CN116868327A - 用于焊线和其他电子部件封装设备的智能图案识别系统及相关方法 - Google Patents
用于焊线和其他电子部件封装设备的智能图案识别系统及相关方法 Download PDFInfo
- Publication number
- CN116868327A CN116868327A CN202280010210.1A CN202280010210A CN116868327A CN 116868327 A CN116868327 A CN 116868327A CN 202280010210 A CN202280010210 A CN 202280010210A CN 116868327 A CN116868327 A CN 116868327A
- Authority
- CN
- China
- Prior art keywords
- pattern recognition
- recipe
- image acquisition
- parameters
- imaging system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0012—Biomedical image inspection
- G06T7/0014—Biomedical image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/141—Control of illumination
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V20/00—Scenes; Scene-specific elements
- G06V20/60—Type of objects
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10141—Special mode during image acquisition
- G06T2207/10152—Varying illumination
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30168—Image quality inspection
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V2201/00—Indexing scheme relating to image or video recognition or understanding
- G06V2201/06—Recognition of objects for industrial automation
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Multimedia (AREA)
- Health & Medical Sciences (AREA)
- Medical Informatics (AREA)
- General Health & Medical Sciences (AREA)
- Evolutionary Computation (AREA)
- Databases & Information Systems (AREA)
- Computing Systems (AREA)
- Artificial Intelligence (AREA)
- Software Systems (AREA)
- Quality & Reliability (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
- Studio Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163138377P | 2021-01-15 | 2021-01-15 | |
| PCT/US2022/012406 WO2022155398A1 (en) | 2021-01-15 | 2022-02-17 | Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116868327A true CN116868327A (zh) | 2023-10-10 |
Family
ID=82406475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280010210.1A Pending CN116868327A (zh) | 2021-01-15 | 2022-02-17 | 用于焊线和其他电子部件封装设备的智能图案识别系统及相关方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12118726B2 (https=) |
| EP (1) | EP4278377A4 (https=) |
| JP (1) | JP2024505159A (https=) |
| CN (1) | CN116868327A (https=) |
| WO (1) | WO2022155398A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12462375B2 (en) * | 2022-08-05 | 2025-11-04 | Tokyo Electron Limited | Methods to automatically adjust one or more parameters of a camera system for optimal 3D reconstruction of features formed within/on a semiconductor substrate |
Family Cites Families (43)
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| JPS6362242A (ja) * | 1986-09-02 | 1988-03-18 | Toshiba Corp | ワイヤボンディング装置 |
| JPH0897241A (ja) | 1994-09-21 | 1996-04-12 | Rohm Co Ltd | リードボンディング位置の検出順位決定方法、およびその装置 |
| KR0152607B1 (ko) * | 1995-08-17 | 1998-12-01 | 김주용 | 윈도우 클램프 및 그를 이용한 리드 프레임 스트립의 정렬방법 |
| JP2982000B1 (ja) * | 1998-07-03 | 1999-11-22 | 株式会社新川 | ボンディング方法及びその装置 |
| US6476913B1 (en) * | 1998-11-30 | 2002-11-05 | Hitachi, Ltd. | Inspection method, apparatus and system for circuit pattern |
| KR20010100868A (ko) * | 2000-04-06 | 2001-11-14 | 이주하라 요죠우 | 광기록 헤드와 그 조립 방법 |
| JP4124554B2 (ja) | 2000-08-16 | 2008-07-23 | 株式会社カイジョー | ボンディング装置 |
| MY127433A (en) | 2001-05-29 | 2006-12-29 | Integrated Device Tech | Die bonding apparatus with automatic die and lead frame image matching system. |
| US7065239B2 (en) * | 2001-10-24 | 2006-06-20 | Applied Materials, Inc. | Automated repetitive array microstructure defect inspection |
| JP2004086136A (ja) * | 2002-07-01 | 2004-03-18 | Seiko Epson Corp | 光トランシーバの製造方法及び調整装置 |
| JP2004226717A (ja) * | 2003-01-23 | 2004-08-12 | Renesas Technology Corp | マスクの製造方法および半導体集積回路装置の製造方法 |
| JP4128540B2 (ja) * | 2003-06-05 | 2008-07-30 | 株式会社新川 | ボンディング装置 |
| JP2006041006A (ja) | 2004-07-23 | 2006-02-09 | Matsushita Electric Ind Co Ltd | 半導体チップのボンディング方法及び装置 |
| US7454053B2 (en) * | 2004-10-29 | 2008-11-18 | Mitutoyo Corporation | System and method for automatically recovering video tools in a vision system |
| JP4618691B2 (ja) * | 2005-02-03 | 2011-01-26 | 富士通株式会社 | マーク画像処理方法、プログラム及び装置 |
| JP2006251571A (ja) * | 2005-03-11 | 2006-09-21 | Fuji Photo Film Co Ltd | アライメント用光源ユニット、アライメント装置、露光装置、デジタル露光装置、アライメント方法、露光方法及び照明装置の条件を設定する方法 |
| JP4634289B2 (ja) * | 2005-11-25 | 2011-02-16 | 株式会社日立ハイテクノロジーズ | 半導体パターン形状評価装置および形状評価方法 |
| JP4791840B2 (ja) * | 2006-02-06 | 2011-10-12 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置、走査電子顕微鏡、および試料検査方法 |
| CN101025402B (zh) * | 2006-02-17 | 2012-07-04 | 株式会社日立高新技术 | 扫描型电子显微镜装置以及使用它的摄影方法 |
| WO2008077100A2 (en) * | 2006-12-19 | 2008-06-26 | Kla-Tencor Corporation | Systems and methods for creating inspection recipes |
| US9304412B2 (en) * | 2007-08-24 | 2016-04-05 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method |
| US20090088997A1 (en) * | 2007-09-28 | 2009-04-02 | Hitachi High Technologies Corporation | Data processing system |
| CN102017109A (zh) * | 2008-02-29 | 2011-04-13 | 库力索法工业公司 | 在线焊机上指导焊接位置并检验导线环的方法以及执行该方法的装置 |
| US8098955B2 (en) * | 2008-03-25 | 2012-01-17 | Point Grey Research Inc. | Efficient selection and application of regions of interest in digital imaging |
| JP5030906B2 (ja) * | 2008-09-11 | 2012-09-19 | 株式会社日立ハイテクノロジーズ | 走査荷電粒子顕微鏡を用いたパノラマ画像合成方法およびその装置 |
| JP5390215B2 (ja) * | 2009-02-25 | 2014-01-15 | 株式会社日立ハイテクノロジーズ | 欠陥観察方法および欠陥観察装置 |
| US10324046B1 (en) * | 2009-06-03 | 2019-06-18 | Kla-Tencor Corp. | Methods and systems for monitoring a non-defect related characteristic of a patterned wafer |
| JP5525421B2 (ja) * | 2010-11-24 | 2014-06-18 | 株式会社日立ハイテクノロジーズ | 画像撮像装置および画像撮像方法 |
| US9780004B2 (en) * | 2011-03-25 | 2017-10-03 | Kla-Tencor Corporation | Methods and apparatus for optimization of inspection speed by generation of stage speed profile and selection of care areas for automated wafer inspection |
| JP5544344B2 (ja) * | 2011-09-26 | 2014-07-09 | 株式会社日立ハイテクノロジーズ | 欠陥観察方法及び欠陥観察装置 |
| US9401013B2 (en) * | 2012-02-03 | 2016-07-26 | Applied Materials Israel, Ltd. | Method of design-based defect classification and system thereof |
| EP2828882B1 (en) * | 2012-03-19 | 2019-09-18 | Kla-Tencor Corporation | Method, computer system and apparatus for recipe generation for automated inspection semiconductor devices |
| US8640060B2 (en) * | 2012-05-29 | 2014-01-28 | Applied Materials Israel, Ltd. | Method of generating a recipe for a manufacturing tool and system thereof |
| JP5783953B2 (ja) * | 2012-05-30 | 2015-09-24 | 株式会社日立ハイテクノロジーズ | パターン評価装置およびパターン評価方法 |
| SG11201604465VA (en) * | 2013-12-11 | 2016-07-28 | Fairchild Semiconductor | Integrated wire bonder and 3d measurement system with defect rejection |
| US9470559B2 (en) * | 2014-09-15 | 2016-10-18 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical linear measurement system and method |
| JP6244329B2 (ja) * | 2015-05-12 | 2017-12-06 | 東京エレクトロン株式会社 | 基板の検査方法、基板処理システム及びコンピュータ記憶媒体 |
| US10545490B2 (en) * | 2015-06-01 | 2020-01-28 | Applied Materials Israel Ltd. | Method of inspecting a specimen and system thereof |
| KR101876934B1 (ko) | 2016-05-10 | 2018-07-12 | 한미반도체 주식회사 | 비전 검사장치 |
| JP2020502645A (ja) * | 2016-12-09 | 2020-01-23 | イーオーエスエス インテリゲンテ オプティシェ ゼンゾーレン ウントゥ ジステーメ ゲゼルシャフト ミット ベシュレンクテル ハフツンク | 物体の識別方法および物体識別装置 |
| US10565702B2 (en) * | 2017-01-30 | 2020-02-18 | Dongfang Jingyuan Electron Limited | Dynamic updates for the inspection of integrated circuits |
| JP7245733B2 (ja) * | 2019-06-26 | 2023-03-24 | 株式会社日立ハイテク | ウェハ観察装置およびウェハ観察方法 |
| JP7285728B2 (ja) * | 2019-08-07 | 2023-06-02 | 株式会社日立ハイテク | 電気特性を導出するシステム及び非一時的コンピューター可読媒体 |
-
2022
- 2022-01-14 US US17/575,705 patent/US12118726B2/en active Active
- 2022-02-17 CN CN202280010210.1A patent/CN116868327A/zh active Pending
- 2022-02-17 JP JP2023542650A patent/JP2024505159A/ja active Pending
- 2022-02-17 WO PCT/US2022/012406 patent/WO2022155398A1/en not_active Ceased
- 2022-02-17 EP EP22740100.7A patent/EP4278377A4/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2024505159A (ja) | 2024-02-05 |
| EP4278377A4 (en) | 2025-02-19 |
| EP4278377A1 (en) | 2023-11-22 |
| US20220230314A1 (en) | 2022-07-21 |
| US12118726B2 (en) | 2024-10-15 |
| WO2022155398A1 (en) | 2022-07-21 |
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| PB01 | Publication | ||
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