CN116419849A - 非热塑性聚酰亚胺薄膜、多层聚酰亚胺薄膜和覆金属箔层压板 - Google Patents

非热塑性聚酰亚胺薄膜、多层聚酰亚胺薄膜和覆金属箔层压板 Download PDF

Info

Publication number
CN116419849A
CN116419849A CN202180072102.2A CN202180072102A CN116419849A CN 116419849 A CN116419849 A CN 116419849A CN 202180072102 A CN202180072102 A CN 202180072102A CN 116419849 A CN116419849 A CN 116419849A
Authority
CN
China
Prior art keywords
thermoplastic polyimide
polyimide film
residues
film
mol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180072102.2A
Other languages
English (en)
Chinese (zh)
Inventor
佐藤嵩浩
细贝诚二
宇野真理
大熊敬介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneka Corp
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of CN116419849A publication Critical patent/CN116419849A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
CN202180072102.2A 2020-10-22 2021-10-18 非热塑性聚酰亚胺薄膜、多层聚酰亚胺薄膜和覆金属箔层压板 Pending CN116419849A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020177533 2020-10-22
JP2020-177533 2020-10-22
PCT/JP2021/038393 WO2022085619A1 (ja) 2020-10-22 2021-10-18 非熱可塑性ポリイミドフィルム、複層ポリイミドフィルム、及び金属張積層板

Publications (1)

Publication Number Publication Date
CN116419849A true CN116419849A (zh) 2023-07-11

Family

ID=81290540

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180072102.2A Pending CN116419849A (zh) 2020-10-22 2021-10-18 非热塑性聚酰亚胺薄膜、多层聚酰亚胺薄膜和覆金属箔层压板

Country Status (6)

Country Link
US (1) US20230265252A1 (https=)
JP (1) JP7791097B2 (https=)
KR (1) KR20230090330A (https=)
CN (1) CN116419849A (https=)
TW (1) TWI890877B (https=)
WO (1) WO2022085619A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118440606A (zh) * 2024-05-04 2024-08-06 万洲胶粘制品(江苏)有限公司 一种金属保护与环保脱除结合的pcb镀金胶带制备方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023157789A1 (ja) * 2022-02-16 2023-08-24 株式会社カネカ ポリアミド酸、ポリイミド、非熱可塑性ポリイミドフィルム、複層ポリイミドフィルム及び金属張積層板
KR20240150439A (ko) * 2022-02-24 2024-10-15 가부시키가이샤 가네카 폴리아미드산, 폴리이미드, 비열가소성 폴리이미드 필름, 복층 폴리이미드 필름 및 금속 피복 적층판
WO2024085047A1 (ja) * 2022-10-19 2024-04-25 株式会社カネカ 複層ポリイミドフィルム
JP2024063619A (ja) * 2022-10-26 2024-05-13 大日本印刷株式会社 真空断熱材用外包材、真空断熱材、および真空断熱材付き物品

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6476177B2 (en) 2000-12-21 2002-11-05 E. I. Du Pont De Nemours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
JP2008095000A (ja) 2006-10-13 2008-04-24 Toyobo Co Ltd 易接着高弾性ポリイミドフィルム及びその製造方法
JP2008182092A (ja) 2007-01-25 2008-08-07 Toyobo Co Ltd 熱電変換モジュール
JP5031639B2 (ja) 2008-03-31 2012-09-19 新日鐵化学株式会社 フレキシブル銅張積層板
CN101974155B (zh) 2010-07-10 2013-08-28 横店集团东磁股份有限公司 聚酰亚胺前聚体树脂合成方法及单面柔性覆铜板制造方法
JP5345116B2 (ja) 2010-09-30 2013-11-20 日本化薬株式会社 銅張積層板及びその製造方法、並びに該銅張積層板を含む配線基板
KR101299652B1 (ko) 2011-09-07 2013-08-23 주식회사 엘지화학 불소수지 함유 연성 금속 적층판
JP6515180B2 (ja) * 2015-03-31 2019-05-15 株式会社カネカ 多層接着フィルム及びフレキシブル金属張積層板
KR102442540B1 (ko) 2016-10-31 2022-09-13 유비이 가부시키가이샤 금속 적층용 폴리이미드 필름 및 이것을 사용한 폴리이미드 금속 적층체
JP2018165346A (ja) * 2017-03-28 2018-10-25 東レ・デュポン株式会社 ポリイミドフィルム
CN109503836A (zh) 2018-09-28 2019-03-22 广东圣帕新材料股份有限公司 聚酰胺酸树脂的制备方法及双面柔性覆铜板的制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118440606A (zh) * 2024-05-04 2024-08-06 万洲胶粘制品(江苏)有限公司 一种金属保护与环保脱除结合的pcb镀金胶带制备方法

Also Published As

Publication number Publication date
JPWO2022085619A1 (https=) 2022-04-28
TWI890877B (zh) 2025-07-21
TW202225270A (zh) 2022-07-01
KR20230090330A (ko) 2023-06-21
US20230265252A1 (en) 2023-08-24
JP7791097B2 (ja) 2025-12-23
WO2022085619A1 (ja) 2022-04-28

Similar Documents

Publication Publication Date Title
JP5880658B2 (ja) ポリイミドフィルム、およびこれらのポリイミド積層体、ポリイミド金属積層体
JP7428646B2 (ja) 金属張積層板及び回路基板
CN116419849A (zh) 非热塑性聚酰亚胺薄膜、多层聚酰亚胺薄膜和覆金属箔层压板
KR20200036770A (ko) 금속 피복 적층판 및 회로 기판
JPWO2020022129A5 (https=)
JP6403460B2 (ja) 金属張積層体、回路基板及びポリイミド
CN109575283B (zh) 聚酰亚胺膜、覆金属层叠板及电路基板
JP7825567B2 (ja) 複層ポリイミドフィルム、金属張積層板、及び複層ポリイミドフィルムの製造方法
JP7584274B2 (ja) 多層接着フィルム、フレキシブル金属張積層板およびフレキシブルプリント基板
KR102560356B1 (ko) 폴리이미드 필름 및 금속장 적층체
JP7726928B2 (ja) マイクロストリップアンテナおよびその製造方法
JP2023121512A (ja) 非熱可塑性ポリイミドフィルム、複層ポリイミドフィルム、及び金属張積層板
JP2020015237A (ja) 金属張積層板の製造方法及び回路基板の製造方法
JP7829368B2 (ja) ポリイミド前駆体及びポリイミド
TW202237765A (zh) 電路基板
CN118749007A (zh) 聚酰胺酸、聚酰亚胺、非热塑性聚酰亚胺薄膜、多层聚酰亚胺薄膜及覆金属层叠板
TW202344567A (zh) 聚醯胺酸、聚醯亞胺、非熱塑性聚醯亞胺膜、多層聚醯亞胺膜及金屬貼合積層板
JP2004315601A (ja) 接着性の改良されたポリイミドフィルム、その製造法および積層体
KR102160000B1 (ko) 후막 폴리이미드 금속박 적층체 및 이의 제조방법
CN116353168A (zh) 树脂层叠体、层叠板、电路基板、电子元件及电子设备
JP2023146309A (ja) 両面銅張積層板および両面銅張積層板の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination