JPWO2024225363A1 - - Google Patents
Info
- Publication number
- JPWO2024225363A1 JPWO2024225363A1 JP2024527679A JP2024527679A JPWO2024225363A1 JP WO2024225363 A1 JPWO2024225363 A1 JP WO2024225363A1 JP 2024527679 A JP2024527679 A JP 2024527679A JP 2024527679 A JP2024527679 A JP 2024527679A JP WO2024225363 A1 JPWO2024225363 A1 JP WO2024225363A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023072581 | 2023-04-26 | ||
| PCT/JP2024/016178 WO2024225363A1 (ja) | 2023-04-26 | 2024-04-24 | 積層体、積層体の製造方法、及び半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024225363A1 true JPWO2024225363A1 (https=) | 2024-10-31 |
Family
ID=93256590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024527679A Pending JPWO2024225363A1 (https=) | 2023-04-26 | 2024-04-24 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP4704142A1 (https=) |
| JP (1) | JPWO2024225363A1 (https=) |
| CN (1) | CN121079761A (https=) |
| TW (1) | TW202443636A (https=) |
| WO (1) | WO2024225363A1 (https=) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3039854B2 (ja) | 1990-11-30 | 2000-05-08 | 宇部興産株式会社 | 耐熱性樹脂接着剤シ−トおよび基板 |
| JP4304498B2 (ja) | 2004-10-08 | 2009-07-29 | 日本電信電話株式会社 | 半導体装置及び半導体モジュール |
| JP6275841B2 (ja) | 2013-12-27 | 2018-02-07 | インテル・コーポレーション | 非対称光導波路格子共振器及びｄｂｒレーザ |
| JP6258048B2 (ja) | 2014-01-28 | 2018-01-10 | 信越化学工業株式会社 | 有機変性シリコーン樹脂組成物 |
| EP3187559B1 (en) | 2014-08-08 | 2021-02-17 | Toray Industries, Inc. | Adhesive for temporary bonding, adhesive layer, method for manufacturing wafer work piece and semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition |
| JP2019172970A (ja) * | 2018-03-26 | 2019-10-10 | 東レ株式会社 | 表示デバイスまたは受光デバイスの基板用樹脂組成物、並びに、それを用いた表示デバイスまたは受光デバイスの基板、表示デバイス、受光デバイス、表示デバイスまたは受光デバイスの製造方法。 |
| JP7230398B2 (ja) * | 2018-09-26 | 2023-03-01 | 東レ株式会社 | 犠牲層用樹脂組成物、およびこれを用いた半導体電子部品の製造方法 |
| JP7145096B2 (ja) | 2019-02-12 | 2022-09-30 | 信越化学工業株式会社 | 微小構造体移載装置、スタンプヘッドユニット、微小構造体移載用スタンプ部品及び微小構造体集積部品の移載方法 |
| US20240186172A1 (en) * | 2021-04-01 | 2024-06-06 | Toray Industries, Inc. | Laminate, resin composition, and method for manufacturing semiconductor device |
| EP4316815A4 (en) * | 2021-04-01 | 2025-04-02 | Toray Industries, Inc. | Laminate and manufacturing method of semiconductor device |
| JP7744799B2 (ja) | 2021-11-12 | 2025-09-26 | キヤノン株式会社 | 撮像装置およびその制御方法、レンズ装置、像倍率補正用データ、画像処理装置および画像処理方法、ならびにアクセサリ装置 |
-
2024
- 2024-04-24 JP JP2024527679A patent/JPWO2024225363A1/ja active Pending
- 2024-04-24 CN CN202480027617.4A patent/CN121079761A/zh active Pending
- 2024-04-24 EP EP24797108.8A patent/EP4704142A1/en active Pending
- 2024-04-24 WO PCT/JP2024/016178 patent/WO2024225363A1/ja not_active Ceased
- 2024-04-25 TW TW113115503A patent/TW202443636A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP4704142A1 (en) | 2026-03-04 |
| WO2024225363A1 (ja) | 2024-10-31 |
| TW202443636A (zh) | 2024-11-01 |
| CN121079761A (zh) | 2025-12-05 |