CN116868319A - 层叠体、树脂组合物、及半导体装置的制造方法 - Google Patents

层叠体、树脂组合物、及半导体装置的制造方法 Download PDF

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Publication number
CN116868319A
CN116868319A CN202280014325.8A CN202280014325A CN116868319A CN 116868319 A CN116868319 A CN 116868319A CN 202280014325 A CN202280014325 A CN 202280014325A CN 116868319 A CN116868319 A CN 116868319A
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resin film
resin
formula
substrate
laminate
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Chinese (zh)
Inventor
有本由香里
中嶋里沙乃
越野美加
荒木斉
富川真佐夫
藤原健典
青岛健太
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Toray Industries Inc
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Toray Industries Inc
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
CN202280014325.8A 2021-04-01 2022-03-23 层叠体、树脂组合物、及半导体装置的制造方法 Pending CN116868319A (zh)

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JP2021-062610 2021-04-01
JP2021062610 2021-04-01
PCT/JP2022/013454 WO2022210155A1 (ja) 2021-04-01 2022-03-23 積層体、樹脂組成物、および半導体装置の製造方法

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US (1) US20240186172A1 (https=)
EP (1) EP4316816A4 (https=)
JP (1) JP7806689B2 (https=)
KR (1) KR20230167345A (https=)
CN (1) CN116868319A (https=)
TW (1) TWI911422B (https=)
WO (1) WO2022210155A1 (https=)

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CN121079761A (zh) * 2023-04-26 2025-12-05 东丽株式会社 层叠体、层叠体的制造方法、半导体装置的制造方法
WO2025164353A1 (ja) * 2024-01-31 2025-08-07 東レ株式会社 積層体、樹脂組成物および半導体素子付き積層体ならびにそれらを用いた半導体装置の製造方法

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