CN116656240A - 一种基于环氧丙烯酸酯缩合烯基硅树脂所制备的光固化涂料及涂层 - Google Patents
一种基于环氧丙烯酸酯缩合烯基硅树脂所制备的光固化涂料及涂层 Download PDFInfo
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- CN116656240A CN116656240A CN202310668986.9A CN202310668986A CN116656240A CN 116656240 A CN116656240 A CN 116656240A CN 202310668986 A CN202310668986 A CN 202310668986A CN 116656240 A CN116656240 A CN 116656240A
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- Prior art keywords
- alkenyl
- coating
- silane
- alkyl
- epoxy acrylate
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- 238000000576 coating method Methods 0.000 title claims abstract description 135
- 239000011248 coating agent Substances 0.000 title claims abstract description 127
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 title claims abstract description 79
- 125000003342 alkenyl group Chemical group 0.000 title claims abstract description 66
- 238000000016 photochemical curing Methods 0.000 title claims abstract description 54
- 229920002050 silicone resin Polymers 0.000 title claims abstract description 49
- -1 alkenyl silicon Chemical compound 0.000 claims abstract description 72
- 229910000077 silane Inorganic materials 0.000 claims abstract description 61
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000003085 diluting agent Substances 0.000 claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 32
- 125000004103 aminoalkyl group Chemical group 0.000 claims abstract description 21
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 11
- 239000012949 free radical photoinitiator Substances 0.000 claims abstract description 10
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 10
- 239000010703 silicon Substances 0.000 claims abstract description 10
- 230000003301 hydrolyzing effect Effects 0.000 claims abstract description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 24
- 239000003822 epoxy resin Substances 0.000 claims description 19
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 238000003756 stirring Methods 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 15
- 238000006068 polycondensation reaction Methods 0.000 claims description 15
- 238000001723 curing Methods 0.000 claims description 14
- 125000005376 alkyl siloxane group Chemical group 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 239000003054 catalyst Substances 0.000 claims description 11
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 11
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 9
- 239000008186 active pharmaceutical agent Substances 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 6
- 125000005055 alkyl alkoxy group Chemical group 0.000 claims description 6
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 6
- 238000006116 polymerization reaction Methods 0.000 claims description 6
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 6
- 229920002554 vinyl polymer Polymers 0.000 claims description 6
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 claims description 4
- GCYHRYNSUGLLMA-UHFFFAOYSA-N 2-prop-2-enoxyethanol Chemical compound OCCOCC=C GCYHRYNSUGLLMA-UHFFFAOYSA-N 0.000 claims description 4
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 4
- 238000009835 boiling Methods 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims description 4
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims description 4
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 3
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims description 3
- 229910001868 water Inorganic materials 0.000 claims description 3
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 claims description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims description 2
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 claims description 2
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 claims description 2
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 claims description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 2
- 244000028419 Styrax benzoin Species 0.000 claims description 2
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 2
- 229960002130 benzoin Drugs 0.000 claims description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims description 2
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 2
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 claims description 2
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 claims description 2
- MNFGEHQPOWJJBH-UHFFFAOYSA-N diethoxy-methyl-phenylsilane Chemical compound CCO[Si](C)(OCC)C1=CC=CC=C1 MNFGEHQPOWJJBH-UHFFFAOYSA-N 0.000 claims description 2
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 claims description 2
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 claims description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 claims description 2
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 claims description 2
- 235000019382 gum benzoic Nutrition 0.000 claims description 2
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 claims description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 claims 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 claims 1
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 claims 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 claims 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 claims 1
- UDWIZRDPCQAYRF-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C=C UDWIZRDPCQAYRF-UHFFFAOYSA-N 0.000 claims 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 claims 1
- MCDBEBOBROAQSH-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C=C MCDBEBOBROAQSH-UHFFFAOYSA-N 0.000 claims 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 claims 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 claims 1
- 239000002202 Polyethylene glycol Substances 0.000 claims 1
- 150000005840 aryl radicals Chemical class 0.000 claims 1
- 125000004386 diacrylate group Chemical group 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 150000003839 salts Chemical class 0.000 abstract description 15
- 239000013638 trimer Substances 0.000 abstract description 11
- 229920002396 Polyurea Polymers 0.000 abstract description 10
- 239000000853 adhesive Substances 0.000 abstract description 9
- 230000001070 adhesive effect Effects 0.000 abstract description 9
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 abstract description 2
- 230000032683 aging Effects 0.000 description 14
- 239000007921 spray Substances 0.000 description 14
- 238000005507 spraying Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 238000006460 hydrolysis reaction Methods 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- 238000005303 weighing Methods 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000002270 dispersing agent Substances 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 238000011056 performance test Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000009736 wetting Methods 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000007062 hydrolysis Effects 0.000 description 5
- 239000005028 tinplate Substances 0.000 description 5
- 230000005856 abnormality Effects 0.000 description 4
- 230000003373 anti-fouling effect Effects 0.000 description 4
- 239000010881 fly ash Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 229910014033 C-OH Inorganic materials 0.000 description 3
- 229910014570 C—OH Inorganic materials 0.000 description 3
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000001343 alkyl silanes Chemical class 0.000 description 3
- 125000005021 aminoalkenyl group Chemical group 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 2
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 2
- OPLCSTZDXXUYDU-UHFFFAOYSA-N 2,4-dimethyl-6-tert-butylphenol Chemical compound CC1=CC(C)=C(O)C(C(C)(C)C)=C1 OPLCSTZDXXUYDU-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical group COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229910008051 Si-OH Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910006358 Si—OH Inorganic materials 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 150000002902 organometallic compounds Chemical group 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000012085 test solution Substances 0.000 description 2
- 150000003673 urethanes Chemical class 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- YFVKHKCZBSGZPE-UHFFFAOYSA-N 1-(1,3-benzodioxol-5-yl)-2-(propylamino)propan-1-one Chemical compound CCCNC(C)C(=O)C1=CC=C2OCOC2=C1 YFVKHKCZBSGZPE-UHFFFAOYSA-N 0.000 description 1
- KUFFULVDNCHOFZ-UHFFFAOYSA-N 2,4-xylenol Chemical compound CC1=CC=C(O)C(C)=C1 KUFFULVDNCHOFZ-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- JXNGSNLOFNAVJI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]-n,n-dimethylpropan-1-amine Chemical compound CO[Si](C)(OC)CCCN(C)C JXNGSNLOFNAVJI-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- 238000010146 3D printing Methods 0.000 description 1
- MNVMYTVDDOXZLS-UHFFFAOYSA-N 4-methoxyguaiacol Natural products COC1=CC=C(O)C(OC)=C1 MNVMYTVDDOXZLS-UHFFFAOYSA-N 0.000 description 1
- OEOIWYCWCDBOPA-UHFFFAOYSA-N 6-methyl-heptanoic acid Chemical compound CC(C)CCCCC(O)=O OEOIWYCWCDBOPA-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/10—Block or graft copolymers containing polysiloxane sequences
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Abstract
本发明公开了一种基于环氧丙烯酸酯缩合烯基硅树脂所制备的光固化涂料与涂层的方法。所述的光固化涂料含有环氧丙烯酸酯缩合烯基硅树脂EAPSi、烯基活性稀释剂DS1和烯基活性稀释剂DS2及纳米增硬补强组分、自由基光引发剂。所述的光固化环氧丙烯酸酯缩合烯基硅树脂,系由氨烃基烷氧基硅烷、烃基烷氧基硅烷、烯基烷氧基硅烷与环氧丙烯酸酯树脂水解共缩聚而得,所述的烯基活性稀释剂DS1为结构中含有2‑3个烯基改性氨基甲酸酯基的聚脲三聚体。本发明的光固化涂料,在紫外光照条件下不仅能快速固化成型,且用该涂料制得的光固化涂层还可兼有良好的附着力、柔韧性、硬度及耐高低温、耐盐雾等性能。
Description
技术领域
本发明属于改性硅树脂涂料与涂层领域,具体地说,涉及一种基于环氧丙烯酸酯缩合烯基硅树脂所制备的光固化涂料与涂层的方法及应用。
背景技术
众所周知,光固化涂料不仅固化速度快、清洁高效、低污染或无污染,且在快速成型、功能涂层、3D打印、电子元器件的封装与灌封等方面有广泛应用。
而文献检索可见,目前光固化涂料所用的树脂主要为基于2-6官能的聚氨酯丙烯酸酯、(改性)环氧丙烯酸酯、结构中含(甲基)丙烯酰氧丙基[又名(甲基)丙烯酸酯基]改性有机(氟)硅树脂等所配制的涂料(可见专利文献CN105778103A,CN111607321A,CN104177991A等),如CN105419634就曾将甲基丙烯酰氧丙基三甲氧基硅烷(KH-570)和羟基硅油先缩聚制成光固化有机聚硅氧烷(组分1),再将甲基丙烯酸酯基三甲氧基硅烷(KH-570)与二甲基二烷氧基硅烷、环氧基硅烷及封头剂六甲基二硅氧烷等水解共缩聚制成环氧基/丙烯酸酯基改性光固化有机硅树脂(组分2),然后再将组分1和组分2与光固化助剂、色浆、光引发剂等复合制成UV光固化硅涂料,据称,这种涂料环保无污染、可快速实现光固化;而CN113402976将甲基丙烯酰氧丙基三甲氧基硅烷(KH-570)与含硼硅氧烷树脂及四苯基二甲基二硅烷反应先合成硼杂丙烯酸酯基苯基硅树脂,然后与光引发剂、有机溶剂等复合制成涂料,再经UV曝光固化则可获得高透、高雾、防眩光薄膜。但研究者发现,基于光固化硅树脂所制备的涂层,虽疏水、防尘、耐盐雾、耐高低温性能优异,但涂层附着力差,亟待改进。
用粘附性环氧树脂改性有机硅树脂,可增加涂层的附着力,并能使目标树脂兼具有机硅树脂与环氧树脂二者的性能优势,如CN109851759、CN 106349460等曾将双酚A环氧树脂与由γ-氯丙基甲基二烷氧基硅烷和苯基三烷氧基硅烷水解缩聚制成的有机硅中间体进行缩合,就曾制得了一类有机硅改性环氧树脂,据报道用该树脂与二氧化硅、氧化铝等复合制成的涂料与涂层,可表现出耐高温、抗酸腐或耐紫外老化、硬度高等应用效果,但这类树脂涂料无法在自由基光引发剂作用下用UV光进行固化。
另从文献可知,光固化环氧丙烯酸酯(EA)树脂,结构与性能类似于环氧树脂,具有粘附力强、耐化学腐蚀与耐盐雾性优异等特点,那么能否将EA树脂与光固化丙烯酸酯基硅树脂化学键合使之形成一种新型环氧丙烯酸酯缩合硅树脂并用于光固化涂料与涂层制备,既能解决硅树脂附着力差的问题,又能改善现有环氧树脂涂层质脆、耐老化性能较差、柔韧与防水防尘性能欠佳等问题,然而文献可见,目前尚未有关于此类光固化环氧丙烯酸酯缩合烯基硅树脂合成及基于该树脂所制备的光固化涂料与涂层等的研究报道。
发明内容
本发明目的在于公开一种基于环氧丙烯酸酯缩合烯基硅树脂所制备的光固化涂料与涂层的方法、以及该涂料在光固化功能涂层、灌封与封装材料等方面的应用。为此,本发明采取了如下技术方案:
基于光固化环氧丙烯酸酯缩合烯基硅树脂所制备的光固化涂料,其特征在于,按质量份,由100份光固化环氧丙烯酸酯缩合烯基硅树脂EAPSi、10-35份烯基活性稀释剂DS1和0-15份烯基活性稀释剂DS2及以EAPSi与DS1和DS2三者总质量计0-30%纳米增硬补强组分、0-2%润湿分散剂、以EAPSi与DS1和DS2总质量计1-5%的自由基光引发剂所组成。
所述的环氧丙烯酸酯缩合烯基硅树脂,结构如式(1)所示,式中M=CH3或H,
PSi1、PSi2、PSi3为含氨烃基与烯基的硅树脂链段——即为氨烃基烷氧基硅烷(简称为氨烃基硅烷)、烃基烷氧基硅烷(简称为烃基硅烷)或烃基硅氧烷低聚体、烯基烷氧基硅烷(简称为烯基硅烷)的缩聚产物;其中,氨烃基为γ-氨丙基、N-环己基-γ-氨丙基、N,N-二甲基-γ-氨丙基-γ-氨丙基、哌嗪基丙基中的一种,烃基为C1-18烷基、环烷基或芳烃基等中的一种或2-3种。所述的烯基为丙烯酰氧丙基、甲基丙烯酰氧丙基中任意一种或为前两者中一种与乙烯基的混合基团;所述的烃基硅氧烷低聚体为聚合度<10、分子中含硅羟基或硅烷氧基且含烃基硅氧烷链节而结构呈线性、环状、树枝状或半封闭笼状的硅氧烷低聚物,所述的烃基定义同前文。
所述的环氧丙烯酸酯缩合烯基硅树脂(EAPSi),由下列步骤制得:
(1)环氧丙烯酸酯(EA)树脂的合成
取(甲基)丙烯酸(AA)与环氧树脂(ER)按量比为AA:ER=2-2.5:1(mol/mol)在80-90℃及三苯基膦催化剂、阻聚剂作用下反应数小时合成。
(2)光固化环氧丙烯酸酯缩合烯基硅树脂(EAPSi)的合成
按质量份,称取5-10份氨烃基烷氧基硅烷(APS,用作本实验硅烷初期水解反应的自催化剂)、60-85份烃基烷氧基硅烷或烃基硅氧烷低聚体、10-30份烯基烷氧基硅烷(VPS),搅拌混匀,得单体混合物D,然后再加入以D质量计约50-100%的溶剂S1、以D质量计30-100%的环氧丙烯酸酯(EA)树脂及与混合物D中硅烷的烷氧基等摩尔量的去离子水,搅拌、加热升温至40-80℃进行水解缩聚反应3-6h,然后再加入以D质量计1-2%的有机硅缩聚反应催化剂搅拌反应30-60min,再升温至80-120℃蒸馏回收溶剂、再减压脱除低沸物,得透明状粘稠液体,即为环氧丙烯酸酯缩合烯基硅树脂(EAPSi)。
所述的丙烯酸为丙烯酸或甲基丙烯酸;
所述的环氧树脂(ER)为分子两端连有两个环氧基的芳香族或脂环族环氧树脂,环氧值(以100g树脂所含环氧基的摩尔数表示)约为0.2~0.59,黏度约为1000~20000mPa·s,选取双酚A型环氧树脂、氢化双酚A型环氧树脂、双酚F型环氧树脂等中的一种;所述的阻聚剂为2,4-二甲基-6-叔丁基苯酚、2,4-二甲基苯酚等中的一种。
所述的环氧丙烯酸酯(EA)树脂,固含量约为100%、烯基含量(以100g树脂中所含丙烯酸酯基的摩尔数计)约为0.15-0.3,黏度约为500-25000mPa.s,系用(甲基)丙烯酸与环氧树脂按量比2-2.5:1在80-90℃反应直至体系的酸值降至≤2mg/g而得;对市场已有销售的EA树脂,也可直接从有关厂家订购。
所述的氨烃基烷氧基硅烷(APS,又名氨烃基硅烷),为结构中含有1个氨烃基且连有2~3个烷氧基的硅烷,在本反应中它既用作水解缩聚反应的单体、又用作硅烷水解反应的碱性自催化剂,选取γ-氨丙基三甲氧基硅烷、γ-氨丙基三乙氧基硅烷、N,N-二甲基-γ-氨丙基三甲氧基硅烷、N,N-二甲基-γ-氨丙基三甲氧基硅烷、正丁胺基丙基三甲氧基硅烷、N-环己基-γ-氨丙基三甲氧基硅烷、N-环己基-γ-氨丙基三乙氧基硅烷、N,N-二甲基-γ-氨丙基-γ-氨丙基三甲氧基硅烷、N,N-二甲基-γ-氨丙基-γ-氨丙基三乙氧基硅烷、哌嗪基丙基三甲氧硅烷、哌嗪基丙基三乙氧硅烷或γ-氨丙基甲基二甲氧基硅烷、γ-氨丙基甲基二乙氧基硅烷、N-环己基-γ-氨丙基甲基二甲氧基硅烷、N-环己基-γ-氨丙基甲基二乙氧基硅烷、N,N-二甲基-γ-氨丙基-γ-氨丙基甲基二甲氧基硅烷、N,N-二甲基-γ-氨丙基-γ-氨丙基甲基二乙氧基硅烷、哌嗪基丙基甲基二甲氧基硅烷、哌嗪基丙基甲基二乙氧基硅烷等中的一种或两种。
所述的烃基烷氧基硅烷(又名烃基硅烷),包括脂肪烃基烷氧基硅烷和芳烃基烷氧基硅烷两类,可单一组分或多种组分混合使用;所述的脂肪烃基烷氧基硅烷(又名脂肪烃基硅烷),为结构含有C1-18脂肪族烷基或/和环烷基、且含有2-3个烷氧基的硅烷,选取甲基三甲氧基硅烷、甲基三乙氧基硅烷、乙基三甲氧基硅烷、乙基三乙氧基硅烷、n-丙基三甲氧基硅烷、n-丙基三乙氧基硅烷、叔丁基三甲氧基硅烷、叔丁基三乙氧基硅烷、环戊基三甲氧基硅烷、环戊基三乙氧基硅烷、环己基三甲氧基硅烷、环己基三乙氧基硅烷、正辛基三甲氧基硅烷、正辛基三乙氧基硅烷、异辛基三甲氧基硅烷、异辛基三乙氧基硅烷、十二烷基三甲氧基硅烷、十二烷基三乙氧基硅烷或二甲基二甲氧基硅烷、二甲基二乙氧基硅烷、二乙基二甲氧基硅烷、二乙基二乙氧基硅烷、甲基正丙基二甲氧基硅烷、甲基正丙基二乙氧基硅烷、甲基叔丁基甲氧基硅烷、甲基叔丁基二乙氧基硅烷、甲基环己基二甲氧基硅烷、甲基环己基二乙氧基硅烷、甲基环戊基二甲氧基硅烷、甲基环戊基二乙氧基硅烷、甲基异辛基二甲氧基硅烷、甲基异辛基二乙氧基硅烷、甲基十二烷基二甲氧基硅烷、甲基十二烷基二乙氧基硅烷等中的一种或2-3种。
所述的芳烃基烷氧基硅烷(又名芳烃基硅烷),为结构含有1-2个苯基、且含有2-3个烷氧基的硅烷,选取苯基三甲氧基硅烷、苯基三乙氧基硅烷、二苯基二甲氧基硅烷、二苯基二乙氧基硅烷、甲基苯基二甲氧基硅烷、甲基苯基二乙氧基硅烷中的一种或两种。
所述的烯基烷氧基硅烷为结构中含有1个丙烯酰氧丙基或甲基丙烯酰氧丙基、乙烯基又同时含2-3个烷氧基的硅烷,包括γ-丙烯酰氧丙基烷氧基硅烷、γ-甲基丙烯酰氧丙基烷氧基硅烷、乙烯基烷氧基硅烷三类,可单一组分或前述两者中一种与乙烯基烷氧基硅烷拼混使用,选取γ-丙烯酰氧丙基三甲氧基硅烷、γ-丙烯酰氧丙基三乙氧基硅烷、γ-甲基丙烯酰氧丙基三甲氧基硅烷、γ-甲基丙烯酰氧丙基三乙氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、γ-丙烯酰氧丙基甲基二甲氧基硅烷、γ-丙烯酰氧丙基甲基二乙氧基硅烷、γ-甲基丙烯酰氧丙基甲基二甲氧基硅烷、γ-甲基丙烯酰氧丙基甲基二乙氧基硅烷、甲基乙烯基二甲氧基硅烷、甲基乙烯基二乙氧基硅烷中的一种或2种。
所述的烃基硅氧烷低聚体,为聚合度<10、分子中含硅羟基或硅烷氧基、且含烃基硅氧烷链节(即烷基硅氧烷链节和/或芳烃基硅氧烷链节)而结构呈线性、环状、树枝状或半封闭笼状的硅氧烷低聚物,选取环状1,3,5,7-四乙烯基-1,3,5,7-四苯基环四硅氧烷、羟基或烷氧基封端的烷基硅氧烷-co-二烷基硅氧烷、羟基或烷氧基封端的苯基硅氧烷-co-二苯基硅氧烷、或羟基或烷氧基封端的烷基硅氧烷-co-苯基硅氧烷、羟基或烷氧基封端的二烷基硅氧烷-co-苯基硅氧烷、羟基或烷氧基封端的二烷基硅氧烷-co-二苯基硅氧烷等低聚体中的一种,所述烷氧基为甲氧基或乙氧基、烷基为-CH3~-C18H37。
所述的溶剂S1为对氨烃基硅烷、烃基硅烷、烯基硅烷及环氧丙烯酸酯树脂等有良好互溶性的物质,选取甲苯、二甲苯、乙醇、异丙醇、叔丁醇、乙二醇二甲醚(GDM)、乙二醇二乙醚、丙二醇二甲醚(PDM)、乙二醇二乙醚,丙二醇甲醚醋酸酯(PMA)、丙二醇甲醚醋酸酯、醋酸乙酯(EAc)、醋酸丁酯(BA)等中的一种或由2-3种组成的混合物,优先选取芳烃-醇、芳烃-醇醚、芳烃-醇醚酯、酯-醇、醇醚-酯等组成的混合溶剂。
所述的有机硅缩聚反应催化剂为能催化C-OH与Si-OH之间缩聚反应的金属有机化合物和/或能催化C-OH或Si-OR之间缩聚反应的金属有机化合物,选自二月桂酸二丁基锡、二醋酸二丁基锡、异辛酸铋、二异辛酸锌等中的一种。
所述的烯基活性稀释剂DS1,结构如式(2)所示,为结构中含有3个烯基改性氨基甲酸酯基的聚脲三聚体,式(2)中B=CH2、CH2OCH2CH2、COOCH2CH2、COOCH2CH(CH3)等,既用作反应活性的稀释助剂又有增加附着力和调节涂层硬度的作用,系用三异氰酸酯低聚体TIC与羟基烯类化合物HOA按量比TDI:HOA=1:3-3.1反应制得,由陕西科技大学氟硅课题组提供或委托万华公司等生产厂家加工、订购。
所述的三异氰酸酯低聚体(TIC),选取六亚甲基二异氰酸酯三聚体如拜耳公司的N3390或万华公司生产的HT300等中的一种;所述的羟基烯类化合物为分子中既含羟基又含烯基的小分子化合物,选取烯丙醇、羟乙基烯丙基醚、丙烯酸羟乙酯、丙烯酸羟丙酯、甲基丙烯酸羟乙酯、甲基丙烯酸羟丙酯等中的一种。
所述的烯基活性稀释剂DS2,选取粘度小、流动性好、能与EAPSi互溶起稀释剂作用又能参自由基光引发剂引发的固化反应、且结构中含有1-2个烯基的丙烯酸酯类的小分子化合物,选取(聚)乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯、一缩二丙二醇二(甲基)丙烯酸酯、二缩三丙二醇二(甲基)丙烯酸酯、(甲基)丙烯酸环己酯、(甲基)丙烯酸异冰片酯等中的一种。
所述的纳米增硬补强组分,为不影响涂层透光性、与涂层组分互溶性好、又能增加有机涂层硬度或涂层强度的物质,选取笼状丙烯酰氧丙基七异丁基POSS(MA0701)、笼状甲基丙烯酰氧丙基七异丁基POSS(MA0702)、笼状甲基丙烯酰氧丙基七环己基POSS(MA0703)、笼状甲基丙烯酰氧丙基七乙基POSS(MA0716)、笼状甲基丙烯酰氧丙基七异辛基POSS(MA0718)、笼状八丙烯酰氧丙基POSS(MA0736)、笼状八甲基丙烯酰氧丙基POSS(MA0735)、甲基丙烯酰氧丙基七苯基POSS(MA0734)、苯基改性纳米硅溶胶、C1-18烷基改性纳米硅溶胶、MQ树脂、苯基改性MQ树脂等中的一种。
所述的润湿分散剂,为BYK公司生产的油溶性润湿分散剂ATU。
所述的光引发剂,为能吸收一定波长的紫外光而产生自由基、并能引发不饱和单体共聚反应的物质,选取2-羟基-2-甲基-1-苯基丙烷-1-酮(1173)、1-羟基环已基苯基酮、2-甲基-1-(4-甲硫基苯基)-2-吗啉基-1-丙酮(907)、安息香双甲醚(651)、2,4,6-(三甲基苯甲酰基)二苯基氧化膦(TPO)等中的一种或2种,优先选取由1173和TPO按质量比约为1:1等复合所获得的光引发剂。
所述的基于环氧丙烯酸酯缩合烯基硅树脂所制备的光固化涂料,步骤如下:按计量比,依次称取环氧丙烯酸酯缩合烯基硅树脂(EAPSi),再加入烯基活性稀释剂DS1和烯基活性稀释剂DS2,搅拌混匀,然后再加入纳米增硬补强组分和润湿分散剂,用转速为500-1000r/min的分散机搅拌分散20-30min,再加入自由基光引发剂搅匀后再减压脱泡4-6min,得均匀流体,即为本发明所制备的光固化涂料,记作UVES。
所述的基于环氧丙烯酸酯缩合烯基硅树脂所制备的光固化涂层,具体步骤为:取基于环氧丙烯酸酯缩合烯基硅树脂所制备的光固化涂料UVES,将UVES再均匀涂覆于待施工的洁净基材表面,先室温流平3-5min,然后再用功率约为1000W-2200W的UV光固化机固化2-4min,所得涂层试样,即为本发明所述的光固化涂层试样。
所述的基材,选取马口铁、铝合金、钢板、覆铜线路板、玻璃、陶瓷、聚碳酸酯(PC)板等中的一种;所述涂覆方式,选取喷涂、刷涂、旋涂、滚涂、丝棒涂布、浸渍等中的一种。
所述的基于光固化环氧丙烯酸酯缩合烯基硅树脂所制备的涂层,应用性能可按下列方法进行评价:透光率(T),用Cary 5000型紫外-可见分光光度计测定;疏水性,以水滴在涂层表面的静态接触角(θH2O)表示,用上海中晨数字有限公司的JC 2000C接触角测量仪测定,θH2O越大,表示涂层疏水性越好。涂层耐高低温性能:取涂层试样,在-40℃冰箱中放置30min,取出再置于80℃烘箱中放置30min,如此循环直至总时长约为240h(总计约为10天),观察涂层表面是否发生开裂、粉化、脱落等现象。耐盐雾性:取石蜡-松香(1:1,wt/wt)封边后的涂层作测试样,以5wt%NaCl水溶液作测试液,参照GB/T 10125-1997标准用耐盐雾试验机进行测定,扩蚀小于≤2mm即为耐盐雾。
本发明的有益效果:本发明利用(甲基)丙烯酸与(氢化)环氧树脂的开环反应先合成分子两端各连有反应性(甲基)丙烯酸酯基而结构中含碳羟基的环氧丙烯酸酯(EA)树脂中间体;然后,在中间体EA树脂存在下再将氨烃基烷氧基硅烷APS(用作硅烷碱性水解缩聚反应的自催化剂)、烃基烷氧基硅烷或烃基硅氧烷低聚体、烯基烷氧基硅烷水解缩聚使体系先产生氨基/烯基硅树脂低聚体,然后再利用金属有机催化剂作用下EA树脂中C-OH可与氨基/烯基硅树脂低聚体中Si-OH脱水成醚或与Si-OR脱醇成醚的特点,将中间体EA与氨烃基/烯基硅树脂低聚体进行缩聚键合,进而形成兼具环氧树脂与硅树脂多重性能特点——如良好粘附、疏水、耐老化等性能——的环氧丙烯酸酯缩合(-g-)烯基硅树脂(EAPSi),可明显改善现有硅树脂附着力差的缺陷,并提高现有环氧涂层的疏水、耐老化等性能。
然后,以EAPSi作光固化树脂,再将其与多官能烯基改性氨基甲酸酯基的聚脲三聚体的活性稀释剂DS1、纳米增硬补强组分及光引发剂等复合组配制成光固化涂料,应用表明:如此制得的涂料,不仅可在紫外光照射条件下实现快速室温固化,且如此获得的光固化涂层,还可兼有良好的附着力、理想的柔韧性与硬度、耐高低温、耐盐雾、耐老化等性能。
具体实施方式
下面结合实施例对本发明做进一步说明,但是本发明不局限于以下实施例。(一)环氧丙烯酸酯(EA)树脂的合成
在装有温度计、回流冷凝管、搅拌器的三颈瓶中,依次加入0.1mol环氧树脂、以环氧树脂质量计100%的甲苯溶剂、以环氧树脂质量计1%的三苯基膦催化剂、以环氧树脂质量计0.1%的2,4-二甲基-6-叔丁基苯酚阻聚剂以及0.2mol的(甲基)丙烯酸,搅拌混匀,加热至80℃进行反应直至体系的酸值降至≤2mg/g,然后,在P表为0.85MPa条件下减压蒸除溶剂并脱低沸,得粘稠透明液体,即为环氧丙烯酸酯树脂EA。各实施例合成EA所用的原料及用量一览表见表1。
表1环氧丙烯酸酯(EA)树脂的合成原料与用量一览表
*表1中EA-1:基于E51制得的双酚A环氧丙烯酸酯树脂;EA-2:基于HE44制得的氢化双酚A环氧甲基丙烯酸酯树脂;EA-3:基于F170制得的双酚F环氧丙烯酸酯树脂;EA-4:基于E44制得的双酚A环氧丙烯酸酯树脂。
(二)光固化环氧丙烯酸酯缩合烯基硅树脂(EAPSi)的合成
在装有回流冷凝管、温度计、搅拌器的500mL三口烧瓶中,按质量比依次称取10.0g水解自催化剂γ-氨烃基烷氧基硅烷、35.0g脂肪烃基烷氧基硅烷、30.0g芳烃基烷氧基硅烷、25.0gγ-(甲基)丙烯酰氧基丙基烷氧基硅烷,搅拌混匀,得总计100.0g单体混合物D,然后再加入以D质量计100%(约100.0g)的甲苯-乙醇(1:1,wt/wt)溶剂S1、以D质量计100%(约100.0g)环氧丙烯酸酯树脂EA及与混合物D中硅烷的烷氧基等摩尔量的去离子水,搅拌,加热升温至80℃进行水解缩聚反应3h,然后再加入以D质量计2%(约2.0g)二异辛酸锌搅拌反应60min,然后升温至120℃蒸馏回收溶剂并再在P表约0.85MPa条件下减压脱低沸,得透明状粘稠液体,即为光固化环氧丙烯酸酯缩合烯基硅树脂——[γ-氨丙基硅氧烷-co-脂肪烃基硅氧烷-co-芳烃基硅氧烷-co-γ-(甲基)丙烯酰氧基丙基硅氧烷]-g-环氧丙烯酸酯树脂,记作EAPSi,烯基含量(以100g树脂中所含丙烯酰氧基的摩尔数计)约为0.25左右。实施例1-4合成的EAPSi-1~4所用原材料与用量详见表2。
表2光固化环氧丙烯酸酯(EA)缩合烯基硅树脂的合成与原料用量
(三)活性稀释剂DS1——烯基改性氨基甲酸酯基的聚脲三聚体的合成
以烯丙基氧乙基氨基甲酸酯基聚脲三聚体为例。
在装有温度计、回流冷凝管(顶端配CaC12干燥管)、搅拌器的干燥三颈瓶中,加入0.3mol烯丙基羟乙基醚、30.6g甲苯溶剂,搅拌混匀,加热升温至80℃,然后在30-60min内再滴加入0.1mol、总计约52.0g含固量约为90%的多异氰酸酯N3390(拜耳公司),加料完毕继续保温反应2h,再蒸除溶剂得透明液体,即结构如式(2)所示、B=CH2OCH2CH2的活性稀释剂的DS1——烯丙基氧乙基氨基甲酸酯基聚脲三聚体。
同上,将烯丙基羟乙基醚用等摩尔量的烯丙醇、丙烯酸羟乙酯、甲基丙烯酸羟丙酯代替同法进行上述反应,所获得的结构如式(2)所示、B=CH2、COOCH2CH2、COOCH2CH(CH3)的活性稀释剂DS1——烯基改性氨基甲酸酯基的聚脲三聚体,分别用作后文实施例的活性稀释剂。
(四)实施例
实施例1
(1)基于环氧丙烯酸酯缩合硅树脂所制备的光固化涂料
按质量份,称取100.0g环氧丙烯酸酯缩合烯基硅树脂EAPSi-1、20.0g结构如式(2)所示、B=CH2OCH2CH2的烯丙基氧乙基改性氨基甲酸酯基的聚脲三聚体DS1[记作DS1-a]、15.0g一缩二丙二醇二丙烯酸酯活性稀释剂(DS2-a)、以(EAPSi-1+DS1-a+DS2-a)三者总质量计15%(约15.0g)、平均粒径约为20nm的苯基改性纳米硅溶胶和1.0g BKY-ATU润湿分散剂,用转速为1000r/min的分散机搅拌分散30min,然后再加入以(EAPSi-1+DS1-a+DS2-a)三者总质量计3%、约3.0g 1173/TPO(质量比1:1,wt/wt)复合光引发剂,搅拌混匀,在P表约0.06MPa条件下减压脱泡6min,得均匀流体,即基于EAPSi-1所制备的光固化涂料UVES-1。
(2)涂层制备与性能
取UVES-1,用口径约为1.2mm的喷枪将该涂料用均匀喷涂于洁净马口铁或玻璃基材表面,控制喷涂料以使干后涂层厚度控制为约25μm,先室温流平5min,然后再用功率为2200W的紫外光固化机固化2min,所得涂层试样即UVES-1涂层试样。在室温25℃、相对湿度RH=48%条件下养护48h后,UVES-1涂层性能测试如下:涂层透光率(T,用Cary 5000型紫外-可见分光光度计测定,下同)T=93%、附着力(参照HGT3792-2014标准用电动附着力试验机测定,下同)为0级,硬度(参照GB/T6739-1996用铅笔硬度进行评价,下同)为4H,耐盐雾性能(以5wt%NaCl水溶液作测试液参照GB/T 10125-1997标准测定,下同)×1100h涂层表面扩蚀≤2mm(即表示耐盐雾≥1100h),耐老化性能(85℃×RH85%,参照GB/T2423.24-1995标准用氙灯耐老化试验仪测定,下同)≥1000h涂层表面无异常,涂层表面水的接触角WCA=111.3°(用JC 2000C接触角测量仪测定,液滴大小5μL),涂层表面防污性(参照GB/T9780-1988方法用粉煤灰进行评价,0级为最好、5级最差):约1级。
以环氧丙烯酸树脂EA-1等质量代替EAPSi-1同(1)条件下制备光固化涂料,再同(2)步骤进行光固化,所得涂层试样用作本发明参比1,其性能测试结果:T=95%;附着力1级;硬度2H;耐盐雾性能×1000h,涂层表面扩蚀≤2mm;耐老化性能(85℃×RH85%)×800h,涂层局部表面粉化、色黄;WCA=70.3°。
另以实施例1不含双酚A环氧丙烯酸酯树脂EA-1(即EA-1用量为0)制备的氨基/烯基硅树脂作为光固化树脂组分,再加15%平均粒径约为20nm的苯基改性纳米硅溶胶、1.0gBKY-ATU润湿分散剂、3%1173/TPO(质量比1:1,wt/wt)复合光引发剂制备的涂料作为参比2,同法进行光固化,所得的涂层试样,性能测试结果为:T=91%;附着力2级;硬度3H;耐盐雾性能×1200h涂层表面扩蚀≤2mm;耐老化性能(85℃×RH85%)×1200h涂层表面无变化;WCA=117.5°。
与参比1比较可见,本发明基于EAPSi-1所制备的UVES-1,确有改善环氧丙烯酸酯涂层表面耐老化性能、增加防水性能的作用;而与参比2比较可见,UVES-1涂层附着力更好。
实施例2
(1)基于环氧丙烯酸酯缩合硅树脂所制备的光固化涂料
按质量份,称取100.0g环氧丙烯酸酯缩合烯基硅树脂EAPSi-2、10.0g结构如式(2)所示B=CH2的烯丙基改性氨基甲酸酯基聚脲三聚体[记作活性稀释剂DS1-2a]和15.0g丙二醇二丙烯酸酯(活性稀释剂DS2-2b),搅拌混匀,用转速为500r/min的分散机搅拌分散20min,然后,再加入以(EAPSi+DS1-2a+DS2-2b)三者总质量计1%、约1.25g的自由基光引发剂1173,在P表约0.06MPa条件下减压脱泡5min,得均匀流体,即基于EAPSi-2所制备的光固化涂料UVES-2。
(2)光固化涂层制备与性能
取UVES-2,用口径约为1.2mm的喷枪将涂料均匀喷涂于洁净马口铁或玻璃基材表面,控制喷涂量以使干后涂层的厚度约为20.0μm,先室温流平5min,然后用功率为2200W的紫外光固化机进行光固化2min,所得涂层试样即UVES-2试样。在室温25℃、相对湿度RH=48%条件下养护48h,UVES-2涂层性能测试结果为:涂层透光率T=98%;附着力1级;硬度3H;涂层耐盐雾×1200h,涂层表面扩蚀≤2mm;耐老化性能(85℃×RH85%)≥1000h涂层表面无异常;WCA=113.8°,涂层表面防污性(粉煤灰试验)约为1级。
实施例3
(1)基于环氧丙烯酸酯缩合硅树脂所制备的光固化涂料
按质量份,称取100.0g环氧丙烯酸酯缩合烯基硅树脂EAPSi-3、35.0g结构如式(2)所示B=COOCH2CH2的丙烯酰氧乙撑改性氨基甲酸酯基聚脲三聚体[记作活性稀释剂DS1-3a]及以EAPSi+DS1-3a总质量(135g)计10%(约13.5g)纳米增硬补强组分甲基丙烯酰氧丙基七苯基POSS,搅拌、加热使之溶解成透明状,用转速为1000r/min的分散机搅拌分散30min,然后再加入以EAPSi+DS1-3a总质量计约2.0%、约2.7g的1173/TPO(1:1,wt/wt)复合光引发剂,搅拌混匀,在P表约0.065MPa条件下减压脱泡4min,得均匀流体,即基于EAPSi-3所制备的光固化涂料UVES-3。
(2)光固化涂层制备与性能
取UVES-3,用口径约为1.2mm的喷枪将涂料用均匀喷涂于洁净马口铁或玻璃基材表面,控制喷涂量以使干后涂层的厚度约为22.7μm,先室温流平5min,然后用功率为2200W的紫外光固化机进行光固化4min,所得涂层试样即UVES-3试样。在室温25℃、相对湿度RH=48%条件下养护48h,UVES-3涂层性能测试结果如下:涂层透光率T=94%;附着力:1级;硬度:5H;耐盐雾性能×1200h,涂层表面扩蚀≤2mm;耐老化性能(85℃×RH85%)≥1200h涂层表面无异常;WCA=116.2°,涂层表面防污性(粉煤灰试验)约1级。
另将步骤(1)中的DS1-3a等质量换成单官能烯基活性稀释剂DS2——丙烯酸环己酯同法制备光固化涂层,结果发现:涂层在UV光作用下无法有效固化;
而将步骤(1)中DS1-3a等质量换成活性稀释剂DS2——己二醇二丙烯酸酯同法制备光固化涂料与涂层,用作本发明参比3,涂层性能测试结果如下:涂层透光率T=92%;附着力:2级;硬度:3H;耐盐雾性能×1200h,涂层表面扩蚀≤2mm;耐老化性能(85℃×RH85%)≥1200h涂层表面无异常;WCA=115.7°。
与本发明UVES-3比较可见,DS1-3a因结构与本发明涂层树脂组分相近故组分互溶性更好,且有增加涂层附着与硬度的作用。
实施例4
(1)基于环氧丙烯酸酯缩合硅树脂所制备的光固化涂料
按质量份,称取100.0g环氧丙烯酸酯缩合烯基硅树脂EAPSi-4、25.0g结构如式(2)所示B=COOCH(CH3)CH2的丙烯酰氧异丙撑改性氨基甲酸酯基聚脲三聚体[记作活性稀释剂DS1-4a]和10.0g新戊二醇二丙烯酸酯(活性稀释剂DS2-4b)及以(EAPSi+DS1-4a+DS2-4b)三者总质量计5%、约6.75g纳米增硬补强组分甲基丙烯酰氧丙基七异丁基POSS,搅拌、加热使之溶解成透明状,用转速为1000r/min的分散机搅拌分散25min,然后再加入以(EAPSi+DS1-4a+DS2-4b)三者总质量计3%、约4.05g的1173/TPO(1:1,wt/wt)光引发剂,搅拌混匀,在P表约0.06MPa条件下减压脱泡5min,得均匀透明流体,即基于EAPSi-4所制备的光固化涂料UVES-4。
(2)光固化涂层制备与性能
取UVES-3,用口径约为1.2mm的喷枪将涂料用均匀喷涂于洁净马口铁或玻璃基材表面,控制喷涂量以使干后涂层的厚度约为22.7μm,先室温流平5min,然后用功率为2200W的紫外光固化机进行光固化4min,所得涂层试样即UVES-4试样。在室温25℃、相对湿度RH=48%条件下养护48h,UVES-4涂层性能测试结果如下:涂层透光率T=96%;附着力:1级;硬度:4H;耐盐雾性能×1200h,涂层表面扩蚀≤2mm;耐老化性能(85℃×RH85%)≥1200h涂层表面无异常;WCA=114.6°;涂层表面防污性(粉煤灰试验)约1级。
Claims (10)
1.一种基于光固化环氧丙烯酸酯缩合硅树脂所制备的光固化涂料,其特征在于,按质量份,由100份环氧丙烯酸酯缩合烯基硅树脂、10-35份烯基活性稀释剂DS1、不超过15份的烯基活性稀释剂DS2以及以环氧丙烯酸酯缩合烯基硅树脂、烯基活性稀释剂DS1及烯基活性稀释剂DS2三者总质量计不超过30%的纳米增硬补强组分和1-5%的自由基光引发剂组成;
所述的环氧丙烯酸酯缩合烯基硅树脂,结构如式(Ⅰ)所示:
式(Ⅰ)中M=CH3或H;A PSi1、PSi2、PSi3含有氨烃基及烯基,为氨烃基烷氧基硅烷与烃基烷氧基硅烷及烯基烷氧基硅烷的缩聚产物或氨烃基烷氧基硅烷与烃基硅氧烷低聚体及烯基烷氧基硅烷的缩聚产物,PSi1、PSi2、PSi3具有相同或不同的结构;
所述的氨烃基烷氧基硅烷为含有氨烃基和2-3个烷氧基的硅烷;
所述的烃基烷氧基硅烷为含有烃基和2-3个烷氧基的硅烷;
所述的烃基硅氧烷低聚体为聚合度≤10,含有硅羟基或硅烷氧基以及烃基硅氧烷链节的线性、环状、树枝状或半封闭笼状的硅氧烷低聚物;
所述的烯基烷氧基硅烷为含有烯基和2-3个烷氧基的硅烷;
所述的烷氧基为甲氧基或乙氧基;
所述的氨烃基为γ-氨丙基、N-环己基-γ-氨丙基、N,N-二甲基-γ-氨丙基-γ-氨丙基、哌嗪基丙基中的一种;
所述的烃基为C1-18烷基、环烷基、芳烃基中的1-3种;
所述的烯基为丙烯酰氧丙基、甲基丙烯酰氧丙基、乙烯基中的任意一种,或乙烯基与丙烯酰氧丙基、甲基丙烯酰氧丙基中的任意一种的混合基团;
所述的烯基活性稀释剂DS1,结构如式(2)所示:
式中B=CH2、CH2OCH2CH2、COOCH2CH2、COOCH2CH(CH3);
所述的烯基活性稀释剂DS2为含有1个以上烯基的酯类稀释剂。
2.根据权利要求1所述的涂料,其特征在于,所述的环氧丙烯酸酯缩合烯基硅树脂,由包括以下步骤的方法得到:
步骤S1:将丙烯酸或甲基丙烯酸与环氧树脂按摩尔比2-2.5:1反应,合成环氧丙烯酸酯树脂;
所述的环氧树脂为分子两端连有环氧基的双酚A型环氧树脂、氢化双酚A型环氧树脂、双酚F型环氧树脂中的一种,环氧值为0.2~0.59;
步骤S2:按质量计,取5-10份氨烃基烷氧基硅烷、60-85份的烃基烷氧基硅烷或烃基硅氧烷低聚体、10-30份烯基烷氧基硅烷搅拌混匀,得单体混合物D;再加入溶剂S1、以混合物D质量计30-100%的步骤S1得到的环氧丙烯酸酯树脂以及与混合物D中的烷氧基等摩尔量的水,在40-80℃进行水解缩聚反应3-6h;再加入催化剂反应30-60min,减压脱低沸,即得光固化环氧丙烯酸酯缩合烯基硅树脂。
3.根据权利要求1或2所述的涂料,其特征在于,所述的氨烃基烷氧基硅烷为分子中含有氨烃基和2-3个烷氧基的硅烷;所述的氨烃基为γ-氨丙基、N-环己基-γ-氨丙基、N,N-二甲基-γ-氨丙基-γ-氨丙基、哌嗪基丙基中的一种;所述的烷氧基为甲氧基或乙氧基;
所述的烃基烷氧基硅烷,为脂肪烃基烷氧基硅烷和/或芳烃基烷氧基硅烷;
所述的脂肪烃基烷氧基硅烷,为结构中含有C1-18烷基和/或环烷基、且含2-3个烷氧基的硅烷,所述的烷氧基为甲氧基或乙氧基;
所述的芳烃基烷氧基硅烷为苯基三甲氧基硅烷、苯基三乙氧基硅烷、二苯基二甲氧基硅烷、二苯基二乙氧基硅烷、甲基苯基二甲氧基硅烷、甲基苯基二乙氧基硅烷中的一种或两种。
4.根据权利要求1或2所述的涂料,其特征在于,所述的烯基烷氧基硅烷为γ-丙烯酰氧丙基三甲氧基硅烷、γ-丙烯酰氧丙基三乙氧基硅烷、γ-甲基丙烯酰氧丙基三甲氧基硅烷、γ-甲基丙烯酰氧丙基三乙氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、γ-丙烯酰氧丙基甲基二甲氧基硅烷、γ-丙烯酰氧丙基甲基二乙氧基硅烷、γ-甲基丙烯酰氧丙基甲基二甲氧基硅烷、γ-甲基丙烯酰氧丙基甲基二乙氧基硅烷、甲基乙烯基二甲氧基硅烷、甲基乙烯基二乙氧基硅烷中的一种或两种。
5.根据权利要求2所述的涂料,其特征在于,所述的环氧丙烯酸酯树脂为双酚A型环氧丙烯酸酯、双酚A型环氧甲基丙烯酸酯、氢化双酚A型环氧树脂丙烯酸酯、氢化双酚A型环氧甲基丙烯酸酯、双酚F型环氧丙烯酸酯、双酚F型环氧甲基丙烯酸酯中的一种,烯基含量以100g环氧丙烯酸酯树脂中所含烯基的摩尔数计为0.15-0.3。
6.根据权利要求1所述的涂料,其特征在于,所述的自由基光引发剂为2-羟基-2-甲基-1-苯基丙烷-1-酮、1-羟基环已基苯基酮、2-甲基-1-(4-甲硫基苯基)-2-吗啉基-1-丙酮、安息香双甲醚、2,4,6-(三甲基苯甲酰基)二苯基氧化膦中的一种或多种。
7.根据权利要求1所述的涂料,其特征在于,所述的烯基活性稀释剂DS1由三异氰酸酯低聚体与羟基烯类化合物按摩尔比1:3-3.1反应得到;
所述的羟基烯类化合物为烯丙醇、羟乙基烯丙基醚、丙烯酸羟乙酯、丙烯酸羟丙酯、甲基丙烯酸羟乙酯或甲基丙烯酸羟丙酯;
所述的烯基活性稀释剂DS2为乙二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、丙二醇二丙烯酸酯、己二醇二丙烯酸酯、一缩二丙二醇二丙烯酸酯、二缩三丙二醇二丙烯酸酯、丙烯酸环己酯或丙烯酸异冰片酯。
8.根据权利要求1所述的涂料,其特征在于,所述的纳米增硬补强组分为丙烯酰氧丙基七异丁基POSS、甲基丙烯酰氧丙基七异丁基POSS、甲基丙烯酰氧丙基七环己基POSS、甲基丙烯酰氧丙基七乙基POSS、甲基丙烯酰氧丙基七异辛基POSS、八丙烯酰氧丙基POSS、八甲基丙烯酰氧丙基POSS、甲基丙烯酰氧丙基七苯基POSS、苯基改性纳米硅溶胶、C1-18烷基改性纳米硅溶胶、MQ树脂或苯基改性MQ树脂。
9.权利要求1-8任一项所述涂料的固化方法,其特征在于,包括如下步骤:取环氧丙烯酸酯缩合烯基硅树脂、烯基活性稀释剂DS1、烯基活性稀释剂DS2及纳米增硬补强组分、自由基光引发剂,搅拌混匀,先制成光固化涂料;
将该涂料均匀涂在基材表面,先室温流平3-5min,然后再经UV光照射2-4min,所得涂层即为基于环氧丙烯酸酯缩合烯基硅树脂所制备的光固化涂层。
10.权利要求9所述方法得到的涂层。
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