CN1173212C - Glass upper chip adhering device for LCD - Google Patents

Glass upper chip adhering device for LCD Download PDF

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Publication number
CN1173212C
CN1173212C CNB021232490A CN02123249A CN1173212C CN 1173212 C CN1173212 C CN 1173212C CN B021232490 A CNB021232490 A CN B021232490A CN 02123249 A CN02123249 A CN 02123249A CN 1173212 C CN1173212 C CN 1173212C
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CN
China
Prior art keywords
chip
glass
lcd
unit
driving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB021232490A
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Chinese (zh)
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CN1385737A (en
Inventor
安东哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arni Ltd
Original Assignee
SEMICONDUCTOR ENGINEERING CORP
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Filing date
Publication date
Application filed by SEMICONDUCTOR ENGINEERING CORP filed Critical SEMICONDUCTOR ENGINEERING CORP
Publication of CN1385737A publication Critical patent/CN1385737A/en
Application granted granted Critical
Publication of CN1173212C publication Critical patent/CN1173212C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

A device for bonding chip on glass in LCD(liquid crystal display) device is provided to reduce an interference of a signal generated inter data line by sticking an LCD drive chip on a glass of an LCD device directly. A bonding head unit and a worktable unit is connected with a chip carriage unit . A robot unit operates in X-Y axis. A bonding head assembled in the bonding head unit descends on a slide in case the robot unit supplies with an IC(integrated circuit) chip. The IC chip is bonded on a glass for an appointed second in an appointed range of temperature.

Description

The adhering device of glass top chip in the LCD
Technical field
The present invention relates to the adhering device of glass top chip in a kind of LCD, and more specifically say, the adhering device that relates to glass top chip in a kind of following LCD, it can be directly that LCD (LCD) chip for driving is bonded in the TFT of LCD device is on glass.
Background technology
Figure 14 a illustrates the structural drawing of prototype LCD (LCD).Generally, most of LCD devices become thin, light and small and exquisite along with it and sell with prototype on market.As shown in the figure, the LCD chip for driving at first is not with the QFP method, but with the encapsulation of TAP (belt bonds automatically) method, and be contained on the PCB.After this, the outside lead of chip is bent, and it is on glass then to be connected in TFT.
Secondly, Figure 14 b shows the structural drawing of LCD, wherein by means of the method that is used for directly the LCD chip for driving being encapsulated in TFT glass top chip on glass, makes LCD thinner, lighter and littler.Shown in Figure 14 c, this LCD forms metal layer on TFT glass two sides, and then, the LCD chip for driving is bonded on the metal layer.The LCD chip for driving is bondd with a kind of SBB COG (chip on the tap projection adhesive glass) method, and promptly a conducting polymer is bondd by polymerization on being placed at the golden projection that is formed on each solder joint of chip.
But, conducting polymer has a shortcoming,, needs very accurately increase manufacturing cost owing to being placed on each solder joint when conducting polymer that is.
Conducting polymer has another shortcoming, that is, because its other various common materials of resistance ratio high 10～100 times, so electric conductivity is bad, in case and conducting polymer be aggregated and be bonded on the chip, then be difficult to repair.
Goal of the invention
Therefore, the purpose of this invention is to provide the adhering device of glass top chip in a kind of LCD, it can directly be bonded in the on glass of LCD device to LCD (LCD) chip for driving.
In order to reach above purpose, the invention provides the adhering device of glass top chip in a kind of LCD, wherein, it is on glass that binding material closely is applied to TFT, and the heat of high temperature by heating plate is melted and is bonded in each chip for driving on glass.Binding material be by as thermoplastic resin family by polystyrene resin, ethene acetic acid ester resin (EVA) or ethene acetyl resin, perhaps by making as phenolic resin, urea resin, melanocyte resin, alkyd resin, vibrin, silicones, epoxy resin, urethane resin or the furancarbinol resin of thermosetting resin family.
Description of drawings
Other purposes of the present invention and advantage can obtain more comprehensively understanding from the detailed description of doing below in conjunction with accompanying drawing, in the accompanying drawing:
Fig. 1 shows a part section front view, shows assembled state of the present invention;
Fig. 2 shows a partial cut away side views, shows assembled state of the present invention;
Fig. 3 illustrates the amplification front view of bonding head unit of the present invention;
Fig. 4 illustrates the enlarged side view of bonding head unit of the present invention;
Fig. 5 illustrates the front view of countertop unit of the present invention;
Fig. 6 illustrates the planimetric map of countertop unit of the present invention;
Fig. 7 illustrates the planimetric map of chip delivery unit of the present invention;
Fig. 8 illustrates the side view of chip delivery unit of the present invention;
Fig. 9 is illustrated in the robot cell's who operates on the X-Y axis front view;
Figure 10 is illustrated in the robot cell's who operates on the X-Y axis side view;
Figure 11 illustrates a side view, shows that ACF is bonded in state on glass;
Figure 12 illustrates a side view, shows the state of COG type IC chip attach;
Figure 13 illustrates the part section enlarged side view of each major part of the present invention;
Figure 14 a to 14c illustrates the structural drawing of the LCD (LCD) that adopts traditional TAP.
Embodiment
The present invention is described in detail in conjunction with preferential embodiment now with reference to accompanying drawing.As reference, same Reference numeral spreads all over each view, indicates corresponding parts.
The present invention includes bonding head unit, a countertop unit and a chip conveying element, so that it is on glass that chip for driving is bonded in TFT.Chip for driving is moved automatically by the robot cell who operates on the X-Y axis.
After this, with reference to accompanying drawing, the present invention will be described in detail.
Fig. 1 illustrates a part section front view, shows assembled state of the present invention; Fig. 2 illustrates a partial cut away side views, shows assembled state of the present invention; Fig. 3 illustrates the amplification front view of bonding head unit of the present invention; Fig. 4 illustrates the enlarged side view of bonding head unit of the present invention; Fig. 5 illustrates the front view of countertop unit of the present invention; Fig. 6 illustrates the planimetric map of countertop unit of the present invention; Fig. 7 illustrates the planimetric map of chip delivery unit of the present invention; Fig. 8 illustrates the side view of chip delivery unit of the present invention; Fig. 9 shows the robot cell's who operates front view on the X-Y axis; Figure 10 is illustrated in the robot cell's who operates on the X-Y axis side view; Figure 11 illustrates a side view, has shown that ACF is bonded in state on glass; Figure 12 illustrates a side view, has shown the state of COG (glass top chip) type IC chip attach; Figure 13 illustrates the part section enlarged side view of major part of the present invention; And Figure 14 a to 14c illustrates the structural drawing of the LCD (LCD) that adopts traditional TAP.
At first, shown in Fig. 3 and 4, cylinder 28 is fixed on the support member 11 on the sliding support 12 that both sides form, and remains to be arranged on cylinder below 28 with 29 plate that are connected 10 that bond.
At this moment, temperature that produced by bonding 29 apply according to operating conditions differently, and preferably apply 5～10 seconds kinds within 170 ℃～220 ℃ of temperature ranges.
Secondly, preferably, according to binding material, pressure is 2Mpa, 40kg/cm 2
Bonding 29 vertically moves along slide rail 46 slidably by operation cylinder 28.
Fig. 5 and 6 illustrates the front view and the planimetric map of countertop unit.One milling clamp 32 is assembled on the tabular platform 31, and video camera 47 is assembled on the platform support 30, thus operator's state of sight glass 52, binding material 53 and chip for driving 45 bondings constantly.
Fig. 7 and 8 illustrates the planimetric map and the side view of chip delivery unit.The chip pin 37 fixedly critical component at place (key) (not shown) is fixed on another plate 10 and adsorbs the chip for driving 45 that leaves among the robot cell 48 under vacuum condition, and the edge is displaced sideways by operation cylinder 28 simultaneously.After this, this critical component is automatically moved to the bonding head, so that be adsorbed under vacuum condition.The chip delivery unit is turned back to its initial position by cylinder 28 and falls.After this, the operator then, is bonded in chip for driving 45 on the glass surface of placing on the countertop unit 49 by the position of video camera 47 adjusting chip delivery units.
Fig. 9 and 10 is illustrated in the robot cell's who operates on the X-Y axis front view and planimetric map.Connect plate 42 can be by being rotationally connected with ball-screw 39 on the electric machine support 44 lateral rotation.
Secondly, a plurality of chip for driving 45 are positioned to connect on the plate 42 and by chip delivery unit 50 and transmit.
At this moment, employing by as thermoplastic resin family by polystyrene resin, ethene acetic acid ester resin (EVA) or ethene acetyl resin, perhaps by the binding material of making as phenolic resin, urea resin, melanocyte resin, alkyd resin, vibrin, silicones, epoxy resin, urethane resin or the furancarbinol resin of thermosetting resin family.Binding material closely is applied on glass, and is made it fusing and chip for driving is bonded on glass by the heat of high temperature of heating plate.
More than bonding can be finished by the people unit 48 of operating machine continuously, chip delivery unit 50, countertop unit 49 and bonding head unit 51.
Operation of the present invention and effect will be described as follows in more detail.
At first, the operator is placed on a plurality of chip for driving 45 on the plate 10 of working on the X-Y axis by the ball-screw 39 that manipulation is assembled on the robot cell 48, and waits for next step.
At this moment, being assembled into heating plate 17 and the bonding 29 of bonding on the head unit 51 rises along slide rail 46 by operation cylinder 28.
After this, move into place chip for driving 45 places on plate 10 with the integrally formed casing 19 of chip delivery unit 50 and backing plate 13 by operation cylinder 28.
Then, in chip delivery unit 50, vacuum buffer pad 38 be fixed in connect on the mounting bracket on the rotary driver 36, make chip for driving 45 be adsorbed and move by air supplied in vacuum condition following moment.
The chip for driving that is adsorbed under vacuum condition is moved on the bonding 29 and is adsorbed under vacuum condition, and chip delivery unit 50 turns back to its initial position.
Then, bonder 29 falls by operation cylinder 28.
At this moment, go up and can not move by 52 surfaces because binding material 53 is bonded in glass for chip for driving 45.
Secondly, the operator utilizes X, Y and theta stage to regulate the ITO line (not shown) of impression on the glass 52 and the projection of chip for driving 45, so that they are become is identical by being contained in video camera 47 under the countertop unit 49.After this, when the operator pressed the switch (not shown), slide rail 46 moved backward by operation cylinder 28, and bonding 29 falls, thus hot pressing glass and chip for driving.
Then, after the process official hour, the one action circulation finishes along with bonding 29 rise, and then adhering device turns back to initial position.
Industrial applicability
As mentioned above, according to the structure of LCD panel of the present invention, be installed in COG type LCD face The signal that produces between many data wires on the glass sheet disturbs and the EMI phenomenon is reduced, and via The distortion of the signal that data wire and input lead section are transmitted is minimized.
Although the present invention is described with reference to each concrete illustrated embodiment, it also can't help to implement Example limits, and is just limited by appended claims. Should be appreciated that the art technology people The member can change or revise embodiment under the prerequisite that does not depart from category of the present invention and spirit.

Claims (5)

1. the adhering device of glass top chip in a LCD (LCD) device, it is on glass to be used for that directly the LCD chip for driving is bonded in LCD device TFT, and this adhering device comprises bonding head unit, countertop unit, chip delivery unit and robot cell,
Wherein, bonding head unit and countertop unit are connected on the chip delivery unit, on glass chip for driving is bonded in TFT, and when chip for driving is supplied with by the robot cell who operates on the X-Y axis, being assembled into the head that bonds on the bonder unit falls along slide rail, make chip for driving on glass through being bonded in for 5～10 seconds under 170 ℃～220 ℃ temperature by means of binding material, described binding material is made by thermoplastic resin family or thermosetting resin family.
2. adhering device as claimed in claim 1, it is characterized in that, video camera is installed on the platform support that is connected on the tabular platform of countertop unit, regulates the position arrangement of chip for driving and glass to allow the operator, confirms this position arrangement by watch-dog simultaneously.
3. adhering device as claimed in claim 1, it is characterized in that, the critical component that chip pin is fixed on the chip delivery unit is fixed on the plate, and chip for driving among the robot cell is left in absorption under vacuum condition, laterally move by the operation cylinder simultaneously, and move to countertop unit.
4. adhering device as claimed in claim 1 is characterized in that, the robot cell is lateral rotation by the rotation that is connected in the ball-screw that connects plate and electric machine support.
5. adhering device as claimed in claim 1 is characterized in that, the heat of high temperature of described binding material by bonding head melted and chip for driving be bonded on glass.
CNB021232490A 2001-08-20 2002-06-14 Glass upper chip adhering device for LCD Expired - Fee Related CN1173212C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2001-0049961A KR100431149B1 (en) 2001-08-20 2001-08-20 A bonding device of chip on glass in Liquid Crystal Display
KR0049961/2001 2001-08-20
KR0049961/01 2001-08-20

Publications (2)

Publication Number Publication Date
CN1385737A CN1385737A (en) 2002-12-18
CN1173212C true CN1173212C (en) 2004-10-27

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CN (1) CN1173212C (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100808937B1 (en) * 2005-08-23 2008-03-03 주식회사 여의시스템 Apparatus for Bonding Chip On Glass
KR100748161B1 (en) * 2005-09-02 2007-08-09 주식회사 에스에프에이 Automatic cog bonder
KR100787837B1 (en) * 2006-02-08 2007-12-27 박웅기 Chip's Compression Bonding Method and Apparatus for Producing a Plate Type Display Module
KR101305379B1 (en) * 2009-07-21 2013-09-06 엘지디스플레이 주식회사 Chip on glass type liquid crystal display device and inspecting method for the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3018919B2 (en) * 1994-08-30 2000-03-13 カシオ計算機株式会社 Bonding method and apparatus
KR0138745Y1 (en) * 1996-10-02 1999-05-15 삼성전자주식회사 Apparatus for moving parts for outer lead bonding machine
JPH10150075A (en) * 1996-11-18 1998-06-02 Toshiba Corp Method and device for flip-chip bonding
KR19990017052A (en) * 1997-08-21 1999-03-15 윤종용 Apparatus and method for both adhesive application and die bonding
KR100312743B1 (en) * 1998-04-02 2001-11-03 윤종용 Semiconductor die bonder position recognizing and testing apparatus and method thereof
KR100291538B1 (en) * 1999-03-12 2001-05-15 정현구 A camera lining up apparatus for semiconductor chip bonding machine
KR200249793Y1 (en) * 2001-04-25 2001-11-16 주식회사 성진하이메크 Chip Automatic Attachment Apparatus

Also Published As

Publication number Publication date
KR100431149B1 (en) 2004-05-22
KR20010088671A (en) 2001-09-28
CN1385737A (en) 2002-12-18

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Owner name: ANI CO., LTD.

Free format text: FORMER OWNER: SEMICONDUCTOR ENGINEERING CORP.

Effective date: 20071012

C41 Transfer of patent application or patent right or utility model
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Address after: Gyeonggi Do, South Korea

Patentee after: Arni Ltd

Address before: gumi

Patentee before: Semiconductor Engineering Corp.

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20041027

Termination date: 20130614