KR20230129372A - 워크 핸들링 시트 및 디바이스 제조 방법 - Google Patents

워크 핸들링 시트 및 디바이스 제조 방법 Download PDF

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Publication number
KR20230129372A
KR20230129372A KR1020237004773A KR20237004773A KR20230129372A KR 20230129372 A KR20230129372 A KR 20230129372A KR 1020237004773 A KR1020237004773 A KR 1020237004773A KR 20237004773 A KR20237004773 A KR 20237004773A KR 20230129372 A KR20230129372 A KR 20230129372A
Authority
KR
South Korea
Prior art keywords
work
ablation
interfacial
handling sheet
ablation layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237004773A
Other languages
English (en)
Korean (ko)
Inventor
켄타 후루노
아키오 후쿠모토
요지 와카야마
세이타로 야마구치
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Priority claimed from PCT/JP2021/045507 external-priority patent/WO2022153745A1/ja
Publication of KR20230129372A publication Critical patent/KR20230129372A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H01L33/48—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
KR1020237004773A 2021-01-13 2021-12-10 워크 핸들링 시트 및 디바이스 제조 방법 Pending KR20230129372A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-003436 2021-01-13
JP2021003436 2021-01-13
PCT/JP2021/045507 WO2022153745A1 (ja) 2021-01-13 2021-12-10 ワークハンドリングシートおよびデバイス製造方法

Publications (1)

Publication Number Publication Date
KR20230129372A true KR20230129372A (ko) 2023-09-08

Family

ID=86682945

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237004773A Pending KR20230129372A (ko) 2021-01-13 2021-12-10 워크 핸들링 시트 및 디바이스 제조 방법

Country Status (3)

Country Link
JP (1) JPWO2022153745A1 (https=)
KR (1) KR20230129372A (https=)
CN (1) CN116261585A (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246278A (ja) 1988-08-06 1990-02-15 Marutaka Iryo Kk 陰イオン発生器付きパイプ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198569A (ja) * 2000-12-26 2002-07-12 Sony Corp 素子の転写方法、半導体装置、及び画像表示装置
JP2002314053A (ja) * 2001-04-19 2002-10-25 Sony Corp チップ部品の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP3608615B2 (ja) * 2001-04-19 2005-01-12 ソニー株式会社 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP4934942B2 (ja) * 2003-07-23 2012-05-23 ソニー株式会社 剥離方法
JP2010177390A (ja) * 2009-01-29 2010-08-12 Sony Corp 素子の移載方法および表示装置の製造方法
JP5444798B2 (ja) * 2009-04-10 2014-03-19 ソニー株式会社 素子の移載方法
WO2012142177A2 (en) * 2011-04-11 2012-10-18 Ndsu Research Foundation Selective laser-assisted transfer of discrete components
JP6720333B2 (ja) * 2017-06-12 2020-07-08 ユニカルタ・インコーポレイテッド 基板上に個別部品を並列に組み立てる方法
US11201077B2 (en) * 2017-06-12 2021-12-14 Kulicke & Soffa Netherlands B.V. Parallel assembly of discrete components onto a substrate
WO2019207920A1 (ja) * 2018-04-26 2019-10-31 Jsr株式会社 半導体素子の実装方法および実装装置
KR20240057380A (ko) * 2021-09-06 2024-05-02 세키스이가가쿠 고교가부시키가이샤 반도체 장치 제조용 점착 테이프

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246278A (ja) 1988-08-06 1990-02-15 Marutaka Iryo Kk 陰イオン発生器付きパイプ

Also Published As

Publication number Publication date
CN116261585A (zh) 2023-06-13
JPWO2022153745A1 (https=) 2022-07-21

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