JP7759347B2 - 積層体の製造方法、回路配線の製造方法、転写フィルム - Google Patents

積層体の製造方法、回路配線の製造方法、転写フィルム

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Publication number
JP7759347B2
JP7759347B2 JP2022572099A JP2022572099A JP7759347B2 JP 7759347 B2 JP7759347 B2 JP 7759347B2 JP 2022572099 A JP2022572099 A JP 2022572099A JP 2022572099 A JP2022572099 A JP 2022572099A JP 7759347 B2 JP7759347 B2 JP 7759347B2
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JP
Japan
Prior art keywords
photosensitive composition
composition layer
intermediate layer
transfer film
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022572099A
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English (en)
Japanese (ja)
Other versions
JPWO2022138154A1 (https=
JPWO2022138154A5 (https=
Inventor
知樹 松田
壮二 石坂
大輔 有岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of JPWO2022138154A1 publication Critical patent/JPWO2022138154A1/ja
Publication of JPWO2022138154A5 publication Critical patent/JPWO2022138154A5/ja
Application granted granted Critical
Publication of JP7759347B2 publication Critical patent/JP7759347B2/ja
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
JP2022572099A 2020-12-25 2021-12-08 積層体の製造方法、回路配線の製造方法、転写フィルム Active JP7759347B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020217703 2020-12-25
JP2020217703 2020-12-25
PCT/JP2021/045044 WO2022138154A1 (ja) 2020-12-25 2021-12-08 積層体の製造方法、回路配線の製造方法、転写フィルム

Publications (3)

Publication Number Publication Date
JPWO2022138154A1 JPWO2022138154A1 (https=) 2022-06-30
JPWO2022138154A5 JPWO2022138154A5 (https=) 2023-09-15
JP7759347B2 true JP7759347B2 (ja) 2025-10-23

Family

ID=82157690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022572099A Active JP7759347B2 (ja) 2020-12-25 2021-12-08 積層体の製造方法、回路配線の製造方法、転写フィルム

Country Status (3)

Country Link
JP (1) JP7759347B2 (https=)
CN (1) CN116670593A (https=)
WO (1) WO2022138154A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008175957A (ja) 2007-01-17 2008-07-31 Asahi Kasei Electronics Co Ltd 感光性樹脂積層体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009069589A (ja) * 2007-09-14 2009-04-02 Fujifilm Corp 画像形成方法
KR101328840B1 (ko) * 2009-03-30 2013-11-13 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물 및 그 적층체
JP6789193B2 (ja) * 2017-08-09 2020-11-25 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板
JP7067045B2 (ja) * 2017-12-13 2022-05-16 昭和電工マテリアルズ株式会社 半導体用感光性樹脂組成物及び半導体装置の製造方法
WO2019244898A1 (ja) * 2018-06-22 2019-12-26 旭化成株式会社 感光性樹脂組成物およびレジストパターンの形成方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008175957A (ja) 2007-01-17 2008-07-31 Asahi Kasei Electronics Co Ltd 感光性樹脂積層体

Also Published As

Publication number Publication date
WO2022138154A1 (ja) 2022-06-30
JPWO2022138154A1 (https=) 2022-06-30
CN116670593A (zh) 2023-08-29

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