CN116438326B - 成膜装置、成膜单元和成膜方法 - Google Patents

成膜装置、成膜单元和成膜方法 Download PDF

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Publication number
CN116438326B
CN116438326B CN202080106929.6A CN202080106929A CN116438326B CN 116438326 B CN116438326 B CN 116438326B CN 202080106929 A CN202080106929 A CN 202080106929A CN 116438326 B CN116438326 B CN 116438326B
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Prior art keywords
film forming
evaporation
inner peripheral
peripheral surface
evaporation source
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CN202080106929.6A
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Chinese (zh)
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CN116438326A (zh
Inventor
饭塚贵嗣
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225—Oblique incidence of vaporised material on substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
    • B21D28/14—Dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/24—Perforating, i.e. punching holes
    • B21D28/34—Perforating tools; Die holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00—Tools as parts of machines covered by this subclass
    • B21D37/01—Selection of materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00—Tools as parts of machines covered by this subclass
    • B21D37/20—Making tools by operations not covered by a single other subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
CN202080106929.6A 2020-11-06 2020-11-06 成膜装置、成膜单元和成膜方法 Active CN116438326B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/041602 WO2022097286A1 (ja) 2020-11-06 2020-11-06 成膜装置、成膜ユニット及び成膜方法

Publications (2)

Publication Number Publication Date
CN116438326A CN116438326A (zh) 2023-07-14
CN116438326B true CN116438326B (zh) 2024-04-12

Family

ID=81457650

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080106929.6A Active CN116438326B (zh) 2020-11-06 2020-11-06 成膜装置、成膜单元和成膜方法

Country Status (5)

Country Link
US (1) US12270099B2 (https=)
EP (1) EP4230762A4 (https=)
JP (1) JP7239724B2 (https=)
CN (1) CN116438326B (https=)
WO (1) WO2022097286A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62290867A (ja) * 1986-06-06 1987-12-17 Nissin Electric Co Ltd 薄膜形成装置
JPH0794412A (ja) * 1993-09-20 1995-04-07 Mitsubishi Electric Corp 薄膜形成装置
JP2007138286A (ja) * 2005-10-17 2007-06-07 Kobe Steel Ltd アークイオンプレーティング装置
JP2008519163A (ja) * 2004-11-08 2008-06-05 アプライド マテリアルズ インコーポレイテッド 調整可能なターゲットを有する物理気相堆積チャンバ
JP2009182140A (ja) * 2008-01-30 2009-08-13 Tokyo Electron Ltd 薄膜の形成方法、プラズマ成膜装置及び記憶媒体
JP2013147743A (ja) * 2011-12-22 2013-08-01 Semiconductor Energy Lab Co Ltd 成膜装置および成膜方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT388394B (de) * 1987-01-09 1989-06-12 Vni Instrument Inst Verfahren zur herstellung von schneidwerkzeug
JP2718731B2 (ja) * 1988-12-21 1998-02-25 株式会社神戸製鋼所 真空アーク蒸着装置及び真空アーク蒸着方法
JP4326895B2 (ja) * 2003-09-25 2009-09-09 キヤノンアネルバ株式会社 スパッタリング装置
EP1524329A1 (de) * 2003-10-17 2005-04-20 Platit AG Modulare Vorrichtung zur Beschichtung von Oberflächen
US20070240982A1 (en) * 2005-10-17 2007-10-18 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Arc ion plating apparatus
JP5138892B2 (ja) * 2006-01-20 2013-02-06 株式会社神戸製鋼所 硬質皮膜
KR101076227B1 (ko) * 2008-12-23 2011-10-26 주식회사 테스 진공증착장치
JP2012011393A (ja) 2010-06-29 2012-01-19 Kobe Steel Ltd せん断用金型及びその製造方法
ES2739283T3 (es) * 2011-09-19 2020-01-30 Lamina Tech Sa Herramienta de corte recubierta
EP2921572B1 (en) 2012-11-14 2020-06-24 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Film deposition device
CN105671496B (zh) * 2016-01-28 2019-02-12 武汉江海行纳米科技有限公司 一种氮化钼/氮硼钛纳米复合多层涂层刀具及其制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62290867A (ja) * 1986-06-06 1987-12-17 Nissin Electric Co Ltd 薄膜形成装置
JPH0794412A (ja) * 1993-09-20 1995-04-07 Mitsubishi Electric Corp 薄膜形成装置
JP2008519163A (ja) * 2004-11-08 2008-06-05 アプライド マテリアルズ インコーポレイテッド 調整可能なターゲットを有する物理気相堆積チャンバ
JP2007138286A (ja) * 2005-10-17 2007-06-07 Kobe Steel Ltd アークイオンプレーティング装置
JP2009182140A (ja) * 2008-01-30 2009-08-13 Tokyo Electron Ltd 薄膜の形成方法、プラズマ成膜装置及び記憶媒体
JP2013147743A (ja) * 2011-12-22 2013-08-01 Semiconductor Energy Lab Co Ltd 成膜装置および成膜方法

Also Published As

Publication number Publication date
JPWO2022097286A1 (https=) 2022-05-12
EP4230762A4 (en) 2023-12-06
EP4230762A1 (en) 2023-08-23
US12270099B2 (en) 2025-04-08
US20230304140A1 (en) 2023-09-28
WO2022097286A1 (ja) 2022-05-12
JP7239724B2 (ja) 2023-03-14
CN116438326A (zh) 2023-07-14

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