JP2024505159A - ワイヤーボンディングおよびその他の電子部品パッケージング装置のためのインテリジェントパターン認識システムおよびそれに関連する方法 - Google Patents

ワイヤーボンディングおよびその他の電子部品パッケージング装置のためのインテリジェントパターン認識システムおよびそれに関連する方法 Download PDF

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JP2024505159A
JP2024505159A JP2023542650A JP2023542650A JP2024505159A JP 2024505159 A JP2024505159 A JP 2024505159A JP 2023542650 A JP2023542650 A JP 2023542650A JP 2023542650 A JP2023542650 A JP 2023542650A JP 2024505159 A JP2024505159 A JP 2024505159A
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pattern recognition
recipe
image acquisition
matching
parameters
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JPWO2022155398A5 (https=
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クラーナー、ピーター、ジュリアス
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クリック アンド ソッファ インダストリーズ、インク．
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0012—Biomedical image inspection
    • G06T7/0014—Biomedical image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/141—Control of illumination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V20/00—Scenes; Scene-specific elements
    • G06V20/60—Type of objects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30168—Image quality inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00—Indexing scheme relating to image or video recognition or understanding
    • G06V2201/06—Recognition of objects for industrial automation

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Multimedia (AREA)
  • Health & Medical Sciences (AREA)
  • Medical Informatics (AREA)
  • General Health & Medical Sciences (AREA)
  • Evolutionary Computation (AREA)
  • Databases & Information Systems (AREA)
  • Computing Systems (AREA)
  • Artificial Intelligence (AREA)
  • Software Systems (AREA)
  • Quality & Reliability (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Studio Devices (AREA)
JP2023542650A 2021-01-15 2022-02-17 ワイヤーボンディングおよびその他の電子部品パッケージング装置のためのインテリジェントパターン認識システムおよびそれに関連する方法 Pending JP2024505159A (ja)

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Application Number Priority Date Filing Date Title
US202163138377P 2021-01-15 2021-01-15
PCT/US2022/012406 WO2022155398A1 (en) 2021-01-15 2022-02-17 Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods

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JP2024505159A true JP2024505159A (ja) 2024-02-05
JP2024505159A5 JP2024505159A5 (https=) 2025-02-21
JPWO2022155398A5 JPWO2022155398A5 (https=) 2025-02-21

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US (1) US12118726B2 (https=)
EP (1) EP4278377A4 (https=)
JP (1) JP2024505159A (https=)
CN (1) CN116868327A (https=)
WO (1) WO2022155398A1 (https=)

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US12462375B2 (en) * 2022-08-05 2025-11-04 Tokyo Electron Limited Methods to automatically adjust one or more parameters of a camera system for optimal 3D reconstruction of features formed within/on a semiconductor substrate

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JPH0897241A (ja) * 1994-09-21 1996-04-12 Rohm Co Ltd リードボンディング位置の検出順位決定方法、およびその装置
JP2002064121A (ja) * 2000-08-16 2002-02-28 Kaijo Corp ボンディング装置
JP2006041006A (ja) * 2004-07-23 2006-02-09 Matsushita Electric Ind Co Ltd 半導体チップのボンディング方法及び装置
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EP4278377A4 (en) 2025-02-19
EP4278377A1 (en) 2023-11-22
CN116868327A (zh) 2023-10-10
US20220230314A1 (en) 2022-07-21
US12118726B2 (en) 2024-10-15
WO2022155398A1 (en) 2022-07-21

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