TWI911422B - 積層體、樹脂組成物、及半導體裝置的製造方法 - Google Patents

積層體、樹脂組成物、及半導體裝置的製造方法

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Publication number
TWI911422B
TWI911422B TW111112126A TW111112126A TWI911422B TW I911422 B TWI911422 B TW I911422B TW 111112126 A TW111112126 A TW 111112126A TW 111112126 A TW111112126 A TW 111112126A TW I911422 B TWI911422 B TW I911422B
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TW
Taiwan
Prior art keywords
resin film
laminate
formula
resin
substrate
Prior art date
Application number
TW111112126A
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English (en)
Chinese (zh)
Other versions
TW202239903A (zh
Inventor
有本由香里
中嶋里沙乃
越野美加
荒木斉
富川真佐夫
藤原健典
青島健太
Original Assignee
日商東麗股份有限公司
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    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
TW111112126A 2021-04-01 2022-03-30 積層體、樹脂組成物、及半導體裝置的製造方法 TWI911422B (zh)

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TWI911422B true TWI911422B (zh) 2026-01-11

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US (1) US20240186172A1 (https=)
EP (1) EP4316816A4 (https=)
JP (1) JP7806689B2 (https=)
KR (1) KR20230167345A (https=)
CN (1) CN116868319A (https=)
TW (1) TWI911422B (https=)
WO (1) WO2022210155A1 (https=)

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CN121079761A (zh) * 2023-04-26 2025-12-05 东丽株式会社 层叠体、层叠体的制造方法、半导体装置的制造方法
WO2025164353A1 (ja) * 2024-01-31 2025-08-07 東レ株式会社 積層体、樹脂組成物および半導体素子付き積層体ならびにそれらを用いた半導体装置の製造方法

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