CN116387038A - 多层电子组件 - Google Patents

多层电子组件 Download PDF

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Publication number
CN116387038A
CN116387038A CN202211720240.XA CN202211720240A CN116387038A CN 116387038 A CN116387038 A CN 116387038A CN 202211720240 A CN202211720240 A CN 202211720240A CN 116387038 A CN116387038 A CN 116387038A
Authority
CN
China
Prior art keywords
multilayer electronic
electronic assembly
plating layer
insulating layer
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211720240.XA
Other languages
English (en)
Chinese (zh)
Inventor
李有淨
李忠烈
崔亨综
元光渊
安昭贞
李冈夏
成佑庆
朴明俊
李种晧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN116387038A publication Critical patent/CN116387038A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
CN202211720240.XA 2021-12-31 2022-12-30 多层电子组件 Pending CN116387038A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210194177A KR20230103351A (ko) 2021-12-31 2021-12-31 적층형 전자 부품
KR10-2021-0194177 2021-12-31

Publications (1)

Publication Number Publication Date
CN116387038A true CN116387038A (zh) 2023-07-04

Family

ID=86977591

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211720240.XA Pending CN116387038A (zh) 2021-12-31 2022-12-30 多层电子组件

Country Status (4)

Country Link
US (1) US12374497B2 (https=)
JP (1) JP2023099433A (https=)
KR (2) KR20230103351A (https=)
CN (1) CN116387038A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250022628A (ko) 2023-08-08 2025-02-17 주식회사 엘지에너지솔루션 전기화학소자용 분리막 및 이를 포함하는 전기화학소자

Family Cites Families (30)

* Cited by examiner, † Cited by third party
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JP5152174B2 (ja) * 2007-03-08 2013-02-27 パナソニック株式会社 ケースモールド型コンデンサおよびその使用方法
JP2013026392A (ja) * 2011-07-20 2013-02-04 Tdk Corp 電子部品及び電子部品の製造方法
KR101862396B1 (ko) * 2011-09-08 2018-05-30 삼성전기주식회사 적층 세라믹 전자부품 및 이의 제조방법
KR101422926B1 (ko) * 2012-10-26 2014-07-23 삼성전기주식회사 적층 칩 전자부품 및 그 실장 기판
JP5920304B2 (ja) * 2013-09-25 2016-05-18 株式会社村田製作所 電子部品およびその製造方法
KR101983154B1 (ko) * 2013-11-05 2019-05-28 삼성전기주식회사 적층 세라믹 커패시터
JP6156345B2 (ja) 2014-12-10 2017-07-05 株式会社村田製作所 電子部品及びその製造方法
CN107210129B (zh) * 2015-01-30 2020-03-10 株式会社村田制作所 电子部件的制造方法以及电子部件
JP6592923B2 (ja) 2015-03-20 2019-10-23 株式会社村田製作所 電子部品およびその製造方法
JP6395322B2 (ja) * 2015-12-01 2018-09-26 太陽誘電株式会社 電子部品及びその製造方法、並びに回路基板
JP2017130572A (ja) * 2016-01-21 2017-07-27 Tdk株式会社 電子部品及び電子部品装置
JP2017147410A (ja) * 2016-02-19 2017-08-24 Tdk株式会社 電子部品及び電子部品の実装構造
JP6405327B2 (ja) * 2016-02-26 2018-10-17 太陽誘電株式会社 積層セラミックコンデンサ
JP6512139B2 (ja) * 2016-03-04 2019-05-15 株式会社村田製作所 電子部品の実装構造及びその電子部品の製造方法
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KR102715894B1 (ko) * 2016-11-21 2024-10-11 삼성전기주식회사 커패시터 및 그 제조 방법
US10770232B2 (en) * 2017-09-29 2020-09-08 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and method of manufacturing the same
KR102436224B1 (ko) 2017-12-19 2022-08-25 삼성전기주식회사 커패시터 부품
JP7358692B2 (ja) * 2018-06-15 2023-10-11 サムソン エレクトロ－メカニックス カンパニーリミテッド． キャパシタ部品及びキャパシタ部品の製造方法
KR102620541B1 (ko) * 2018-08-22 2024-01-03 삼성전기주식회사 커패시터 부품
JP7221616B2 (ja) * 2018-08-27 2023-02-14 太陽誘電株式会社 セラミック電子部品、セラミック電子部品の製造方法および電子部品実装回路基板
KR20200049661A (ko) * 2018-10-30 2020-05-08 티디케이가부시기가이샤 적층 세라믹 전자 부품
JP7247740B2 (ja) * 2019-05-15 2023-03-29 株式会社村田製作所 電子部品の実装構造体及びその製造方法
KR102724901B1 (ko) * 2019-06-24 2024-11-01 삼성전기주식회사 전자 부품
JP7275951B2 (ja) * 2019-07-16 2023-05-18 株式会社村田製作所 積層セラミックコンデンサ
JP7115461B2 (ja) * 2019-12-12 2022-08-09 株式会社村田製作所 積層セラミックコンデンサ
JP7522585B2 (ja) * 2020-06-01 2024-07-25 太陽誘電株式会社 電子部品、回路基板および電子部品の製造方法

Also Published As

Publication number Publication date
KR20250009005A (ko) 2025-01-16
KR20230103351A (ko) 2023-07-07
US12374497B2 (en) 2025-07-29
JP2023099433A (ja) 2023-07-13
US20230215647A1 (en) 2023-07-06

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