CN116982003A - 感光性树脂组合物 - Google Patents

感光性树脂组合物 Download PDF

Info

Publication number
CN116982003A
CN116982003A CN202280019418.XA CN202280019418A CN116982003A CN 116982003 A CN116982003 A CN 116982003A CN 202280019418 A CN202280019418 A CN 202280019418A CN 116982003 A CN116982003 A CN 116982003A
Authority
CN
China
Prior art keywords
bond
photosensitive resin
resin composition
group
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280019418.XA
Other languages
English (en)
Chinese (zh)
Inventor
远藤贵文
石井秀则
坂口崇洋
荻野浩司
星野有辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Publication of CN116982003A publication Critical patent/CN116982003A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymerisation Methods In General (AREA)
CN202280019418.XA 2021-03-22 2022-02-25 感光性树脂组合物 Pending CN116982003A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021046929 2021-03-22
JP2021-046929 2021-03-22
PCT/JP2022/007899 WO2022202098A1 (ja) 2021-03-22 2022-02-25 感光性樹脂組成物

Publications (1)

Publication Number Publication Date
CN116982003A true CN116982003A (zh) 2023-10-31

Family

ID=83395591

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280019418.XA Pending CN116982003A (zh) 2021-03-22 2022-02-25 感光性树脂组合物

Country Status (5)

Country Link
JP (1) JPWO2022202098A1 (de)
KR (1) KR20230160249A (de)
CN (1) CN116982003A (de)
TW (1) TW202244131A (de)
WO (1) WO2022202098A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804086B (zh) 2021-03-26 2023-06-01 財團法人工業技術研究院 聚醯亞胺、薄膜組合物及其所形成之薄膜
CN115626989B (zh) * 2022-10-28 2023-06-13 嘉兴瑞华泰薄膜技术有限公司 光敏聚酰亚胺、光敏聚酰亚胺薄膜及其制备方法和应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113748A (ja) * 1987-10-27 1989-05-02 Hitachi Chem Co Ltd 感光性樹脂組成物
JPH01118514A (ja) * 1987-11-02 1989-05-11 Hitachi Chem Co Ltd 感光性樹脂組成物
US6303742B1 (en) * 1998-04-01 2001-10-16 Kanekafuchi Kagaku Kogyo Kabushiki Kaisha Polyimide compositions
JP2000347404A (ja) 1999-06-02 2000-12-15 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物並びにこれを用いた電子部品及びその製造法
TW202130701A (zh) * 2019-11-27 2021-08-16 日商富士軟片股份有限公司 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件及樹脂

Also Published As

Publication number Publication date
TW202244131A (zh) 2022-11-16
WO2022202098A1 (ja) 2022-09-29
KR20230160249A (ko) 2023-11-23
JPWO2022202098A1 (de) 2022-09-29

Similar Documents

Publication Publication Date Title
KR102090451B1 (ko) 감광성 수지 조성물, 폴리이미드의 제조 방법 및 반도체 장치
JP7131557B2 (ja) 感光性樹脂組成物
KR101719045B1 (ko) 네거티브형 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법, 및 반도체 장치
JP5415861B2 (ja) 感光性樹脂組成物、パターン形成方法、及び半導体装置
CN116982003A (zh) 感光性树脂组合物
JP6935982B2 (ja) 樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
JP3332278B2 (ja) ポリイミド前駆体およびネガ型感光性材料、並びに感光性基材およびネガ型パターン形成方法
JP7444239B2 (ja) 感光性絶縁膜形成組成物
JPWO2020080206A1 (ja) ポリアミック酸エステル樹脂組成物
WO2023106104A1 (ja) 感光性樹脂組成物
JP7331860B2 (ja) 感光性絶縁膜組成物
JP2023156304A (ja) 感光性絶縁膜組成物
JP7332076B1 (ja) 絶縁膜形成用感光性樹脂組成物
WO2021117586A1 (ja) 感光性絶縁膜形成組成物
TWI827467B (zh) 絕緣膜形成用感光性樹脂組成物
WO2021070232A1 (ja) ポリイミド前駆体、樹脂組成物、感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
WO2023106108A1 (ja) 感光性樹脂組成物
JP2023127745A (ja) 感光性樹脂組成物
CN118302485A (en) Resin composition
WO2023106101A1 (ja) 樹脂組成物
TW202413490A (zh) 絕緣膜形成用感光性樹脂組成物
WO2023058385A1 (ja) ブロック共重合体
CN116256946A (zh) 感光性树脂组合物、固化浮雕图案的制造方法和半导体装置
JP2023023187A (ja) 感光性樹脂組成物および半導体装置
JP2023054767A (ja) ポリアミド樹脂の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination