CN116685075A - Ccs集成母排用fpc模组装配工艺 - Google Patents

Ccs集成母排用fpc模组装配工艺 Download PDF

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CN116685075A
CN116685075A CN202310740123.8A CN202310740123A CN116685075A CN 116685075 A CN116685075 A CN 116685075A CN 202310740123 A CN202310740123 A CN 202310740123A CN 116685075 A CN116685075 A CN 116685075A
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automatic
station
fpc module
circuit board
module assembly
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董晨辉
张小雷
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Kunshan Jinghui Intelligent Equipment Co ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015Orientation; Alignment; Positioning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069Holders for printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • H05K13/0465Surface mounting by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • H05K13/0469Surface mounting by applying a glue or viscous material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813Controlling of single components prior to mounting, e.g. orientation, component geometry
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815Controlling of component placement on the substrate during or after manufacturing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817Monitoring of soldering processes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/089Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0008Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

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Abstract

本发明CCS集成母排用FPC模组装配工艺,通过FPC模组装配生产线进行FPC模组的自动化装配,FPC模组装配生产线包括:柔性电路板自动上料工位、锡膏自动印刷工位、锡膏印刷质量自动化检测工位、贴片机自动上料工位、回炉焊自动焊接工位、冷却机自动制冷工位、X光自动检测工位、补强板自动贴设工位、补强板自动热压工位、自动烘烤加固工位、等离子自动清洗工位、整体式自动点胶工位、紫外线自动固化工位、胶片自动贴设工位、自动化视觉检测工位、以及自动下料工位;通过自动化的柔性电路板、自动贴片、集成式点胶、自动贴片上料、对应工位做业,形成短线程的、无需人工辅助的高效CCS集成母排用FPC模组自动化装配程式。

Description

CCS集成母排用FPC模组装配工艺
技术领域
本发明涉及自动化生产技术及自动化生产设备,具体的,是一种CCS集成母排用FPC模组装配工艺。
背景技术
FPC模组包括:吸塑板、柔性电路板、镍片、热敏电阻、连接器、补强板、胶片、胶体;
其中,吸塑板质地软,现阶段大多采用人工上件方式,劳动强度大、上件慢;胶片、补强板来料基材柔软、位置易偏差,现阶段采用用人工撕下、手工放置在柔性电路板上;FPC模组装配过程中,热压机压下,温度逐渐升高,补强板上的预涂的胶面恢复粘性,和电路板贴合。
现阶段的FPC模组,装配方式,需要配置人工进行辅助,更多的情况是FPC模组制备的多个工站为不连续做业的,即部分需要人工辅助的工段为单独使用的设备,通过人工辅助获得该工段的半成品后,进行人工转移该工段的半成品至下一工段的设备的上料,FPC模组装配的自动化程度低,FPC模组装配设备安置混乱,不利于企业优化生产场地的实施,同时人工辅助一定程度上增加企业的生产成本、生产效率、以及装配精度。
因此,有必要提供一种CCS集成母排用FPC模组装配工艺来解决上述问题。
发明内容
本发明的目的是提供一种CCS集成母排用FPC模组装配工艺。
技术方案如下:
一种CCS集成母排用FPC模组装配工艺,通过FPC模组装配生产线进行FPC模组的自动化装配,FPC模组装配生产线包括:柔性电路板自动上料工位、锡膏自动印刷工位、锡膏印刷质量自动化检测工位、贴片机自动上料工位、回炉焊自动焊接工位、冷却机自动制冷工位、X光自动检测工位、补强板自动贴设工位、补强板自动热压工位、自动烘烤加固工位、等离子自动清洗工位、整体式自动点胶工位、紫外线自动固化工位、胶片自动贴设工位、自动化视觉检测工位、以及自动下料工位;
通过自动化的柔性电路板、自动贴片、集成式点胶、自动贴片上料、对应工位做业,形成短线程的、无需人工辅助的高效CCS集成母排用FPC模组自动化装配程式。
进一步的,柔性电路板自动上料工位,柔性电路板板通过AGV小车运输到线体旁预定区域内,也可通过人工摆放在线体旁预定区域内,抓取机构把柔性电路板抓起放到线体的治具上。
进一步的,锡膏自动印刷工位,锡膏过预制漏孔印刷在柔性电路板上。
进一步的,锡膏印刷质量自动化检测工位,通过高清CDD相机对柔性电路板拍照,视觉系统判定印刷质量。
进一步的,贴片机自动上料工位,通过SMT贴片机实现对镍片、热敏电阻、连接器、补强板的自动上料。
进一步的,回炉焊自动焊接工位,通过预热区、恒温区、高温区、冷却区,高温把锡融化完成焊接后冷却固化。
进一步的,冷却机自动制冷工位,通过风扇对柔性电路板和治具降温。
进一步的,X光自动检测工位,通过X光对焊锡内部拍照成像,判别锡焊有无缺陷。
进一步的,补强板自动贴设工位,补强板预装在飞达上,自动上料,自动上料通过贴片机配合视觉识别系统实现,贴片头上设置有电加热机构,对应将补强片预贴的胶加热到粘合温度。
进一步的,补强板自动热压工位,通过热压板把胶的温度再度升高,并保压固化。
进一步的,自动烘烤加固工位,通过热风把胶的文档升高,并保温。
进一步的,等离子自动清洗工位,高温等离子清洗点胶表面的杂质。
进一步的,整体式自动点胶工位,集成了多个点胶胶嘴和点胶机,在一个工位完成点胶工作。
进一步的,紫外线自动固化工位,通过紫外线烘烤,让点的胶硬化。
进一步的,胶片自动贴设工位,通过SMT贴片机实现对胶片的自动上料。
进一步的,自动化视觉检测工位,通过相机对贴片拍照,判别位置是否准确。
进一步的,自动下料工位,下料模组把产品放置在下料AGV小车或托盘中。
与现有技术相比,本发明通过自动化的柔性电路板、自动贴片、集成式点胶、自动贴片上料、对应工位做业,形成短线程的、无需人工辅助的高效CCS集成母排用FPC模组自动化装配程式。
附图说明
图1是本发明的流程图。
具体实施方式
实施例:
本实施例展示一种CCS集成母排用FPC模组装配工艺,通过FPC模组装配生产线进行FPC模组的自动化装配,FPC模组装配生产线包括:柔性电路板自动上料工位、锡膏自动印刷工位、锡膏印刷质量自动化检测工位、贴片机自动上料工位、回炉焊自动焊接工位、冷却机自动制冷工位、X光自动检测工位、补强板自动贴设工位、补强板自动热压工位、自动烘烤加固工位、等离子自动清洗工位、整体式自动点胶工位、紫外线自动固化工位、胶片自动贴设工位、自动化视觉检测工位、以及自动下料工位;
通过自动化的柔性电路板、自动贴片、集成式点胶、自动贴片上料、对应工位做业,形成短线程的、无需人工辅助的高效CCS集成母排用FPC模组自动化装配程式。
其中:
柔性电路板自动上料工位,柔性电路板板通过AGV小车运输到线体旁预定区域内,也可通过人工摆放在线体旁预定区域内,抓取机构把柔性电路板抓起放到线体的治具上;用长型专用吸盘实现自动上料。用工业相机对来料和治具定位,伺服模驱动的抓放机构根据输入的位置偏差值,自动调整纠偏,把柔性电路板放到治具上准确的位置。
锡膏自动印刷工位,锡膏过预制漏孔印刷在柔性电路板上。
锡膏印刷质量自动化检测工位,通过高清CDD相机对柔性电路板拍照,视觉系统判定印刷质量。
贴片机自动上料工位,通过SMT贴片机实现对镍片、热敏电阻、连接器、补强板的自动上料。
回炉焊自动焊接工位,通过预热区、恒温区、高温区、冷却区,高温把锡融化完成焊接后冷却固化。
冷却机自动制冷工位,通过风扇对柔性电路板和治具降温。
X光自动检测工位,通过X光对焊锡内部拍照成像,判别锡焊有无缺陷。
补强板自动贴设工位,补强板预装在飞达上,自动上料,自动上料通过贴片机配合视觉识别系统实现,贴片头上设置有电加热机构,对应将补强片预贴的胶加热到粘合温度;使用飞达实现补强板自动上料,用工业相机对来料和治具定位,伺服模驱动的抓放机构根据输入的位置偏差值,自动调整纠偏,把补强板放到电路板上准确的位置。
补强板自动热压工位,通过热压板把胶的温度再度升高,并保压固化。
自动烘烤加固工位,通过热风把胶的文档升高,并保温。
等离子自动清洗工位,高温等离子清洗点胶表面的杂质。
整体式自动点胶工位,集成了多个点胶胶嘴和点胶机,在一个工位完成点胶工作;根据点胶位置布置胶嘴,通过伺服模组和机器人配合,覆盖电路板全区域点胶。
紫外线自动固化工位,通过紫外线烘烤,让点的胶硬化。
胶片自动贴设工位,通过SMT贴片机实现对胶片的自动上料。
自动化视觉检测工位,通过相机对贴片拍照,判别位置是否准确。
自动下料工位,下料模组把产品放置在下料AGV小车或托盘中。
具体可参照图1,流程为:
1)自动上柔性线路板;
2)自动印刷锡膏;
3)自动检测锡膏印刷质量;
4)贴片机上料;
5)回炉焊焊接;
6)冷却机质量;
7)X光检测;
8)贴补强板;
9)热压补强板;
10)烘烤加固;
11)等离子清洗;
12)整体式点胶;
13)紫外线固化;
14)自动贴胶片;
15)自动视觉检测;
16)自动下料;
每个步骤对应的工段,通过一体化输送治具,形成对应输送治具的上料、对应做业的整体对接式CCS集成母排用FPC模组装配生产线。
与现有技术相比,本发明通过自动化的柔性电路板、自动贴片、集成式点胶、自动贴片上料、对应工位做业,形成短线程的、无需人工辅助的高效CCS集成母排用FPC模组自动化装配程式。
以上所述的仅是本发明的一些实施方式。对于本领域的普通技术人员来说,在不脱离本发明创造构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。

Claims (5)

1.一种CCS集成母排用FPC模组装配工艺,其特征在于:通过FPC模组装配生产线进行FPC模组的自动化装配,FPC模组装配生产线包括:柔性电路板自动上料工位、锡膏自动印刷工位、锡膏印刷质量自动化检测工位、贴片机自动上料工位、回炉焊自动焊接工位、冷却机自动制冷工位、X光自动检测工位、补强板自动贴设工位、补强板自动热压工位、自动烘烤加固工位、等离子自动清洗工位、整体式自动点胶工位、紫外线自动固化工位、胶片自动贴设工位、自动化视觉检测工位、以及自动下料工位;
通过自动化的柔性电路板、自动贴片、集成式点胶、自动贴片上料、对应工位做业,形成短线程的、无需人工辅助的高效CCS集成母排用FPC模组自动化装配程式。
2.根据权利要求1所述的CCS集成母排用FPC模组装配工艺,其特征在于:柔性电路板自动上料工位,用长型专用吸盘实现自动上料;使用工业相机对来料和治具定位,伺服模驱动的抓放机构根据输入的位置偏差值,自动调整纠偏,把柔性电路板放到治具上准确的位置。
3.根据权利要求2所述的CCS集成母排用FPC模组装配工艺,其特征在于:贴补强板工位,使用飞达实现补强板自动上料,用工业相机对来料和治具定位,伺服模驱动的抓放机构根据输入的位置偏差值,自动调整纠偏,把补强板放到柔性电路板上准确的位置。
4.根据权利要求3所述的CCS集成母排用FPC模组装配工艺,其特征在于:整体式点胶工位,根据点胶位置布置胶嘴,通过伺服模组和机器人配合,覆盖电路板全区域点胶。
5.根据权利要求4所述的CCS集成母排用FPC模组装配工艺,其特征在于:自动下料工位,伺服模组可准确抓取产品,放入AGV或托盘中。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117812846A (zh) * 2024-03-01 2024-04-02 深圳特新界面科技有限公司 一种环保柔性电路制造方法及系统
CN117812846B (zh) * 2024-03-01 2024-05-07 深圳特新界面科技有限公司 一种环保柔性电路制造方法及系统

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