JP2023141960A - 半導体装置、表示装置、光電変換装置、電子機器、照明装置、移動体 - Google Patents

半導体装置、表示装置、光電変換装置、電子機器、照明装置、移動体 Download PDF

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Publication number
JP2023141960A
JP2023141960A JP2022048568A JP2022048568A JP2023141960A JP 2023141960 A JP2023141960 A JP 2023141960A JP 2022048568 A JP2022048568 A JP 2022048568A JP 2022048568 A JP2022048568 A JP 2022048568A JP 2023141960 A JP2023141960 A JP 2023141960A
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JP
Japan
Prior art keywords
region
circuit chip
drive circuit
semiconductor device
resin layer
Prior art date
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Pending
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JP2022048568A
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English (en)
Japanese (ja)
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JP2023141960A5 (https=
Inventor
秀将 大重
Hidemasa Oshige
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2022048568A priority Critical patent/JP2023141960A/ja
Priority to US18/185,453 priority patent/US20230309361A1/en
Priority to CN202310277831.2A priority patent/CN116806107A/zh
Publication of JP2023141960A publication Critical patent/JP2023141960A/ja
Publication of JP2023141960A5 publication Critical patent/JP2023141960A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
    • B60Q1/50—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating other intentions or conditions, e.g. request for waiting or overtaking
    • B60Q1/503—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating other intentions or conditions, e.g. request for waiting or overtaking using luminous text or symbol displays in or on the vehicle, e.g. static text
    • B60Q1/5035—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating other intentions or conditions, e.g. request for waiting or overtaking using luminous text or symbol displays in or on the vehicle, e.g. static text electronic displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F21S43/145—Surface emitters, e.g. organic light emitting diodes [OLED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2022048568A 2022-03-24 2022-03-24 半導体装置、表示装置、光電変換装置、電子機器、照明装置、移動体 Pending JP2023141960A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022048568A JP2023141960A (ja) 2022-03-24 2022-03-24 半導体装置、表示装置、光電変換装置、電子機器、照明装置、移動体
US18/185,453 US20230309361A1 (en) 2022-03-24 2023-03-17 Semiconductor device, display device, photoelectric conversion device, electronic equipment, illuminating device, and mobile object
CN202310277831.2A CN116806107A (zh) 2022-03-24 2023-03-21 半导体装置、显示装置、光电转换装置、电子设备、照明装置和移动体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022048568A JP2023141960A (ja) 2022-03-24 2022-03-24 半導体装置、表示装置、光電変換装置、電子機器、照明装置、移動体

Publications (2)

Publication Number Publication Date
JP2023141960A true JP2023141960A (ja) 2023-10-05
JP2023141960A5 JP2023141960A5 (https=) 2025-03-24

Family

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Family Applications (1)

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JP2022048568A Pending JP2023141960A (ja) 2022-03-24 2022-03-24 半導体装置、表示装置、光電変換装置、電子機器、照明装置、移動体

Country Status (3)

Country Link
US (1) US20230309361A1 (https=)
JP (1) JP2023141960A (https=)
CN (1) CN116806107A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023157731A (ja) 2022-04-15 2023-10-26 キヤノン株式会社 半導体装置、発光装置、表示装置、光電変換装置、電子機器、照明装置、および、移動体

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0792475A (ja) * 1993-09-20 1995-04-07 Semiconductor Energy Lab Co Ltd 液晶表示装置
JP2000352717A (ja) * 1999-06-09 2000-12-19 Nec Corp 液晶表示パネルおよびその製造方法
JP2004281182A (ja) * 2003-03-14 2004-10-07 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP2006236745A (ja) * 2005-02-24 2006-09-07 Seiko Epson Corp 有機エレクトロルミネッセンス装置及びその製造方法、並びに電気機器及び光書き込みヘッド
JP2006244888A (ja) * 2005-03-04 2006-09-14 Seiko Epson Corp 電気光学装置、その製造方法、画像印刷装置および画像読み取り装置
JP2010219948A (ja) * 2009-03-17 2010-09-30 Sharp Corp 表示パネルおよびその製造方法
JP2013055062A (ja) * 2004-04-16 2013-03-21 Semiconductor Energy Lab Co Ltd 発光装置
JP2015099262A (ja) * 2013-11-19 2015-05-28 ソニー株式会社 固体撮像装置およびカメラモジュール、並びに電子機器
US20170155091A1 (en) * 2002-12-26 2017-06-01 Semiconductor Energy Laboratory Co., Ltd. Light Emitting Device and Method for Manufacturing the Same
JP2018085353A (ja) * 2015-03-24 2018-05-31 ソニー株式会社 固体撮像装置、固体撮像装置の製造方法、及び、電子機器
JP2019047237A (ja) * 2017-08-31 2019-03-22 ソニーセミコンダクタソリューションズ株式会社 撮像装置、および電子機器、並びに撮像装置の製造方法
JP2019509512A (ja) * 2016-02-18 2019-04-04 ニンボー サニー オプテック カンパニー，リミテッド 一体パッケージングプロセスベースのカメラモジュール、その一体ベース部品、およびその製造方法
JP2021039846A (ja) * 2019-08-30 2021-03-11 キヤノン株式会社 半導体装置、表示装置、及び電子機器
JP2021119601A (ja) * 2016-08-01 2021-08-12 ▲寧▼波舜宇光▲電▼信息有限公司 カメラモジュールおよびそのモールド回路基板組立体とモールド感光組立体並びに製造方法

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0792475A (ja) * 1993-09-20 1995-04-07 Semiconductor Energy Lab Co Ltd 液晶表示装置
JP2000352717A (ja) * 1999-06-09 2000-12-19 Nec Corp 液晶表示パネルおよびその製造方法
US20170155091A1 (en) * 2002-12-26 2017-06-01 Semiconductor Energy Laboratory Co., Ltd. Light Emitting Device and Method for Manufacturing the Same
JP2004281182A (ja) * 2003-03-14 2004-10-07 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP2013055062A (ja) * 2004-04-16 2013-03-21 Semiconductor Energy Lab Co Ltd 発光装置
JP2006236745A (ja) * 2005-02-24 2006-09-07 Seiko Epson Corp 有機エレクトロルミネッセンス装置及びその製造方法、並びに電気機器及び光書き込みヘッド
JP2006244888A (ja) * 2005-03-04 2006-09-14 Seiko Epson Corp 電気光学装置、その製造方法、画像印刷装置および画像読み取り装置
JP2010219948A (ja) * 2009-03-17 2010-09-30 Sharp Corp 表示パネルおよびその製造方法
JP2015099262A (ja) * 2013-11-19 2015-05-28 ソニー株式会社 固体撮像装置およびカメラモジュール、並びに電子機器
JP2018085353A (ja) * 2015-03-24 2018-05-31 ソニー株式会社 固体撮像装置、固体撮像装置の製造方法、及び、電子機器
JP2019509512A (ja) * 2016-02-18 2019-04-04 ニンボー サニー オプテック カンパニー，リミテッド 一体パッケージングプロセスベースのカメラモジュール、その一体ベース部品、およびその製造方法
JP2021119601A (ja) * 2016-08-01 2021-08-12 ▲寧▼波舜宇光▲電▼信息有限公司 カメラモジュールおよびそのモールド回路基板組立体とモールド感光組立体並びに製造方法
JP2019047237A (ja) * 2017-08-31 2019-03-22 ソニーセミコンダクタソリューションズ株式会社 撮像装置、および電子機器、並びに撮像装置の製造方法
JP2021039846A (ja) * 2019-08-30 2021-03-11 キヤノン株式会社 半導体装置、表示装置、及び電子機器

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Publication number Publication date
CN116806107A (zh) 2023-09-26
US20230309361A1 (en) 2023-09-28

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