CN116490960A - 半导体装置 - Google Patents
半导体装置 Download PDFInfo
- Publication number
- CN116490960A CN116490960A CN202280007627.2A CN202280007627A CN116490960A CN 116490960 A CN116490960 A CN 116490960A CN 202280007627 A CN202280007627 A CN 202280007627A CN 116490960 A CN116490960 A CN 116490960A
- Authority
- CN
- China
- Prior art keywords
- region
- semiconductor device
- boundary
- contact
- boundary region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
- H10D84/611—Combinations of BJTs and one or more of diodes, resistors or capacitors
- H10D84/613—Combinations of vertical BJTs and one or more of diodes, resistors or capacitors
- H10D84/617—Combinations of vertical BJTs and only diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
- H10D12/461—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
- H10D12/481—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/393—Body regions of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/50—Physical imperfections
- H10D62/53—Physical imperfections the imperfections being within the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
- H10D64/117—Recessed field plates, e.g. trench field plates or buried field plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/422—PN diodes having the PN junctions in mesas
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/811—Combinations of field-effect devices and one or more diodes, capacitors or resistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-101987 | 2021-06-18 | ||
| JP2021101987 | 2021-06-18 | ||
| PCT/JP2022/018987 WO2022264697A1 (ja) | 2021-06-18 | 2022-04-26 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116490960A true CN116490960A (zh) | 2023-07-25 |
Family
ID=84527341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280007627.2A Pending CN116490960A (zh) | 2021-06-18 | 2022-04-26 | 半导体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230299078A1 (https=) |
| JP (1) | JP7732510B2 (https=) |
| CN (1) | CN116490960A (https=) |
| WO (1) | WO2022264697A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024098458A (ja) * | 2023-01-10 | 2024-07-23 | 富士電機株式会社 | 半導体装置 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5206541B2 (ja) | 2008-04-01 | 2013-06-12 | 株式会社デンソー | 半導体装置およびその製造方法 |
| JP5056620B2 (ja) | 2008-06-30 | 2012-10-24 | 新神戸電機株式会社 | 配線板 |
| JP6561611B2 (ja) | 2015-06-17 | 2019-08-21 | 富士電機株式会社 | 半導体装置 |
| JP2017098359A (ja) | 2015-11-20 | 2017-06-01 | トヨタ自動車株式会社 | 逆導通igbt |
| CN107851666B (zh) | 2016-02-15 | 2021-11-23 | 富士电机株式会社 | 半导体装置 |
| CN108604602B (zh) * | 2016-08-12 | 2021-06-15 | 富士电机株式会社 | 半导体装置及半导体装置的制造方法 |
| JP6704057B2 (ja) * | 2016-09-20 | 2020-06-03 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| WO2018105729A1 (ja) | 2016-12-08 | 2018-06-14 | 富士電機株式会社 | 半導体装置 |
| DE112018001627B4 (de) | 2017-11-15 | 2024-07-11 | Fuji Electric Co., Ltd. | Halbleitervorrichtung |
| CN110785852B (zh) | 2017-12-06 | 2023-10-24 | 富士电机株式会社 | 半导体装置 |
| CN110914999B (zh) | 2018-01-17 | 2023-11-17 | 富士电机株式会社 | 半导体装置 |
| CN111418072B (zh) | 2018-06-22 | 2023-11-21 | 富士电机株式会社 | 半导体装置的制造方法及半导体装置 |
| JP6958740B2 (ja) | 2018-08-14 | 2021-11-02 | 富士電機株式会社 | 半導体装置および製造方法 |
| CN112470291B (zh) | 2019-02-07 | 2025-03-11 | 富士电机株式会社 | 半导体装置以及半导体模块 |
| EP3843132B1 (en) | 2019-04-16 | 2024-11-27 | Fuji Electric Co., Ltd. | Semiconductor device and production method |
-
2022
- 2022-04-26 CN CN202280007627.2A patent/CN116490960A/zh active Pending
- 2022-04-26 JP JP2023529663A patent/JP7732510B2/ja active Active
- 2022-04-26 WO PCT/JP2022/018987 patent/WO2022264697A1/ja not_active Ceased
-
2023
- 2023-05-21 US US18/320,997 patent/US20230299078A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022264697A1 (ja) | 2022-12-22 |
| JP7732510B2 (ja) | 2025-09-02 |
| JPWO2022264697A1 (https=) | 2022-12-22 |
| US20230299078A1 (en) | 2023-09-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |