CN118056476A - 印刷布线板用基板以及印刷布线板 - Google Patents

印刷布线板用基板以及印刷布线板 Download PDF

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Publication number
CN118056476A
CN118056476A CN202380013832.4A CN202380013832A CN118056476A CN 118056476 A CN118056476 A CN 118056476A CN 202380013832 A CN202380013832 A CN 202380013832A CN 118056476 A CN118056476 A CN 118056476A
Authority
CN
China
Prior art keywords
copper plating
main surface
plating layer
conductive layer
base film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380013832.4A
Other languages
English (en)
Chinese (zh)
Inventor
部谷拓斗
御影胜成
今北健太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of CN118056476A publication Critical patent/CN118056476A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN202380013832.4A 2022-03-29 2023-03-17 印刷布线板用基板以及印刷布线板 Pending CN118056476A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-053407 2022-03-29
JP2022053407 2022-03-29
PCT/JP2023/010643 WO2023189744A1 (ja) 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板

Publications (1)

Publication Number Publication Date
CN118056476A true CN118056476A (zh) 2024-05-17

Family

ID=88201024

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380013832.4A Pending CN118056476A (zh) 2022-03-29 2023-03-17 印刷布线板用基板以及印刷布线板

Country Status (4)

Country Link
US (1) US12604399B2 (https=)
JP (1) JP7666736B2 (https=)
CN (1) CN118056476A (https=)
WO (1) WO2023189744A1 (https=)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57177966A (en) 1981-04-24 1982-11-01 Fujitsu Ltd Plating method for printed wiring board
JPH03201592A (ja) * 1989-12-28 1991-09-03 Hitachi Chem Co Ltd プリント配線板の製造法
JP4137279B2 (ja) 1999-04-23 2008-08-20 イビデン株式会社 プリント配線板及びその製造方法
JP4032712B2 (ja) 2001-11-22 2008-01-16 日立化成工業株式会社 プリント配線板の製造方法
JP2004095972A (ja) * 2002-09-03 2004-03-25 Sumitomo Metal Electronics Devices Inc プラスチックパッケージの製造方法
US8119920B2 (en) * 2004-02-04 2012-02-21 Ibiden Co., Ltd. Multilayer printed wiring board
US7834273B2 (en) * 2005-07-07 2010-11-16 Ibiden Co., Ltd. Multilayer printed wiring board
KR101119308B1 (ko) * 2009-02-03 2012-03-19 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US8756804B2 (en) * 2010-09-29 2014-06-24 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing printed circuit board
JP6406598B2 (ja) * 2014-07-24 2018-10-17 学校法人福岡大学 プリント配線板及びその製造方法
JP6466110B2 (ja) * 2014-09-09 2019-02-06 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
JP6625872B2 (ja) * 2015-11-25 2019-12-25 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP6816486B2 (ja) * 2016-12-07 2021-01-20 凸版印刷株式会社 コア基板、多層配線基板、半導体パッケージ、半導体モジュール、銅張基板、及びコア基板の製造方法
WO2019208077A1 (ja) 2018-04-26 2019-10-31 住友電気工業株式会社 プリント配線板用基材及びプリント配線板用基材の製造方法
JP7063101B2 (ja) * 2018-05-11 2022-05-09 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法
WO2022075239A1 (ja) 2020-10-09 2022-04-14 住友電気工業株式会社 プリント回路用基材、プリント回路、及びプリント回路用基材の製造方法

Also Published As

Publication number Publication date
JP7666736B2 (ja) 2025-04-22
US20250024598A1 (en) 2025-01-16
US12604399B2 (en) 2026-04-14
JPWO2023189744A1 (https=) 2023-10-05
WO2023189744A1 (ja) 2023-10-05

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