CN116261585A - 工件处理片及器件制造方法 - Google Patents

工件处理片及器件制造方法 Download PDF

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Publication number
CN116261585A
CN116261585A CN202180063345.XA CN202180063345A CN116261585A CN 116261585 A CN116261585 A CN 116261585A CN 202180063345 A CN202180063345 A CN 202180063345A CN 116261585 A CN116261585 A CN 116261585A
Authority
CN
China
Prior art keywords
workpiece
interface
layer
processing sheet
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180063345.XA
Other languages
English (en)
Chinese (zh)
Inventor
古野健太
福元彰朗
若山洋司
山口征太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority claimed from PCT/JP2021/045507 external-priority patent/WO2022153745A1/ja
Publication of CN116261585A publication Critical patent/CN116261585A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
CN202180063345.XA 2021-01-13 2021-12-10 工件处理片及器件制造方法 Pending CN116261585A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021003436 2021-01-13
JP2021-003436 2021-01-13
PCT/JP2021/045507 WO2022153745A1 (ja) 2021-01-13 2021-12-10 ワークハンドリングシートおよびデバイス製造方法

Publications (1)

Publication Number Publication Date
CN116261585A true CN116261585A (zh) 2023-06-13

Family

ID=86682945

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180063345.XA Pending CN116261585A (zh) 2021-01-13 2021-12-10 工件处理片及器件制造方法

Country Status (3)

Country Link
JP (1) JPWO2022153745A1 (https=)
KR (1) KR20230129372A (https=)
CN (1) CN116261585A (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103597589A (zh) * 2011-04-11 2014-02-19 北达科他州立大学研究基金会 分立元件的选择性激光辅助的转移
CN109417065A (zh) * 2017-06-12 2019-03-01 尤尼卡尔塔股份有限公司 分立组件向基板上的并行组装
WO2019207920A1 (ja) * 2018-04-26 2019-10-31 Jsr株式会社 半導体素子の実装方法および実装装置
US20200168498A1 (en) * 2017-06-12 2020-05-28 Uniqarta, Inc. Parallel assembly of discrete components onto a substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246278A (ja) 1988-08-06 1990-02-15 Marutaka Iryo Kk 陰イオン発生器付きパイプ
JP2002198569A (ja) * 2000-12-26 2002-07-12 Sony Corp 素子の転写方法、半導体装置、及び画像表示装置
JP2002314053A (ja) * 2001-04-19 2002-10-25 Sony Corp チップ部品の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP3608615B2 (ja) * 2001-04-19 2005-01-12 ソニー株式会社 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP4934942B2 (ja) * 2003-07-23 2012-05-23 ソニー株式会社 剥離方法
JP2010177390A (ja) * 2009-01-29 2010-08-12 Sony Corp 素子の移載方法および表示装置の製造方法
JP5444798B2 (ja) * 2009-04-10 2014-03-19 ソニー株式会社 素子の移載方法
KR20240057380A (ko) * 2021-09-06 2024-05-02 세키스이가가쿠 고교가부시키가이샤 반도체 장치 제조용 점착 테이프

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103597589A (zh) * 2011-04-11 2014-02-19 北达科他州立大学研究基金会 分立元件的选择性激光辅助的转移
CN109417065A (zh) * 2017-06-12 2019-03-01 尤尼卡尔塔股份有限公司 分立组件向基板上的并行组装
US20200168498A1 (en) * 2017-06-12 2020-05-28 Uniqarta, Inc. Parallel assembly of discrete components onto a substrate
JP2020188261A (ja) * 2017-06-12 2020-11-19 ユニカルタ・インコーポレイテッド 基板上に個別部品を並列に組み立てる方法
WO2019207920A1 (ja) * 2018-04-26 2019-10-31 Jsr株式会社 半導体素子の実装方法および実装装置

Also Published As

Publication number Publication date
JPWO2022153745A1 (https=) 2022-07-21
KR20230129372A (ko) 2023-09-08

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