CN116323200A - 紫外线固化型树脂组合物 - Google Patents

紫外线固化型树脂组合物 Download PDF

Info

Publication number
CN116323200A
CN116323200A CN202180063490.8A CN202180063490A CN116323200A CN 116323200 A CN116323200 A CN 116323200A CN 202180063490 A CN202180063490 A CN 202180063490A CN 116323200 A CN116323200 A CN 116323200A
Authority
CN
China
Prior art keywords
resin composition
curable resin
ultraviolet curable
acid
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180063490.8A
Other languages
English (en)
Chinese (zh)
Inventor
木元裕纪
林泰则
莲见水贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN116323200A publication Critical patent/CN116323200A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/067—Polyurethanes; Polyureas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/52—Amides or imides
    • C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
    • C08F220/56—Acrylamide; Methacrylamide
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202180063490.8A 2020-12-23 2021-11-12 紫外线固化型树脂组合物 Pending CN116323200A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020213953 2020-12-23
JP2020-213953 2020-12-23
PCT/JP2021/041725 WO2022137881A1 (ja) 2020-12-23 2021-11-12 紫外線硬化型樹脂組成物

Publications (1)

Publication Number Publication Date
CN116323200A true CN116323200A (zh) 2023-06-23

Family

ID=82158977

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180063490.8A Pending CN116323200A (zh) 2020-12-23 2021-11-12 紫外线固化型树脂组合物

Country Status (7)

Country Link
US (1) US20240043596A1 (https=)
EP (1) EP4269103A4 (https=)
JP (1) JP7212200B2 (https=)
KR (1) KR20230124887A (https=)
CN (1) CN116323200A (https=)
TW (1) TWI900700B (https=)
WO (1) WO2022137881A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7619407B1 (ja) 2023-09-08 2025-01-22 ａｒｔｉｅｎｃｅ株式会社 活性エネルギー線硬化型組成物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006001863A (ja) * 2004-06-16 2006-01-05 New Japan Chem Co Ltd 重合性リン酸エステル及び該リン酸エステルを含有してなる光硬化性樹脂組成物
US20130137218A1 (en) * 2011-11-28 2013-05-30 Nitto Denko Corporation Under-fill material and method for producing semiconductor device
JP2015119106A (ja) * 2013-12-19 2015-06-25 リンテック株式会社 バックグラインドシート
CN110662870A (zh) * 2017-03-30 2020-01-07 株式会社可乐丽 剥离纸原纸和其制造方法、以及剥离纸
CN110741318A (zh) * 2017-06-06 2020-01-31 富士胶片株式会社 感光性树脂组合物、固化膜、层叠体、固化膜的制造方法、半导体装置及化合物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018646B2 (ja) * 1975-06-23 1985-05-11 三井東圧化学株式会社 硬化性樹脂の貯蔵方法
AU551593B2 (en) * 1981-05-20 1986-05-08 Dow Chemical Company, The Thermosettable resins stabilized with oxalic acid and phenothiazine
JPS6063211A (ja) * 1983-09-19 1985-04-11 Nippon Oil & Fats Co Ltd アクリル系熱硬化型樹脂組成物
JP5165829B2 (ja) * 2004-02-26 2013-03-21 日東電工株式会社 ロール状ウエハ加工用粘着シート
JP6106355B2 (ja) * 2011-02-07 2017-03-29 東亞合成株式会社 プラスチック製フィルム又はシート用活性エネルギー線硬化型接着剤組成物
BR112013025070A2 (pt) * 2011-03-31 2017-02-14 Fujifilm Corp emulsão graxa contendo prostaglandina
JP2013047321A (ja) * 2011-07-28 2013-03-07 Nitto Denko Corp 粘着シート
TWI674287B (zh) * 2013-09-03 2019-10-11 日商東亞合成股份有限公司 硬化性樹脂組成物
JP6340243B2 (ja) * 2014-04-25 2018-06-06 株式会社サクラクレパス 光硬化性人工爪組成物
US10825711B2 (en) * 2015-10-05 2020-11-03 Lintec Corporation Sheet for semiconductor processing
JP6703597B2 (ja) * 2016-03-31 2020-06-03 三井化学東セロ株式会社 半導体装置の製造方法
JP6763564B2 (ja) * 2016-05-27 2020-09-30 株式会社サクラクレパス 疎水性ウレタン（メタ）アクリレートオリゴマー含有自爪塗布用光硬化性人工爪組成物
JP7049796B2 (ja) 2017-09-29 2022-04-07 三井化学東セロ株式会社 粘着性フィルム
JP7049797B2 (ja) 2017-09-29 2022-04-07 三井化学東セロ株式会社 粘着性フィルム
CN110621754B (zh) * 2017-11-16 2021-03-05 昭和电工株式会社 粘接剂、叠层体、电池外装用包装材料、电池壳体及电池壳体的制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006001863A (ja) * 2004-06-16 2006-01-05 New Japan Chem Co Ltd 重合性リン酸エステル及び該リン酸エステルを含有してなる光硬化性樹脂組成物
US20130137218A1 (en) * 2011-11-28 2013-05-30 Nitto Denko Corporation Under-fill material and method for producing semiconductor device
JP2015119106A (ja) * 2013-12-19 2015-06-25 リンテック株式会社 バックグラインドシート
CN110662870A (zh) * 2017-03-30 2020-01-07 株式会社可乐丽 剥离纸原纸和其制造方法、以及剥离纸
CN110741318A (zh) * 2017-06-06 2020-01-31 富士胶片株式会社 感光性树脂组合物、固化膜、层叠体、固化膜的制造方法、半导体装置及化合物

Also Published As

Publication number Publication date
JP7212200B2 (ja) 2023-01-24
WO2022137881A1 (ja) 2022-06-30
KR20230124887A (ko) 2023-08-28
US20240043596A1 (en) 2024-02-08
TW202225366A (zh) 2022-07-01
EP4269103A1 (en) 2023-11-01
EP4269103A4 (en) 2024-06-19
TWI900700B (zh) 2025-10-11
JPWO2022137881A1 (https=) 2022-06-30

Similar Documents

Publication Publication Date Title
TWI460245B (zh) An adhesive composition and a method using its temporary fixing member
JP5727371B2 (ja) 光学部材用粘着剤組成物及び光学部材用粘着テープ
JP5966581B2 (ja) 両面粘着テープ及びその製造方法
CN107849397A (zh) 粘合片、带有粘合剂层的层叠体的制造方法、带有粘合剂层的层叠体、图像显示装置以及触摸面板
WO2010010900A1 (ja) 部材の仮固定・剥離方法及びそれに好適な仮固定用接着剤
JP7547499B2 (ja) 粘着テープ及び加工方法
JP2015507662A (ja) 乾式結合性アクリレート接着剤層
TW201431700A (zh) 附黏著層之透明面材、積層體、顯示裝置、及其等之製造方法
CN116323200A (zh) 紫外线固化型树脂组合物
JP2012241069A (ja) 接着剤組成物及び加工方法
TWI876113B (zh) 紫外線硬化型樹脂組合物
JP4861081B2 (ja) 半導体部材固定用粘着シート及びそれを用いた電子部品製造方法。
JP2009007581A (ja) 感圧性接着シート
JP2017179230A (ja) 光学用透明粘着シート
JP2006225443A (ja) 接着剤組成物
JP2009275091A (ja) 光学機能部材一体型表示装置用接着剤組成物、光学機能部材一体型表示装置及びその製造方法
JP7285641B2 (ja) 離型フィルム付き粘着シートおよびその製造方法
CN107001884A (zh) 光学用途用粘合剂组合物、光学用途用粘合剂组合物的制备方法和光学用途用粘合剂膜
JP2006290957A (ja) 組成物及びそれを用いる部材の仮固定方法
JP3384980B2 (ja) 無基材感圧性両面接着テープ・シート及びその製造方法
JP4543140B2 (ja) 回路基板保護用粘着シートおよびその製造方法
JP2010065235A (ja) 感圧性接着シート
JP2021169580A (ja) 光硬化型樹脂組成物
JP4380841B2 (ja) 熱接着性組成物とその接着シ―ト類
JP4995168B2 (ja) ガラス部材用接着剤組成物及びそれを用いるガラス部材の仮固定方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination