配線基板
JP2012238848A (ja) * 2011-04-25 2012-12-06 Panasonic Corp 回路基板
JP2012248797A (ja) * 2011-05-31 2012-12-13 Kyocera Corp 配線基板
WO2016075730A1 (ja) * 2014-11-10 2016-05-19 株式会社日立製作所 高速信号伝送向け基板の構造

Also Published As

Publication number Publication date
CN118303139A (zh) 2024-07-05
KR20240093974A (ko) 2024-06-24
JP7770421B2 (ja) 2025-11-14
WO2023100853A1 (ja) 2023-06-08

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