KR102917801B1 - 조성물, 경화체 및 유기 el 표시장치 - Google Patents
조성물, 경화체 및 유기 el 표시장치Info
- Publication number
- KR102917801B1 KR102917801B1 KR1020237011513A KR20237011513A KR102917801B1 KR 102917801 B1 KR102917801 B1 KR 102917801B1 KR 1020237011513 A KR1020237011513 A KR 1020237011513A KR 20237011513 A KR20237011513 A KR 20237011513A KR 102917801 B1 KR102917801 B1 KR 102917801B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- inorganic fine
- composition
- fine particles
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
- C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
- Optics & Photonics (AREA)
- Polymerisation Methods In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2021-059446 | 2021-03-31 | ||
| JP2021059446 | 2021-03-31 | ||
| PCT/JP2022/015693 WO2022210785A1 (ja) | 2021-03-31 | 2022-03-29 | 組成物、硬化体及び有機el表示装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20230095934A KR20230095934A (ko) | 2023-06-29 |
| KR102917801B1 true KR102917801B1 (ko) | 2026-01-23 |
Family
ID=83459513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237011513A Active KR102917801B1 (ko) | 2021-03-31 | 2022-03-29 | 조성물, 경화체 및 유기 el 표시장치 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7671842B2 (https=) |
| KR (1) | KR102917801B1 (https=) |
| CN (1) | CN116249722A (https=) |
| TW (1) | TWI898129B (https=) |
| WO (1) | WO2022210785A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009531515A (ja) * | 2006-03-29 | 2009-09-03 | ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション | 放射線−または熱−硬化性バリヤシーラント |
| JP2015124286A (ja) * | 2013-12-26 | 2015-07-06 | 株式会社ダイセル | 硬化性組成物 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0653647B2 (ja) * | 1986-04-18 | 1994-07-20 | 而至歯科工業株式会社 | 歯科修復用組成物 |
| JP2001357973A (ja) | 2000-06-15 | 2001-12-26 | Sony Corp | 表示装置 |
| JP2004123775A (ja) * | 2002-09-30 | 2004-04-22 | Taiyo Ink Mfg Ltd | 感光性熱硬化性ペースト組成物 |
| CN103772649B (zh) * | 2006-03-29 | 2018-09-21 | 汉高股份两合公司 | 辐射或热可固化的防渗密封胶 |
| JP5713959B2 (ja) * | 2012-05-23 | 2015-05-07 | 株式会社東芝 | 電子機器、方法、およびプログラム |
| WO2015111525A1 (ja) * | 2014-01-23 | 2015-07-30 | 株式会社ダイセル | 封止用組成物 |
| CN106062121B (zh) * | 2014-05-02 | 2018-03-13 | 三井化学株式会社 | 密封材及其固化物 |
| WO2021201013A1 (ja) * | 2020-04-01 | 2021-10-07 | デンカ株式会社 | 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び、有機エレクトロルミネッセンス表示装置の製造方法 |
| WO2022085599A1 (ja) * | 2020-10-20 | 2022-04-28 | デンカ株式会社 | 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び、有機エレクトロルミネッセンス表示装置の製造方法 |
-
2022
- 2022-03-29 WO PCT/JP2022/015693 patent/WO2022210785A1/ja not_active Ceased
- 2022-03-29 KR KR1020237011513A patent/KR102917801B1/ko active Active
- 2022-03-29 CN CN202280006619.6A patent/CN116249722A/zh active Pending
- 2022-03-29 JP JP2023511425A patent/JP7671842B2/ja active Active
- 2022-03-30 TW TW111112078A patent/TWI898129B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009531515A (ja) * | 2006-03-29 | 2009-09-03 | ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション | 放射線−または熱−硬化性バリヤシーラント |
| JP2015124286A (ja) * | 2013-12-26 | 2015-07-06 | 株式会社ダイセル | 硬化性組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230095934A (ko) | 2023-06-29 |
| JPWO2022210785A1 (https=) | 2022-10-06 |
| TWI898129B (zh) | 2025-09-21 |
| WO2022210785A1 (ja) | 2022-10-06 |
| JP7671842B2 (ja) | 2025-05-02 |
| CN116249722A (zh) | 2023-06-09 |
| TW202248353A (zh) | 2022-12-16 |
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St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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