JP7798036B2 - 回路接続用接着剤フィルム、並びに、接続構造体及びその製造方法 - Google Patents

回路接続用接着剤フィルム、並びに、接続構造体及びその製造方法

Info

Publication number
JP7798036B2
JP7798036B2 JP2022563795A JP2022563795A JP7798036B2 JP 7798036 B2 JP7798036 B2 JP 7798036B2 JP 2022563795 A JP2022563795 A JP 2022563795A JP 2022563795 A JP2022563795 A JP 2022563795A JP 7798036 B2 JP7798036 B2 JP 7798036B2
Authority
JP
Japan
Prior art keywords
electrode
adhesive film
solder particles
circuit
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022563795A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022107800A1 (https=
Inventor
敏光 森谷
邦彦 赤井
勝将 宮地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2022107800A1 publication Critical patent/JPWO2022107800A1/ja
Application granted granted Critical
Publication of JP7798036B2 publication Critical patent/JP7798036B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2022563795A 2020-11-20 2021-11-17 回路接続用接着剤フィルム、並びに、接続構造体及びその製造方法 Active JP7798036B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020193176 2020-11-20
JP2020193176 2020-11-20
PCT/JP2021/042211 WO2022107800A1 (ja) 2020-11-20 2021-11-17 回路接続用接着剤フィルム、並びに、接続構造体及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2022107800A1 JPWO2022107800A1 (https=) 2022-05-27
JP7798036B2 true JP7798036B2 (ja) 2026-01-14

Family

ID=81708929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022563795A Active JP7798036B2 (ja) 2020-11-20 2021-11-17 回路接続用接着剤フィルム、並びに、接続構造体及びその製造方法

Country Status (4)

Country Link
JP (1) JP7798036B2 (https=)
KR (1) KR20230109659A (https=)
CN (1) CN116529838A (https=)
WO (1) WO2022107800A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117242112A (zh) * 2021-07-30 2023-12-15 积水化学工业株式会社 固化性树脂组合物、显示元件用密封剂、有机el显示元件用密封剂、光学粘接剂以及光学构件

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003286457A (ja) 2002-03-28 2003-10-10 Asahi Kasei Corp 異方導電性接着シートおよびその製造方法
WO2013146604A1 (ja) 2012-03-26 2013-10-03 積水化学工業株式会社 導電材料及び接続構造体
JP2016162510A (ja) 2015-02-26 2016-09-05 デクセリアルズ株式会社 接続構造体の製造方法、及び接続構造体
WO2020004513A1 (ja) 2018-06-26 2020-01-02 日立化成株式会社 はんだ粒子
WO2020071271A1 (ja) 2018-10-03 2020-04-09 デクセリアルズ株式会社 異方性導電フィルム、接続構造体、接続構造体の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11148058A (ja) * 1997-11-17 1999-06-02 Seiko Epson Corp 異方導電性接着剤、それを用いた液晶表示装置および電子機器
TW557237B (en) 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003286457A (ja) 2002-03-28 2003-10-10 Asahi Kasei Corp 異方導電性接着シートおよびその製造方法
WO2013146604A1 (ja) 2012-03-26 2013-10-03 積水化学工業株式会社 導電材料及び接続構造体
JP2016162510A (ja) 2015-02-26 2016-09-05 デクセリアルズ株式会社 接続構造体の製造方法、及び接続構造体
WO2020004513A1 (ja) 2018-06-26 2020-01-02 日立化成株式会社 はんだ粒子
WO2020071271A1 (ja) 2018-10-03 2020-04-09 デクセリアルズ株式会社 異方性導電フィルム、接続構造体、接続構造体の製造方法

Also Published As

Publication number Publication date
WO2022107800A1 (ja) 2022-05-27
JPWO2022107800A1 (https=) 2022-05-27
CN116529838A (zh) 2023-08-01
TW202240602A (zh) 2022-10-16
KR20230109659A (ko) 2023-07-20

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