CN116670336A - 粗糙化处理铜箔、覆铜层叠板以及印刷布线板 - Google Patents

粗糙化处理铜箔、覆铜层叠板以及印刷布线板 Download PDF

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Publication number
CN116670336A
CN116670336A CN202180079134.5A CN202180079134A CN116670336A CN 116670336 A CN116670336 A CN 116670336A CN 202180079134 A CN202180079134 A CN 202180079134A CN 116670336 A CN116670336 A CN 116670336A
Authority
CN
China
Prior art keywords
roughened
copper foil
copper
treatment
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180079134.5A
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English (en)
Chinese (zh)
Inventor
片平周介
筱崎淳
笠原正靖
佐野惇郎
高泽亮二
中崎竜介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of CN116670336A publication Critical patent/CN116670336A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
CN202180079134.5A 2020-11-27 2021-11-15 粗糙化处理铜箔、覆铜层叠板以及印刷布线板 Pending CN116670336A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020197026A JP7051988B1 (ja) 2020-11-27 2020-11-27 粗化処理銅箔、銅張積層板、及びプリント配線板
JP2020-197026 2020-11-27
PCT/JP2021/041954 WO2022113806A1 (ja) 2020-11-27 2021-11-15 粗化処理銅箔、銅張積層板、及びプリント配線板

Publications (1)

Publication Number Publication Date
CN116670336A true CN116670336A (zh) 2023-08-29

Family

ID=81259504

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180079134.5A Pending CN116670336A (zh) 2020-11-27 2021-11-15 粗糙化处理铜箔、覆铜层叠板以及印刷布线板

Country Status (4)

Country Link
JP (1) JP7051988B1 (ja)
KR (1) KR20230112638A (ja)
CN (1) CN116670336A (ja)
WO (1) WO2022113806A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023181627A1 (ja) * 2022-03-22 2023-09-28 三井化学株式会社 構造体、構造体の製造方法及び接合体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6774785B2 (ja) * 2016-05-19 2020-10-28 Ｓｈプレシジョン株式会社 リードフレームおよびリードフレームの製造方法
WO2018110579A1 (ja) 2016-12-14 2018-06-21 古河電気工業株式会社 表面処理銅箔および銅張積層板
TWI619852B (zh) * 2017-02-24 2018-04-01 南亞塑膠工業股份有限公司 具近似橄欖球狀銅瘤的電解銅箔與線路板組件的製造方法
WO2018198905A1 (ja) 2017-04-25 2018-11-01 古河電気工業株式会社 表面処理銅箔
JP6430092B1 (ja) * 2017-05-19 2018-11-28 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
CN111886367B (zh) * 2018-03-27 2023-05-16 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
CN112424399B (zh) * 2018-08-10 2023-07-25 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板

Also Published As

Publication number Publication date
WO2022113806A1 (ja) 2022-06-02
TW202221169A (zh) 2022-06-01
KR20230112638A (ko) 2023-07-27
JP7051988B1 (ja) 2022-04-11
JP2022085378A (ja) 2022-06-08

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