JPWO2023189744A1 - - Google Patents

Info

Publication number
JPWO2023189744A1
JPWO2023189744A1 JP2024511830A JP2024511830A JPWO2023189744A1 JP WO2023189744 A1 JPWO2023189744 A1 JP WO2023189744A1 JP 2024511830 A JP2024511830 A JP 2024511830A JP 2024511830 A JP2024511830 A JP 2024511830A JP WO2023189744 A1 JPWO2023189744 A1 JP WO2023189744A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511830A
Other versions
JPWO2023189744A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023189744A1 publication Critical patent/JPWO2023189744A1/ja
Publication of JPWO2023189744A5 publication Critical patent/JPWO2023189744A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2024511830A 2022-03-29 2023-03-17 Pending JPWO2023189744A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022053407 2022-03-29
PCT/JP2023/010643 WO2023189744A1 (ja) 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2023189744A1 true JPWO2023189744A1 (ja) 2023-10-05
JPWO2023189744A5 JPWO2023189744A5 (ja) 2024-06-04

Family

ID=88201024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511830A Pending JPWO2023189744A1 (ja) 2022-03-29 2023-03-17

Country Status (3)

Country Link
JP (1) JPWO2023189744A1 (ja)
CN (1) CN118056476A (ja)
WO (1) WO2023189744A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03201592A (ja) * 1989-12-28 1991-09-03 Hitachi Chem Co Ltd プリント配線板の製造法
JP4032712B2 (ja) * 2001-11-22 2008-01-16 日立化成工業株式会社 プリント配線板の製造方法
JP6466110B2 (ja) * 2014-09-09 2019-02-06 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
JP6625872B2 (ja) * 2015-11-25 2019-12-25 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP7063101B2 (ja) * 2018-05-11 2022-05-09 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法

Also Published As

Publication number Publication date
WO2023189744A1 (ja) 2023-10-05
CN118056476A (zh) 2024-05-17

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