JPWO2022153745A1 - - Google Patents

Info

Publication number
JPWO2022153745A1
JPWO2022153745A1 JP2022575143A JP2022575143A JPWO2022153745A1 JP WO2022153745 A1 JPWO2022153745 A1 JP WO2022153745A1 JP 2022575143 A JP2022575143 A JP 2022575143A JP 2022575143 A JP2022575143 A JP 2022575143A JP WO2022153745 A1 JPWO2022153745 A1 JP WO2022153745A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022575143A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2021/045507 external-priority patent/WO2022153745A1/ja
Publication of JPWO2022153745A1 publication Critical patent/JPWO2022153745A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
JP2022575143A 2021-01-13 2021-12-10 Pending JPWO2022153745A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021003436 2021-01-13
PCT/JP2021/045507 WO2022153745A1 (ja) 2021-01-13 2021-12-10 ワークハンドリングシートおよびデバイス製造方法

Publications (1)

Publication Number Publication Date
JPWO2022153745A1 true JPWO2022153745A1 (https=) 2022-07-21

Family

ID=86682945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022575143A Pending JPWO2022153745A1 (https=) 2021-01-13 2021-12-10

Country Status (3)

Country Link
JP (1) JPWO2022153745A1 (https=)
KR (1) KR20230129372A (https=)
CN (1) CN116261585A (https=)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198569A (ja) * 2000-12-26 2002-07-12 Sony Corp 素子の転写方法、半導体装置、及び画像表示装置
JP2002311858A (ja) * 2001-04-19 2002-10-25 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP2002314053A (ja) * 2001-04-19 2002-10-25 Sony Corp チップ部品の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP2005045074A (ja) * 2003-07-23 2005-02-17 Sony Corp 剥離方法
JP2010177390A (ja) * 2009-01-29 2010-08-12 Sony Corp 素子の移載方法および表示装置の製造方法
JP2010251359A (ja) * 2009-04-10 2010-11-04 Sony Corp 素子の移載方法
JP2014515883A (ja) * 2011-04-11 2014-07-03 エヌディーエスユー リサーチ ファウンデーション レーザで促進される、分離した部品の選択的な転写
JP2019527465A (ja) * 2017-06-12 2019-09-26 ユニカルタ・インコーポレイテッド 基板上に個別部品を並列に組み立てる方法
WO2019207920A1 (ja) * 2018-04-26 2019-10-31 Jsr株式会社 半導体素子の実装方法および実装装置
JP7219373B1 (ja) * 2021-09-06 2023-02-07 積水化学工業株式会社 半導体装置製造用粘着テープ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246278A (ja) 1988-08-06 1990-02-15 Marutaka Iryo Kk 陰イオン発生器付きパイプ
US11201077B2 (en) * 2017-06-12 2021-12-14 Kulicke & Soffa Netherlands B.V. Parallel assembly of discrete components onto a substrate

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198569A (ja) * 2000-12-26 2002-07-12 Sony Corp 素子の転写方法、半導体装置、及び画像表示装置
JP2002311858A (ja) * 2001-04-19 2002-10-25 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP2002314053A (ja) * 2001-04-19 2002-10-25 Sony Corp チップ部品の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP2005045074A (ja) * 2003-07-23 2005-02-17 Sony Corp 剥離方法
JP2010177390A (ja) * 2009-01-29 2010-08-12 Sony Corp 素子の移載方法および表示装置の製造方法
JP2010251359A (ja) * 2009-04-10 2010-11-04 Sony Corp 素子の移載方法
JP2014515883A (ja) * 2011-04-11 2014-07-03 エヌディーエスユー リサーチ ファウンデーション レーザで促進される、分離した部品の選択的な転写
JP2019527465A (ja) * 2017-06-12 2019-09-26 ユニカルタ・インコーポレイテッド 基板上に個別部品を並列に組み立てる方法
JP2020188261A (ja) * 2017-06-12 2020-11-19 ユニカルタ・インコーポレイテッド 基板上に個別部品を並列に組み立てる方法
WO2019207920A1 (ja) * 2018-04-26 2019-10-31 Jsr株式会社 半導体素子の実装方法および実装装置
JP7219373B1 (ja) * 2021-09-06 2023-02-07 積水化学工業株式会社 半導体装置製造用粘着テープ

Also Published As

Publication number Publication date
CN116261585A (zh) 2023-06-13
KR20230129372A (ko) 2023-09-08

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