CN116762040A - 层叠体的制造方法、电路配线的制造方法及转印膜 - Google Patents

层叠体的制造方法、电路配线的制造方法及转印膜 Download PDF

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Publication number
CN116762040A
CN116762040A CN202180085898.5A CN202180085898A CN116762040A CN 116762040 A CN116762040 A CN 116762040A CN 202180085898 A CN202180085898 A CN 202180085898A CN 116762040 A CN116762040 A CN 116762040A
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CN
China
Prior art keywords
photosensitive composition
composition layer
transfer film
layer
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180085898.5A
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English (en)
Chinese (zh)
Inventor
石坂壮二
松田知树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
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Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN116762040A publication Critical patent/CN116762040A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
CN202180085898.5A 2020-12-25 2021-12-17 层叠体的制造方法、电路配线的制造方法及转印膜 Pending CN116762040A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-217593 2020-12-25
JP2020217593 2020-12-25
PCT/JP2021/046746 WO2022138493A1 (ja) 2020-12-25 2021-12-17 積層体の製造方法、回路配線の製造方法、転写フィルム

Publications (1)

Publication Number Publication Date
CN116762040A true CN116762040A (zh) 2023-09-15

Family

ID=82157749

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180085898.5A Pending CN116762040A (zh) 2020-12-25 2021-12-17 层叠体的制造方法、电路配线的制造方法及转印膜

Country Status (4)

Country Link
JP (1) JPWO2022138493A1 (ja)
CN (1) CN116762040A (ja)
TW (1) TW202236008A (ja)
WO (1) WO2022138493A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002296776A (ja) * 2001-03-29 2002-10-09 Taiyo Ink Mfg Ltd プリント配線板用光硬化性・熱硬化性樹脂組成物及びプリント配線板
JP4979391B2 (ja) * 2007-01-17 2012-07-18 旭化成イーマテリアルズ株式会社 感光性樹脂積層体
JP6851009B2 (ja) * 2016-04-22 2021-03-31 パナソニックＩｐマネジメント株式会社 ソルダーレジスト用樹脂組成物、ソルダーレジスト用フィルム、ソルダーレジスト層付き回路基板及びパッケージ
WO2020054660A1 (ja) * 2018-09-12 2020-03-19 富士フイルム株式会社 感光性転写材料、回路配線の製造方法、タッチパネルの製造方法、樹脂パターンの製造方法、及びフィルム
JP7339111B2 (ja) * 2018-10-01 2023-09-05 旭化成株式会社 マイクロ流路デバイス用感光性樹脂積層体

Also Published As

Publication number Publication date
TW202236008A (zh) 2022-09-16
JPWO2022138493A1 (ja) 2022-06-30
WO2022138493A1 (ja) 2022-06-30

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