CN118265806A - 无铅易切削铍铜合金 - Google Patents
无铅易切削铍铜合金 Download PDFInfo
- Publication number
- CN118265806A CN118265806A CN202380013591.3A CN202380013591A CN118265806A CN 118265806 A CN118265806 A CN 118265806A CN 202380013591 A CN202380013591 A CN 202380013591A CN 118265806 A CN118265806 A CN 118265806A
- Authority
- CN
- China
- Prior art keywords
- copper alloy
- cutting
- beryllium copper
- free
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 132
- 238000005520 cutting process Methods 0.000 title claims abstract description 90
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 title claims abstract description 75
- 229910000765 intermetallic Inorganic materials 0.000 claims abstract description 46
- 239000002245 particle Substances 0.000 claims abstract description 46
- 239000010949 copper Substances 0.000 claims abstract description 11
- 239000012535 impurity Substances 0.000 claims abstract description 9
- 229910052790 beryllium Inorganic materials 0.000 claims description 12
- 238000001887 electron backscatter diffraction Methods 0.000 claims description 12
- 229910052742 iron Inorganic materials 0.000 claims description 11
- 238000010587 phase diagram Methods 0.000 claims description 8
- 238000012360 testing method Methods 0.000 claims description 8
- 238000010008 shearing Methods 0.000 claims description 7
- 238000002050 diffraction method Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 30
- 239000000523 sample Substances 0.000 description 27
- 238000001878 scanning electron micrograph Methods 0.000 description 24
- 238000010438 heat treatment Methods 0.000 description 18
- 238000005259 measurement Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 230000032683 aging Effects 0.000 description 8
- 238000000265 homogenisation Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 238000005482 strain hardening Methods 0.000 description 8
- 238000009826 distribution Methods 0.000 description 7
- 238000004453 electron probe microanalysis Methods 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 238000013507 mapping Methods 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 6
- 238000000921 elemental analysis Methods 0.000 description 5
- 229910001369 Brass Inorganic materials 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000005430 electron energy loss spectroscopy Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000000851 scanning transmission electron micrograph Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000000550 scanning electron microscopy energy dispersive X-ray spectroscopy Methods 0.000 description 3
- 125000003821 2-(trimethylsilyl)ethoxymethyl group Chemical group [H]C([H])([H])[Si](C([H])([H])[H])(C([H])([H])[H])C([H])([H])C(OC([H])([H])[*])([H])[H] 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 238000004626 scanning electron microscopy Methods 0.000 description 2
- 241000252073 Anguilliformes Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/10—Alloys based on copper with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022173377 | 2022-10-28 | ||
| JP2022-173377 | 2022-10-28 | ||
| PCT/JP2023/032138 WO2024090037A1 (ja) | 2022-10-28 | 2023-09-01 | 鉛フリー快削ベリリウム銅合金 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118265806A true CN118265806A (zh) | 2024-06-28 |
Family
ID=90830435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380013591.3A Pending CN118265806A (zh) | 2022-10-28 | 2023-09-01 | 无铅易切削铍铜合金 |
Country Status (7)
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118910463A (zh) * | 2024-10-10 | 2024-11-08 | 国工恒昌新材料(义乌)有限公司 | 一种vcm弹片用高导电率铍铜箔材及其制备方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63125648A (ja) * | 1986-11-13 | 1988-05-28 | Ngk Insulators Ltd | ベリリウム銅合金の製造法 |
| JPS63143247A (ja) * | 1986-12-06 | 1988-06-15 | Ngk Insulators Ltd | 鋳造方法 |
| JP3378430B2 (ja) * | 1996-03-28 | 2003-02-17 | 日本碍子株式会社 | 耐熱性および曲げ部の美観に優れる高強度ベリリウム銅合金 |
| JP3734372B2 (ja) | 1998-10-12 | 2006-01-11 | 三宝伸銅工業株式会社 | 無鉛快削性銅合金 |
| JP5135496B2 (ja) * | 2007-06-01 | 2013-02-06 | Ｄｏｗａメタルテック株式会社 | Ｃｕ−Ｂｅ系銅合金板材およびその製造法 |
| KR102623143B1 (ko) | 2019-06-25 | 2024-01-09 | 미쓰비시 마테리알 가부시키가이샤 | 쾌삭성 구리 합금 주물, 및 쾌삭성 구리 합금 주물의 제조 방법 |
| CN111057886B (zh) * | 2019-10-29 | 2021-06-22 | 宁夏中色新材料有限公司 | 一种铍铜铸轧辊套的制备方法和铍铜铸轧辊套 |
| JP2021155837A (ja) * | 2020-03-30 | 2021-10-07 | 日本碍子株式会社 | ベリリウム銅合金リング及びその製造方法 |
| CN113174509B (zh) * | 2021-03-15 | 2022-10-14 | 江阴金湾合金材料有限公司 | 一种高强度铍铜合金棒及其制备工艺 |
-
2023
- 2023-09-01 EP EP23866641.6A patent/EP4394064A1/en active Pending
- 2023-09-01 JP JP2024517370A patent/JPWO2024090037A1/ja active Pending
- 2023-09-01 WO PCT/JP2023/032138 patent/WO2024090037A1/ja active Application Filing
- 2023-09-01 CN CN202380013591.3A patent/CN118265806A/zh active Pending
- 2023-09-01 KR KR1020247009790A patent/KR20240063124A/ko active Pending
- 2023-09-12 TW TW112134633A patent/TWI866458B/zh active
-
2024
- 2024-03-19 US US18/609,350 patent/US20240263277A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240263277A1 (en) | 2024-08-08 |
| EP4394064A1 (en) | 2024-07-03 |
| WO2024090037A1 (ja) | 2024-05-02 |
| TWI866458B (zh) | 2024-12-11 |
| JPWO2024090037A1 (enrdf_load_stackoverflow) | 2024-05-02 |
| KR20240063124A (ko) | 2024-05-09 |
| TW202428897A (zh) | 2024-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101477884B1 (ko) | 전자 기기용 구리 합금, 전자 기기용 구리 합금의 제조 방법, 전자 기기용 구리 합금 압연재, 및 전자 기기용 구리 합금이나 전자 기기용 구리 합금 압연재로 이루어지는 전자 전기 부품, 단자 또는 커넥터 | |
| US10294547B2 (en) | Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment | |
| TWI381398B (zh) | Cu-Ni-Si alloy for electronic materials | |
| KR101027840B1 (ko) | 전기ㆍ전자기기용 동합금 판재 및 그 제조방법 | |
| KR101615830B1 (ko) | 전자 기기용 구리 합금, 전자 기기용 구리 합금의 제조 방법, 전자 기기용 구리 합금 소성 가공재 및 전자 기기용 부품 | |
| KR102437192B1 (ko) | 고강도·고도전성 구리 합금 판재 및 그 제조 방법 | |
| JP6140032B2 (ja) | 銅合金板材およびその製造方法並びに通電部品 | |
| JP5520533B2 (ja) | 銅合金材およびその製造方法 | |
| WO2017047368A1 (ja) | 銅合金板材およびその製造方法 | |
| WO2007138956A1 (ja) | 高強度、高導電率および曲げ加工性に優れた銅合金 | |
| EP2554691A1 (en) | Cu-ni-si alloy for electronic material | |
| CN111032892B (zh) | 铜合金线材和铜合金线材的制造方法 | |
| TWI866458B (zh) | 無鉛易切削鈹銅合金 | |
| TWI502084B (zh) | 電子．電氣機器用銅合金、電子．電氣機器用零件及端子 | |
| JP6175932B2 (ja) | 引抜銅線、引抜銅線の製造方法及びケーブル | |
| JPH10219374A (ja) | 剪断加工性に優れる高強度銅合金 | |
| JP2009203510A (ja) | 高強度および高導電率を兼備した銅合金 | |
| WO2020045401A1 (ja) | アルミニウム合金材ならびにこれを用いた編組シールド線、導電部材、電池用部材、締結部品、バネ用部品、構造用部品およびキャブタイヤケーブル | |
| EP2977476A1 (en) | Copper alloy for electrical and electronic equipment, copper alloy thin sheet for electrical and electronic equipment, and conductive component and terminal for electrical and electronic equipment | |
| JPH10130755A (ja) | 剪断加工性に優れる高強度、高導電性銅合金 | |
| CN110573635B (zh) | 铜合金板材及其制造方法 | |
| KR100861152B1 (ko) | 구리합금 | |
| EP4431624A1 (en) | Cu-ag alloy wire | |
| JP2009108392A (ja) | 曲げ加工性に優れる高強度洋白およびその製造方法 | |
| JP7126198B2 (ja) | 無鉛快削りん青銅棒線材 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |