CN116806107A - 半导体装置、显示装置、光电转换装置、电子设备、照明装置和移动体 - Google Patents

半导体装置、显示装置、光电转换装置、电子设备、照明装置和移动体 Download PDF

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Publication number
CN116806107A
CN116806107A CN202310277831.2A CN202310277831A CN116806107A CN 116806107 A CN116806107 A CN 116806107A CN 202310277831 A CN202310277831 A CN 202310277831A CN 116806107 A CN116806107 A CN 116806107A
Authority
CN
China
Prior art keywords
region
driving circuit
circuit chip
semiconductor device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310277831.2A
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English (en)
Chinese (zh)
Inventor
大重秀将
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN116806107A publication Critical patent/CN116806107A/zh
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60QARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/26Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
    • B60Q1/50Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating other intentions or conditions, e.g. request for waiting or overtaking
    • B60Q1/503Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating other intentions or conditions, e.g. request for waiting or overtaking using luminous text or symbol displays in or on the vehicle, e.g. static text
    • B60Q1/5035Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating other intentions or conditions, e.g. request for waiting or overtaking using luminous text or symbol displays in or on the vehicle, e.g. static text electronic displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14Light emitting diodes [LED]
    • F21S43/145Surface emitters, e.g. organic light emitting diodes [OLED]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14Light emitting diodes [LED]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/8794Arrangements for heating and cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN202310277831.2A 2022-03-24 2023-03-21 半导体装置、显示装置、光电转换装置、电子设备、照明装置和移动体 Pending CN116806107A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-048568 2022-03-24
JP2022048568A JP2023141960A (ja) 2022-03-24 2022-03-24 半導体装置、表示装置、光電変換装置、電子機器、照明装置、移動体

Publications (1)

Publication Number Publication Date
CN116806107A true CN116806107A (zh) 2023-09-26

Family

ID=88078865

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310277831.2A Pending CN116806107A (zh) 2022-03-24 2023-03-21 半导体装置、显示装置、光电转换装置、电子设备、照明装置和移动体

Country Status (3)

Country Link
US (1) US20230309361A1 (https=)
JP (1) JP2023141960A (https=)
CN (1) CN116806107A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023157731A (ja) 2022-04-15 2023-10-26 キヤノン株式会社 半導体装置、発光装置、表示装置、光電変換装置、電子機器、照明装置、および、移動体

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3180531B2 (ja) * 1993-09-20 2001-06-25 株式会社半導体エネルギー研究所 液晶表示装置
JP3381785B2 (ja) * 1999-06-09 2003-03-04 日本電気株式会社 液晶表示パネルおよびその製造方法
TWI352553B (en) * 2002-12-26 2011-11-11 Semiconductor Energy Lab Light emitting device and a method for manufacturi
JP4526771B2 (ja) * 2003-03-14 2010-08-18 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7764012B2 (en) * 2004-04-16 2010-07-27 Semiconductor Energy Laboratory Co., Ltd Light emitting device comprising reduced frame portion, manufacturing method with improve productivity thereof, and electronic apparatus
JP2006236745A (ja) * 2005-02-24 2006-09-07 Seiko Epson Corp 有機エレクトロルミネッセンス装置及びその製造方法、並びに電気機器及び光書き込みヘッド
JP4742624B2 (ja) * 2005-03-04 2011-08-10 セイコーエプソン株式会社 電気光学装置、その製造方法、画像印刷装置および画像読み取り装置
JP2010219948A (ja) * 2009-03-17 2010-09-30 Sharp Corp 表示パネルおよびその製造方法
JP2015099262A (ja) * 2013-11-19 2015-05-28 ソニー株式会社 固体撮像装置およびカメラモジュール、並びに電子機器
JP2018085353A (ja) * 2015-03-24 2018-05-31 ソニー株式会社 固体撮像装置、固体撮像装置の製造方法、及び、電子機器
KR102282687B1 (ko) * 2016-02-18 2021-07-28 닝보 써니 오포테크 코., 엘티디. 일체형 패키징 공정 기반 카메라 모듈, 그 일체형 기저 부품 및 그 제조 방법
JP7048573B2 (ja) * 2016-08-01 2022-04-07 ▲寧▼波舜宇光▲電▼信息有限公司 カメラモジュールおよびそのモールド回路基板組立体とモールド感光組立体並びに製造方法
JP7146376B2 (ja) * 2017-08-31 2022-10-04 ソニーセミコンダクタソリューションズ株式会社 撮像装置、および電子機器
JP7418077B2 (ja) * 2019-08-30 2024-01-19 キヤノン株式会社 半導体装置、表示装置、及び電子機器

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Publication number Publication date
US20230309361A1 (en) 2023-09-28
JP2023141960A (ja) 2023-10-05

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