CN116249722A - 组合物、固化体及有机el显示装置 - Google Patents

组合物、固化体及有机el显示装置 Download PDF

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Publication number
CN116249722A
CN116249722A CN202280006619.6A CN202280006619A CN116249722A CN 116249722 A CN116249722 A CN 116249722A CN 202280006619 A CN202280006619 A CN 202280006619A CN 116249722 A CN116249722 A CN 116249722A
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CN
China
Prior art keywords
composition
inorganic fine
fine particles
organic
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280006619.6A
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English (en)
Chinese (zh)
Inventor
三浦学
石田泰则
栗村启之
山下幸彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN116249722A publication Critical patent/CN116249722A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Optics & Photonics (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202280006619.6A 2021-03-31 2022-03-29 组合物、固化体及有机el显示装置 Pending CN116249722A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-059446 2021-03-31
JP2021059446 2021-03-31
PCT/JP2022/015693 WO2022210785A1 (ja) 2021-03-31 2022-03-29 組成物、硬化体及び有機ｅｌ表示装置

Publications (1)

Publication Number Publication Date
CN116249722A true CN116249722A (zh) 2023-06-09

Family

ID=83459513

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280006619.6A Pending CN116249722A (zh) 2021-03-31 2022-03-29 组合物、固化体及有机el显示装置

Country Status (5)

Country Link
JP (1) JP7671842B2 (https=)
KR (1) KR102917801B1 (https=)
CN (1) CN116249722A (https=)
TW (1) TWI898129B (https=)
WO (1) WO2022210785A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4820744A (en) * 1986-04-18 1989-04-11 G-C Dental Industrial Corp. Compositions for dental restoration
JP2004123775A (ja) * 2002-09-30 2004-04-22 Taiyo Ink Mfg Ltd 感光性熱硬化性ペースト組成物
CN103772649A (zh) * 2006-03-29 2014-05-07 汉高股份两合公司 辐射或热可固化的防渗密封胶
JP2015124286A (ja) * 2013-12-26 2015-07-06 株式会社ダイセル 硬化性組成物
WO2015166657A1 (ja) * 2014-05-02 2015-11-05 三井化学株式会社 シール材及びその硬化物
CN105557068A (zh) * 2014-01-23 2016-05-04 株式会社大赛璐 密封用组合物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001357973A (ja) 2000-06-15 2001-12-26 Sony Corp 表示装置
US8278401B2 (en) * 2006-03-29 2012-10-02 Henkel Ag & Co. Kgaa Radiation or thermally curable barrier sealants
JP5713959B2 (ja) * 2012-05-23 2015-05-07 株式会社東芝 電子機器、方法、およびプログラム
WO2021201013A1 (ja) * 2020-04-01 2021-10-07 デンカ株式会社 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び、有機エレクトロルミネッセンス表示装置の製造方法
WO2022085599A1 (ja) * 2020-10-20 2022-04-28 デンカ株式会社 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び、有機エレクトロルミネッセンス表示装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4820744A (en) * 1986-04-18 1989-04-11 G-C Dental Industrial Corp. Compositions for dental restoration
JP2004123775A (ja) * 2002-09-30 2004-04-22 Taiyo Ink Mfg Ltd 感光性熱硬化性ペースト組成物
CN103772649A (zh) * 2006-03-29 2014-05-07 汉高股份两合公司 辐射或热可固化的防渗密封胶
JP2015124286A (ja) * 2013-12-26 2015-07-06 株式会社ダイセル 硬化性組成物
CN105557068A (zh) * 2014-01-23 2016-05-04 株式会社大赛璐 密封用组合物
WO2015166657A1 (ja) * 2014-05-02 2015-11-05 三井化学株式会社 シール材及びその硬化物

Also Published As

Publication number Publication date
KR20230095934A (ko) 2023-06-29
JPWO2022210785A1 (https=) 2022-10-06
TWI898129B (zh) 2025-09-21
WO2022210785A1 (ja) 2022-10-06
KR102917801B1 (ko) 2026-01-23
JP7671842B2 (ja) 2025-05-02
TW202248353A (zh) 2022-12-16

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