CN116670593A - 层叠体的制造方法、电路配线的制造方法、转印膜 - Google Patents

层叠体的制造方法、电路配线的制造方法、转印膜 Download PDF

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Publication number
CN116670593A
CN116670593A CN202180085907.0A CN202180085907A CN116670593A CN 116670593 A CN116670593 A CN 116670593A CN 202180085907 A CN202180085907 A CN 202180085907A CN 116670593 A CN116670593 A CN 116670593A
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CN
China
Prior art keywords
photosensitive composition
composition layer
transfer film
layer
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180085907.0A
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English (en)
Chinese (zh)
Inventor
松田知树
石坂壮二
有冈大辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN116670593A publication Critical patent/CN116670593A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
CN202180085907.0A 2020-12-25 2021-12-08 层叠体的制造方法、电路配线的制造方法、转印膜 Pending CN116670593A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-217703 2020-12-25
JP2020217703 2020-12-25
PCT/JP2021/045044 WO2022138154A1 (ja) 2020-12-25 2021-12-08 積層体の製造方法、回路配線の製造方法、転写フィルム

Publications (1)

Publication Number Publication Date
CN116670593A true CN116670593A (zh) 2023-08-29

Family

ID=82157690

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180085907.0A Pending CN116670593A (zh) 2020-12-25 2021-12-08 层叠体的制造方法、电路配线的制造方法、转印膜

Country Status (3)

Country Link
JP (1) JP7759347B2 (https=)
CN (1) CN116670593A (https=)
WO (1) WO2022138154A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4979391B2 (ja) * 2007-01-17 2012-07-18 旭化成イーマテリアルズ株式会社 感光性樹脂積層体
JP2009069589A (ja) * 2007-09-14 2009-04-02 Fujifilm Corp 画像形成方法
KR101328840B1 (ko) * 2009-03-30 2013-11-13 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물 및 그 적층체
JP6789193B2 (ja) * 2017-08-09 2020-11-25 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板
JP7067045B2 (ja) * 2017-12-13 2022-05-16 昭和電工マテリアルズ株式会社 半導体用感光性樹脂組成物及び半導体装置の製造方法
WO2019244898A1 (ja) * 2018-06-22 2019-12-26 旭化成株式会社 感光性樹脂組成物およびレジストパターンの形成方法

Also Published As

Publication number Publication date
WO2022138154A1 (ja) 2022-06-30
JPWO2022138154A1 (https=) 2022-06-30
JP7759347B2 (ja) 2025-10-23

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