CN121079761A - 层叠体、层叠体的制造方法、半导体装置的制造方法 - Google Patents

层叠体、层叠体的制造方法、半导体装置的制造方法

Info

Publication number
CN121079761A
CN121079761A CN202480027617.4A CN202480027617A CN121079761A CN 121079761 A CN121079761 A CN 121079761A CN 202480027617 A CN202480027617 A CN 202480027617A CN 121079761 A CN121079761 A CN 121079761A
Authority
CN
China
Prior art keywords
laminate
layer
laser
adhesive layer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480027617.4A
Other languages
English (en)
Chinese (zh)
Inventor
藤原健典
有本由香里
青岛健太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of CN121079761A publication Critical patent/CN121079761A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202480027617.4A 2023-04-26 2024-04-24 层叠体、层叠体的制造方法、半导体装置的制造方法 Pending CN121079761A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023072581 2023-04-26
JP2023-072581 2023-04-26
PCT/JP2024/016178 WO2024225363A1 (ja) 2023-04-26 2024-04-24 積層体、積層体の製造方法、及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN121079761A true CN121079761A (zh) 2025-12-05

Family

ID=93256590

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480027617.4A Pending CN121079761A (zh) 2023-04-26 2024-04-24 层叠体、层叠体的制造方法、半导体装置的制造方法

Country Status (5)

Country Link
EP (1) EP4704142A1 (https=)
JP (1) JPWO2024225363A1 (https=)
CN (1) CN121079761A (https=)
TW (1) TW202443636A (https=)
WO (1) WO2024225363A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3039854B2 (ja) 1990-11-30 2000-05-08 宇部興産株式会社 耐熱性樹脂接着剤シ−トおよび基板
JP4304498B2 (ja) 2004-10-08 2009-07-29 日本電信電話株式会社 半導体装置及び半導体モジュール
JP6275841B2 (ja) 2013-12-27 2018-02-07 インテル・コーポレーション 非対称光導波路格子共振器及びｄｂｒレーザ
JP6258048B2 (ja) 2014-01-28 2018-01-10 信越化学工業株式会社 有機変性シリコーン樹脂組成物
EP3187559B1 (en) 2014-08-08 2021-02-17 Toray Industries, Inc. Adhesive for temporary bonding, adhesive layer, method for manufacturing wafer work piece and semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition
JP2019172970A (ja) * 2018-03-26 2019-10-10 東レ株式会社 表示デバイスまたは受光デバイスの基板用樹脂組成物、並びに、それを用いた表示デバイスまたは受光デバイスの基板、表示デバイス、受光デバイス、表示デバイスまたは受光デバイスの製造方法。
JP7230398B2 (ja) * 2018-09-26 2023-03-01 東レ株式会社 犠牲層用樹脂組成物、およびこれを用いた半導体電子部品の製造方法
JP7145096B2 (ja) 2019-02-12 2022-09-30 信越化学工業株式会社 微小構造体移載装置、スタンプヘッドユニット、微小構造体移載用スタンプ部品及び微小構造体集積部品の移載方法
US20240186172A1 (en) * 2021-04-01 2024-06-06 Toray Industries, Inc. Laminate, resin composition, and method for manufacturing semiconductor device
EP4316815A4 (en) * 2021-04-01 2025-04-02 Toray Industries, Inc. Laminate and manufacturing method of semiconductor device
JP7744799B2 (ja) 2021-11-12 2025-09-26 キヤノン株式会社 撮像装置およびその制御方法、レンズ装置、像倍率補正用データ、画像処理装置および画像処理方法、ならびにアクセサリ装置

Also Published As

Publication number Publication date
EP4704142A1 (en) 2026-03-04
JPWO2024225363A1 (https=) 2024-10-31
WO2024225363A1 (ja) 2024-10-31
TW202443636A (zh) 2024-11-01

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