JPWO2023189744A1 - - Google Patents

Info

Publication number
JPWO2023189744A1
JPWO2023189744A1 JP2024511830A JP2024511830A JPWO2023189744A1 JP WO2023189744 A1 JPWO2023189744 A1 JP WO2023189744A1 JP 2024511830 A JP2024511830 A JP 2024511830A JP 2024511830 A JP2024511830 A JP 2024511830A JP WO2023189744 A1 JPWO2023189744 A1 JP WO2023189744A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024511830A
Other languages
Japanese (ja)
Other versions
JP7666736B2 (ja
JPWO2023189744A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023189744A1 publication Critical patent/JPWO2023189744A1/ja
Publication of JPWO2023189744A5 publication Critical patent/JPWO2023189744A5/ja
Application granted granted Critical
Publication of JP7666736B2 publication Critical patent/JP7666736B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2024511830A 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板 Active JP7666736B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022053407 2022-03-29
JP2022053407 2022-03-29
PCT/JP2023/010643 WO2023189744A1 (ja) 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板

Publications (3)

Publication Number Publication Date
JPWO2023189744A1 true JPWO2023189744A1 (https=) 2023-10-05
JPWO2023189744A5 JPWO2023189744A5 (https=) 2024-06-04
JP7666736B2 JP7666736B2 (ja) 2025-04-22

Family

ID=88201024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511830A Active JP7666736B2 (ja) 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板

Country Status (4)

Country Link
US (1) US12604399B2 (https=)
JP (1) JP7666736B2 (https=)
CN (1) CN118056476A (https=)
WO (1) WO2023189744A1 (https=)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03201592A (ja) * 1989-12-28 1991-09-03 Hitachi Chem Co Ltd プリント配線板の製造法
JP2000307245A (ja) * 1999-04-23 2000-11-02 Ibiden Co Ltd プリント配線板及びその製造方法、金属張積層板
JP2003158364A (ja) * 2001-11-22 2003-05-30 Hitachi Chem Co Ltd プリント配線板の製造方法
JP2004095972A (ja) * 2002-09-03 2004-03-25 Sumitomo Metal Electronics Devices Inc プラスチックパッケージの製造方法
JP2010183046A (ja) * 2009-02-03 2010-08-19 Samsung Electro-Mechanics Co Ltd プリント基板及びその製造方法
JP2016025329A (ja) * 2014-07-24 2016-02-08 学校法人福岡大学 プリント配線板及びその製造方法
JP2016058545A (ja) * 2014-09-09 2016-04-21 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
JP2017098422A (ja) * 2015-11-25 2017-06-01 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP2018093141A (ja) * 2016-12-07 2018-06-14 凸版印刷株式会社 コア基板、多層配線基板、半導体パッケージ、半導体モジュール、銅張基板、及びコア基板の製造方法
JP2019197851A (ja) * 2018-05-11 2019-11-14 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57177966A (en) 1981-04-24 1982-11-01 Fujitsu Ltd Plating method for printed wiring board
US8119920B2 (en) * 2004-02-04 2012-02-21 Ibiden Co., Ltd. Multilayer printed wiring board
US7834273B2 (en) * 2005-07-07 2010-11-16 Ibiden Co., Ltd. Multilayer printed wiring board
US8756804B2 (en) * 2010-09-29 2014-06-24 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing printed circuit board
WO2019208077A1 (ja) 2018-04-26 2019-10-31 住友電気工業株式会社 プリント配線板用基材及びプリント配線板用基材の製造方法
WO2022075239A1 (ja) 2020-10-09 2022-04-14 住友電気工業株式会社 プリント回路用基材、プリント回路、及びプリント回路用基材の製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03201592A (ja) * 1989-12-28 1991-09-03 Hitachi Chem Co Ltd プリント配線板の製造法
JP2000307245A (ja) * 1999-04-23 2000-11-02 Ibiden Co Ltd プリント配線板及びその製造方法、金属張積層板
JP2003158364A (ja) * 2001-11-22 2003-05-30 Hitachi Chem Co Ltd プリント配線板の製造方法
JP2004095972A (ja) * 2002-09-03 2004-03-25 Sumitomo Metal Electronics Devices Inc プラスチックパッケージの製造方法
JP2010183046A (ja) * 2009-02-03 2010-08-19 Samsung Electro-Mechanics Co Ltd プリント基板及びその製造方法
JP2016025329A (ja) * 2014-07-24 2016-02-08 学校法人福岡大学 プリント配線板及びその製造方法
JP2016058545A (ja) * 2014-09-09 2016-04-21 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
JP2017098422A (ja) * 2015-11-25 2017-06-01 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP2018093141A (ja) * 2016-12-07 2018-06-14 凸版印刷株式会社 コア基板、多層配線基板、半導体パッケージ、半導体モジュール、銅張基板、及びコア基板の製造方法
JP2019197851A (ja) * 2018-05-11 2019-11-14 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法

Also Published As

Publication number Publication date
JP7666736B2 (ja) 2025-04-22
US20250024598A1 (en) 2025-01-16
CN118056476A (zh) 2024-05-17
US12604399B2 (en) 2026-04-14
WO2023189744A1 (ja) 2023-10-05

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