CN116918049A - 半导体装置用Al接合线 - Google Patents

半导体装置用Al接合线 Download PDF

Info

Publication number
CN116918049A
CN116918049A CN202280013190.3A CN202280013190A CN116918049A CN 116918049 A CN116918049 A CN 116918049A CN 202280013190 A CN202280013190 A CN 202280013190A CN 116918049 A CN116918049 A CN 116918049A
Authority
CN
China
Prior art keywords
wire
bonding wire
mass ppm
temperature
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280013190.3A
Other languages
English (en)
Chinese (zh)
Inventor
须藤裕弥
宇野智裕
小山田哲哉
小田大造
江藤基稀
栗原佑仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel and Sumikin Chemical Co Ltd
Nippon Steel Chemical and Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel and Sumikin Chemical Co Ltd, Nippon Steel Chemical and Materials Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Publication of CN116918049A publication Critical patent/CN116918049A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
    • B23K35/286—Al as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)
CN202280013190.3A 2021-02-05 2022-01-31 半导体装置用Al接合线 Pending CN116918049A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021017610 2021-02-05
JP2021-017610 2021-02-05
PCT/JP2022/003575 WO2022168787A1 (ja) 2021-02-05 2022-01-31 半導体装置用Ａｌボンディングワイヤ

Publications (1)

Publication Number Publication Date
CN116918049A true CN116918049A (zh) 2023-10-20

Family

ID=82741431

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280013190.3A Pending CN116918049A (zh) 2021-02-05 2022-01-31 半导体装置用Al接合线

Country Status (5)

Country Link
US (1) US20240071978A1 (https=)
EP (1) EP4289983A4 (https=)
JP (1) JP7784390B2 (https=)
CN (1) CN116918049A (https=)
WO (1) WO2022168787A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7600474B1 (ja) * 2022-12-05 2024-12-16 日鉄ケミカル＆マテリアル株式会社 Ａｌ接続材
JP7600475B1 (ja) * 2022-12-05 2024-12-16 日鉄ケミカル＆マテリアル株式会社 Ａｌ接続材
DE112023005086T5 (de) * 2022-12-05 2025-10-23 Nippon Micrometal Corporation Al-Legierungs-Bonddraht
WO2025115916A1 (ja) * 2023-11-27 2025-06-05 日鉄ケミカル＆マテリアル株式会社 Ａｌボンディングワイヤ又はＡｌボンディングリボン

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60177667A (ja) * 1984-02-24 1985-09-11 Hitachi Ltd 半導体装置
JPS6095948A (ja) * 1983-10-31 1985-05-29 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS6132444A (ja) * 1984-07-24 1986-02-15 Hitachi Ltd 集積回路装置
JP2002246542A (ja) 2001-02-15 2002-08-30 Matsushita Electric Ind Co Ltd パワーモジュール及びその製造方法
JP2008311383A (ja) * 2007-06-14 2008-12-25 Ibaraki Univ ボンディングワイヤ、それを使用したボンディング方法及び半導体装置並びに接続部構造
JP5680138B2 (ja) 2013-05-15 2015-03-04 田中電子工業株式会社 耐食性アルミニウム合金ボンディングワイヤ
KR20180008245A (ko) * 2015-06-15 2018-01-24 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 반도체 장치용 본딩 와이어

Also Published As

Publication number Publication date
WO2022168787A1 (ja) 2022-08-11
US20240071978A1 (en) 2024-02-29
TW202235634A (zh) 2022-09-16
JP7784390B2 (ja) 2025-12-11
EP4289983A1 (en) 2023-12-13
EP4289983A4 (en) 2025-03-05
JPWO2022168787A1 (https=) 2022-08-11

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