CN116490960A - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN116490960A
CN116490960A CN202280007627.2A CN202280007627A CN116490960A CN 116490960 A CN116490960 A CN 116490960A CN 202280007627 A CN202280007627 A CN 202280007627A CN 116490960 A CN116490960 A CN 116490960A
Authority
CN
China
Prior art keywords
region
semiconductor device
boundary
contact
boundary region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280007627.2A
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English (en)
Chinese (zh)
Inventor
吉田崇一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of CN116490960A publication Critical patent/CN116490960A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/611Combinations of BJTs and one or more of diodes, resistors or capacitors
    • H10D84/613Combinations of vertical BJTs and one or more of diodes, resistors or capacitors
    • H10D84/617Combinations of vertical BJTs and only diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/441Vertical IGBTs
    • H10D12/461Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
    • H10D12/481Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/393Body regions of DMOS transistors or IGBTs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/50Physical imperfections
    • H10D62/53Physical imperfections the imperfections being within the semiconductor body 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • H10D64/117Recessed field plates, e.g. trench field plates or buried field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/422PN diodes having the PN junctions in mesas
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/811Combinations of field-effect devices and one or more diodes, capacitors or resistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
CN202280007627.2A 2021-06-18 2022-04-26 半导体装置 Pending CN116490960A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-101987 2021-06-18
JP2021101987 2021-06-18
PCT/JP2022/018987 WO2022264697A1 (ja) 2021-06-18 2022-04-26 半導体装置

Publications (1)

Publication Number Publication Date
CN116490960A true CN116490960A (zh) 2023-07-25

Family

ID=84527341

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280007627.2A Pending CN116490960A (zh) 2021-06-18 2022-04-26 半导体装置

Country Status (4)

Country Link
US (1) US20230299078A1 (https=)
JP (1) JP7732510B2 (https=)
CN (1) CN116490960A (https=)
WO (1) WO2022264697A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024098458A (ja) * 2023-01-10 2024-07-23 富士電機株式会社 半導体装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5206541B2 (ja) 2008-04-01 2013-06-12 株式会社デンソー 半導体装置およびその製造方法
JP5056620B2 (ja) 2008-06-30 2012-10-24 新神戸電機株式会社 配線板
JP6561611B2 (ja) 2015-06-17 2019-08-21 富士電機株式会社 半導体装置
JP2017098359A (ja) 2015-11-20 2017-06-01 トヨタ自動車株式会社 逆導通igbt
CN107851666B (zh) 2016-02-15 2021-11-23 富士电机株式会社 半导体装置
CN108604602B (zh) * 2016-08-12 2021-06-15 富士电机株式会社 半导体装置及半导体装置的制造方法
JP6704057B2 (ja) * 2016-09-20 2020-06-03 富士電機株式会社 半導体装置および半導体装置の製造方法
WO2018105729A1 (ja) 2016-12-08 2018-06-14 富士電機株式会社 半導体装置
DE112018001627B4 (de) 2017-11-15 2024-07-11 Fuji Electric Co., Ltd. Halbleitervorrichtung
CN110785852B (zh) 2017-12-06 2023-10-24 富士电机株式会社 半导体装置
CN110914999B (zh) 2018-01-17 2023-11-17 富士电机株式会社 半导体装置
CN111418072B (zh) 2018-06-22 2023-11-21 富士电机株式会社 半导体装置的制造方法及半导体装置
JP6958740B2 (ja) 2018-08-14 2021-11-02 富士電機株式会社 半導体装置および製造方法
CN112470291B (zh) 2019-02-07 2025-03-11 富士电机株式会社 半导体装置以及半导体模块
EP3843132B1 (en) 2019-04-16 2024-11-27 Fuji Electric Co., Ltd. Semiconductor device and production method

Also Published As

Publication number Publication date
WO2022264697A1 (ja) 2022-12-22
JP7732510B2 (ja) 2025-09-02
JPWO2022264697A1 (https=) 2022-12-22
US20230299078A1 (en) 2023-09-21

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