JP7784390B2 - 半導体装置用Ａｌボンディングワイヤ - Google Patents

半導体装置用Ａｌボンディングワイヤ

Info

Publication number
JP7784390B2
JP7784390B2 JP2022579524A JP2022579524A JP7784390B2 JP 7784390 B2 JP7784390 B2 JP 7784390B2 JP 2022579524 A JP2022579524 A JP 2022579524A JP 2022579524 A JP2022579524 A JP 2022579524A JP 7784390 B2 JP7784390 B2 JP 7784390B2
Authority
JP
Japan
Prior art keywords
wire
mass
bonding wire
less
ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022579524A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022168787A1 (https=
Inventor
裕弥 須藤
智裕 宇野
哲哉 小山田
大造 小田
基稀 江藤
佑仁 栗原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Micrometal Corp, Nippon Steel Chemical and Materials Co Ltd filed Critical Nippon Micrometal Corp
Publication of JPWO2022168787A1 publication Critical patent/JPWO2022168787A1/ja
Application granted granted Critical
Publication of JP7784390B2 publication Critical patent/JP7784390B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
    • B23K35/286—Al as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)
JP2022579524A 2021-02-05 2022-01-31 半導体装置用Ａｌボンディングワイヤ Active JP7784390B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021017610 2021-02-05
JP2021017610 2021-02-05
PCT/JP2022/003575 WO2022168787A1 (ja) 2021-02-05 2022-01-31 半導体装置用Ａｌボンディングワイヤ

Publications (2)

Publication Number Publication Date
JPWO2022168787A1 JPWO2022168787A1 (https=) 2022-08-11
JP7784390B2 true JP7784390B2 (ja) 2025-12-11

Family

ID=82741431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022579524A Active JP7784390B2 (ja) 2021-02-05 2022-01-31 半導体装置用Ａｌボンディングワイヤ

Country Status (5)

Country Link
US (1) US20240071978A1 (https=)
EP (1) EP4289983A4 (https=)
JP (1) JP7784390B2 (https=)
CN (1) CN116918049A (https=)
WO (1) WO2022168787A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7600474B1 (ja) * 2022-12-05 2024-12-16 日鉄ケミカル＆マテリアル株式会社 Ａｌ接続材
JP7600475B1 (ja) * 2022-12-05 2024-12-16 日鉄ケミカル＆マテリアル株式会社 Ａｌ接続材
DE112023005086T5 (de) * 2022-12-05 2025-10-23 Nippon Micrometal Corporation Al-Legierungs-Bonddraht
WO2025115916A1 (ja) * 2023-11-27 2025-06-05 日鉄ケミカル＆マテリアル株式会社 Ａｌボンディングワイヤ又はＡｌボンディングリボン

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008311383A (ja) 2007-06-14 2008-12-25 Ibaraki Univ ボンディングワイヤ、それを使用したボンディング方法及び半導体装置並びに接続部構造
JP2014224283A (ja) 2013-05-15 2014-12-04 田中電子工業株式会社 耐食性アルミニウム合金ボンディングワイヤ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60177667A (ja) * 1984-02-24 1985-09-11 Hitachi Ltd 半導体装置
JPS6095948A (ja) * 1983-10-31 1985-05-29 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS6132444A (ja) * 1984-07-24 1986-02-15 Hitachi Ltd 集積回路装置
JP2002246542A (ja) 2001-02-15 2002-08-30 Matsushita Electric Ind Co Ltd パワーモジュール及びその製造方法
KR20180008245A (ko) * 2015-06-15 2018-01-24 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 반도체 장치용 본딩 와이어

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008311383A (ja) 2007-06-14 2008-12-25 Ibaraki Univ ボンディングワイヤ、それを使用したボンディング方法及び半導体装置並びに接続部構造
JP2014224283A (ja) 2013-05-15 2014-12-04 田中電子工業株式会社 耐食性アルミニウム合金ボンディングワイヤ

Also Published As

Publication number Publication date
WO2022168787A1 (ja) 2022-08-11
US20240071978A1 (en) 2024-02-29
TW202235634A (zh) 2022-09-16
CN116918049A (zh) 2023-10-20
EP4289983A1 (en) 2023-12-13
EP4289983A4 (en) 2025-03-05
JPWO2022168787A1 (https=) 2022-08-11

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