CN116529838A - 电路连接用黏合剂薄膜、以及连接结构体及其制造方法 - Google Patents

电路连接用黏合剂薄膜、以及连接结构体及其制造方法 Download PDF

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Publication number
CN116529838A
CN116529838A CN202180077955.5A CN202180077955A CN116529838A CN 116529838 A CN116529838 A CN 116529838A CN 202180077955 A CN202180077955 A CN 202180077955A CN 116529838 A CN116529838 A CN 116529838A
Authority
CN
China
Prior art keywords
electrode
circuit
adhesive film
solder
solder particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180077955.5A
Other languages
English (en)
Chinese (zh)
Inventor
森谷敏光
赤井邦彦
宫地胜将
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN116529838A publication Critical patent/CN116529838A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
CN202180077955.5A 2020-11-20 2021-11-17 电路连接用黏合剂薄膜、以及连接结构体及其制造方法 Pending CN116529838A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-193176 2020-11-20
JP2020193176 2020-11-20
PCT/JP2021/042211 WO2022107800A1 (ja) 2020-11-20 2021-11-17 回路接続用接着剤フィルム、並びに、接続構造体及びその製造方法

Publications (1)

Publication Number Publication Date
CN116529838A true CN116529838A (zh) 2023-08-01

Family

ID=81708929

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180077955.5A Pending CN116529838A (zh) 2020-11-20 2021-11-17 电路连接用黏合剂薄膜、以及连接结构体及其制造方法

Country Status (4)

Country Link
JP (1) JP7798036B2 (https=)
KR (1) KR20230109659A (https=)
CN (1) CN116529838A (https=)
WO (1) WO2022107800A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117242112A (zh) * 2021-07-30 2023-12-15 积水化学工业株式会社 固化性树脂组合物、显示元件用密封剂、有机el显示元件用密封剂、光学粘接剂以及光学构件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11148058A (ja) * 1997-11-17 1999-06-02 Seiko Epson Corp 異方導電性接着剤、それを用いた液晶表示装置および電子機器
TW557237B (en) 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
JP4130747B2 (ja) * 2002-03-28 2008-08-06 旭化成エレクトロニクス株式会社 異方導電性接着シートおよびその製造方法
KR101380454B1 (ko) * 2012-03-26 2014-04-01 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
JP2016162510A (ja) * 2015-02-26 2016-09-05 デクセリアルズ株式会社 接続構造体の製造方法、及び接続構造体
CN112543693A (zh) * 2018-06-26 2021-03-23 昭和电工材料株式会社 焊料粒子
WO2020071271A1 (ja) * 2018-10-03 2020-04-09 デクセリアルズ株式会社 異方性導電フィルム、接続構造体、接続構造体の製造方法

Also Published As

Publication number Publication date
JP7798036B2 (ja) 2026-01-14
WO2022107800A1 (ja) 2022-05-27
JPWO2022107800A1 (https=) 2022-05-27
TW202240602A (zh) 2022-10-16
KR20230109659A (ko) 2023-07-20

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