JP7770421B2 - 配線基板、電子装置及び電子モジュール - Google Patents

配線基板、電子装置及び電子モジュール

Info

Publication number
JP7770421B2
JP7770421B2 JP2023564995A JP2023564995A JP7770421B2 JP 7770421 B2 JP7770421 B2 JP 7770421B2 JP 2023564995 A JP2023564995 A JP 2023564995A JP 2023564995 A JP2023564995 A JP 2023564995A JP 7770421 B2 JP7770421 B2 JP 7770421B2
Authority
JP
Japan
Prior art keywords
conductor
line
via conductor
line conductor
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023564995A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023100853A5 (https=
JPWO2023100853A1 (https=
Inventor
晋一郎 澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2023100853A1 publication Critical patent/JPWO2023100853A1/ja
Publication of JPWO2023100853A5 publication Critical patent/JPWO2023100853A5/ja
Application granted granted Critical
Publication of JP7770421B2 publication Critical patent/JP7770421B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023564995A 2021-11-30 2022-11-29 配線基板、電子装置及び電子モジュール Active JP7770421B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021193727 2021-11-30
JP2021193727 2021-11-30
PCT/JP2022/043914 WO2023100853A1 (ja) 2021-11-30 2022-11-29 配線基板、電子装置及び電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2023100853A1 JPWO2023100853A1 (https=) 2023-06-08
JPWO2023100853A5 JPWO2023100853A5 (https=) 2024-08-14
JP7770421B2 true JP7770421B2 (ja) 2025-11-14

Family

ID=86612364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023564995A Active JP7770421B2 (ja) 2021-11-30 2022-11-29 配線基板、電子装置及び電子モジュール

Country Status (4)

Country Link
JP (1) JP7770421B2 (https=)
KR (1) KR20240093974A (https=)
CN (1) CN118303139A (https=)
WO (1) WO2023100853A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2755906Y (zh) 2004-12-06 2006-02-01 威盛电子股份有限公司 讯号传输结构
JP2010161093A (ja) 2009-01-06 2010-07-22 Sumitomo Metal Electronics Devices Inc セラミックパッケージ
JP2011066223A (ja) 2009-09-17 2011-03-31 Kawasaki Microelectronics Inc 回路基板
JP2012099587A (ja) 2010-10-30 2012-05-24 Kyocer Slc Technologies Corp 配線基板
JP2012119473A (ja) 2010-11-30 2012-06-21 Kyocer Slc Technologies Corp 配線基板
JP2012238848A (ja) 2011-04-25 2012-12-06 Panasonic Corp 回路基板
JP2012248797A (ja) 2011-05-31 2012-12-13 Kyocera Corp 配線基板
WO2016075730A1 (ja) 2014-11-10 2016-05-19 株式会社日立製作所 高速信号伝送向け基板の構造

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2755906Y (zh) 2004-12-06 2006-02-01 威盛电子股份有限公司 讯号传输结构
JP2010161093A (ja) 2009-01-06 2010-07-22 Sumitomo Metal Electronics Devices Inc セラミックパッケージ
JP2011066223A (ja) 2009-09-17 2011-03-31 Kawasaki Microelectronics Inc 回路基板
JP2012099587A (ja) 2010-10-30 2012-05-24 Kyocer Slc Technologies Corp 配線基板
JP2012119473A (ja) 2010-11-30 2012-06-21 Kyocer Slc Technologies Corp 配線基板
JP2012238848A (ja) 2011-04-25 2012-12-06 Panasonic Corp 回路基板
JP2012248797A (ja) 2011-05-31 2012-12-13 Kyocera Corp 配線基板
WO2016075730A1 (ja) 2014-11-10 2016-05-19 株式会社日立製作所 高速信号伝送向け基板の構造

Also Published As

Publication number Publication date
CN118303139A (zh) 2024-07-05
KR20240093974A (ko) 2024-06-24
WO2023100853A1 (ja) 2023-06-08
JPWO2023100853A1 (https=) 2023-06-08

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