JPWO2022168787A1 - - Google Patents

Info

Publication number
JPWO2022168787A1
JPWO2022168787A1 JP2022579524A JP2022579524A JPWO2022168787A1 JP WO2022168787 A1 JPWO2022168787 A1 JP WO2022168787A1 JP 2022579524 A JP2022579524 A JP 2022579524A JP 2022579524 A JP2022579524 A JP 2022579524A JP WO2022168787 A1 JPWO2022168787 A1 JP WO2022168787A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022579524A
Other languages
Japanese (ja)
Other versions
JP7784390B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022168787A1 publication Critical patent/JPWO2022168787A1/ja
Application granted granted Critical
Publication of JP7784390B2 publication Critical patent/JP7784390B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
    • B23K35/286—Al as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)
JP2022579524A 2021-02-05 2022-01-31 半導体装置用Ａｌボンディングワイヤ Active JP7784390B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021017610 2021-02-05
JP2021017610 2021-02-05
PCT/JP2022/003575 WO2022168787A1 (ja) 2021-02-05 2022-01-31 半導体装置用Ａｌボンディングワイヤ

Publications (2)

Publication Number Publication Date
JPWO2022168787A1 true JPWO2022168787A1 (https=) 2022-08-11
JP7784390B2 JP7784390B2 (ja) 2025-12-11

Family

ID=82741431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022579524A Active JP7784390B2 (ja) 2021-02-05 2022-01-31 半導体装置用Ａｌボンディングワイヤ

Country Status (5)

Country Link
US (1) US20240071978A1 (https=)
EP (1) EP4289983A4 (https=)
JP (1) JP7784390B2 (https=)
CN (1) CN116918049A (https=)
WO (1) WO2022168787A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7600474B1 (ja) * 2022-12-05 2024-12-16 日鉄ケミカル＆マテリアル株式会社 Ａｌ接続材
JP7600475B1 (ja) * 2022-12-05 2024-12-16 日鉄ケミカル＆マテリアル株式会社 Ａｌ接続材
DE112023005086T5 (de) * 2022-12-05 2025-10-23 Nippon Micrometal Corporation Al-Legierungs-Bonddraht
WO2025115916A1 (ja) * 2023-11-27 2025-06-05 日鉄ケミカル＆マテリアル株式会社 Ａｌボンディングワイヤ又はＡｌボンディングリボン

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6095948A (ja) * 1983-10-31 1985-05-29 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS60177667A (ja) * 1984-02-24 1985-09-11 Hitachi Ltd 半導体装置
JPS6132444A (ja) * 1984-07-24 1986-02-15 Hitachi Ltd 集積回路装置
JP2008311383A (ja) * 2007-06-14 2008-12-25 Ibaraki Univ ボンディングワイヤ、それを使用したボンディング方法及び半導体装置並びに接続部構造
JP2014224283A (ja) * 2013-05-15 2014-12-04 田中電子工業株式会社 耐食性アルミニウム合金ボンディングワイヤ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246542A (ja) 2001-02-15 2002-08-30 Matsushita Electric Ind Co Ltd パワーモジュール及びその製造方法
KR20180008245A (ko) * 2015-06-15 2018-01-24 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 반도체 장치용 본딩 와이어

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6095948A (ja) * 1983-10-31 1985-05-29 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線
JPS60177667A (ja) * 1984-02-24 1985-09-11 Hitachi Ltd 半導体装置
JPS6132444A (ja) * 1984-07-24 1986-02-15 Hitachi Ltd 集積回路装置
JP2008311383A (ja) * 2007-06-14 2008-12-25 Ibaraki Univ ボンディングワイヤ、それを使用したボンディング方法及び半導体装置並びに接続部構造
JP2014224283A (ja) * 2013-05-15 2014-12-04 田中電子工業株式会社 耐食性アルミニウム合金ボンディングワイヤ

Also Published As

Publication number Publication date
WO2022168787A1 (ja) 2022-08-11
US20240071978A1 (en) 2024-02-29
TW202235634A (zh) 2022-09-16
JP7784390B2 (ja) 2025-12-11
CN116918049A (zh) 2023-10-20
EP4289983A1 (en) 2023-12-13
EP4289983A4 (en) 2025-03-05

Similar Documents

Publication Publication Date Title
BR112023005462A2 (https=)
BR112023012656A2 (https=)
BR112021014123A2 (https=)
BR112023009656A2 (https=)
BR112022009896A2 (https=)
JPWO2022168787A1 (https=)
BR112021017747A2 (https=)
BR112022024743A2 (https=)
BR112022026905A2 (https=)
BR112023011738A2 (https=)
BR112023004146A2 (https=)
BR112023006729A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
BR102021007058A2 (https=)
BR102020022030A2 (https=)
BR112023016292A2 (https=)
BR112023011539A2 (https=)
BR112023011610A2 (https=)
BR112023008976A2 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021016837A2 (https=)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241227

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20251104

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20251201

R150 Certificate of patent or registration of utility model

Ref document number: 7784390

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150