CN1160792C - 可伸缩的数据处理设备 - Google Patents

可伸缩的数据处理设备 Download PDF

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Publication number
CN1160792C
CN1160792C CNB998160482A CN99816048A CN1160792C CN 1160792 C CN1160792 C CN 1160792C CN B998160482 A CNB998160482 A CN B998160482A CN 99816048 A CN99816048 A CN 99816048A CN 1160792 C CN1160792 C CN 1160792C
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CN
China
Prior art keywords
thin
data processing
film
film device
processing apparatus
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Expired - Fee Related
Application number
CNB998160482A
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English (en)
Chinese (zh)
Other versions
CN1334963A (zh
Inventor
H��G���ŵ�ɭ
H·G·古德森
��˹��ŵ��
P·-E·诺达尔
G·I·莱斯塔德
R·M·贝尔格伦
A
J·R·A·卡尔松
B·G·古斯塔夫松
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FILM ELECTRONIC Co Ltd
Original Assignee
FILM ELECTRONIC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NO985707A external-priority patent/NO985707L/no
Application filed by FILM ELECTRONIC Co Ltd filed Critical FILM ELECTRONIC Co Ltd
Publication of CN1334963A publication Critical patent/CN1334963A/zh
Application granted granted Critical
Publication of CN1160792C publication Critical patent/CN1160792C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06551—Conductive connections on the side of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Dram (AREA)
CNB998160482A 1998-12-04 1999-12-03 可伸缩的数据处理设备 Expired - Fee Related CN1160792C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NO19985707 1998-12-04
NO985707A NO985707L (no) 1998-06-02 1998-12-04 Skalerbar datalagringsinnretning

Publications (2)

Publication Number Publication Date
CN1334963A CN1334963A (zh) 2002-02-06
CN1160792C true CN1160792C (zh) 2004-08-04

Family

ID=19902694

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB998160482A Expired - Fee Related CN1160792C (zh) 1998-12-04 1999-12-03 可伸缩的数据处理设备

Country Status (10)

Country Link
US (1) US6541869B1 (enExample)
EP (1) EP1135807A1 (enExample)
JP (1) JP3825257B2 (enExample)
KR (1) KR100437925B1 (enExample)
CN (1) CN1160792C (enExample)
AU (1) AU764850B2 (enExample)
CA (1) CA2353496C (enExample)
HK (1) HK1041982B (enExample)
RU (1) RU2201639C1 (enExample)
WO (1) WO2000038234A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6950129B1 (en) 2000-11-22 2005-09-27 Hewlett-Packard Development Company, L.P. One-time-use digital camera
US6756620B2 (en) * 2001-06-29 2004-06-29 Intel Corporation Low-voltage and interface damage-free polymer memory device
US6624457B2 (en) 2001-07-20 2003-09-23 Intel Corporation Stepped structure for a multi-rank, stacked polymer memory device and method of making same
EP1302441B1 (en) * 2001-10-10 2007-01-03 Rohm And Haas Company An improved method for making lithium borohydride
US7727777B2 (en) * 2002-05-31 2010-06-01 Ebrahim Andideh Forming ferroelectric polymer memories
US6828685B2 (en) * 2002-06-14 2004-12-07 Hewlett-Packard Development Company, L.P. Memory device having a semiconducting polymer film
EP1548833A4 (en) * 2002-08-19 2007-03-21 Seiko Epson Corp FERROELECTRIC STORAGE AND METHOD FOR THE PRODUCTION THEREOF
DE10308323B4 (de) * 2003-02-26 2007-10-11 Infineon Technologies Ag Halbleiterchipanordnung mit ROM
JP4411598B2 (ja) * 2004-09-30 2010-02-10 セイコーエプソン株式会社 転写元基板及び半導体装置の製造方法
NO20052904L (no) * 2005-06-14 2006-12-15 Thin Film Electronics Asa Et ikke-flyktig elektrisk minnesystem
US7898893B2 (en) * 2007-09-12 2011-03-01 Samsung Electronics Co., Ltd. Multi-layered memory devices
TW201207852A (en) * 2010-04-05 2012-02-16 Mosaid Technologies Inc Semiconductor memory device having a three-dimensional structure
JP6105266B2 (ja) 2011-12-15 2017-03-29 株式会社半導体エネルギー研究所 記憶装置
SG10201605470SA (en) 2012-01-23 2016-08-30 Semiconductor Energy Lab Co Ltd Semiconductor device
CN105632545B (zh) * 2015-03-27 2018-04-06 上海磁宇信息科技有限公司 一种3d内存芯片
WO2019132994A1 (en) * 2017-12-29 2019-07-04 Intel Corporation Memory arrays
CN109523921B (zh) * 2018-12-12 2021-07-23 上海天马有机发光显示技术有限公司 柔性显示面板和显示装置
WO2021070281A1 (ja) * 2019-10-09 2021-04-15 ウルトラメモリ株式会社 積層半導体、ウェハ積層体、積層半導体の製造方法、支援装置、及びプログラム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63186457A (ja) * 1987-01-29 1988-08-02 Hitachi Ltd 半導体装置及びその製造方法
JPH07112811B2 (ja) 1989-12-15 1995-12-06 美和ロック株式会社 車輌の盗難防止装置
RU2029391C1 (ru) * 1991-06-28 1995-02-20 Тимошков Юрий Викторович Элемент памяти
US5383269A (en) 1991-09-03 1995-01-24 Microelectronics And Computer Technology Corporation Method of making three dimensional integrated circuit interconnect module
US5375085A (en) 1992-09-30 1994-12-20 Texas Instruments Incorporated Three-dimensional ferroelectric integrated circuit without insulation layer between memory layers
EP0721662A1 (en) * 1993-09-30 1996-07-17 Kopin Corporation Three-dimensional processor using transferred thin film circuits
JPH088389A (ja) * 1994-04-20 1996-01-12 Fujitsu Ltd 半導体装置及び半導体装置ユニット
US5714768A (en) * 1995-10-24 1998-02-03 Energy Conversion Devices, Inc. Second-layer phase change memory array on top of a logic device
CA2218307C (en) * 1997-10-10 2006-01-03 Gennum Corporation Three dimensional packaging configuration for multi-chip module assembly
JP3876088B2 (ja) * 1999-01-29 2007-01-31 ローム株式会社 半導体チップおよびマルチチップ型半導体装置

Also Published As

Publication number Publication date
RU2001118285A (ru) 2004-03-10
KR20010080691A (ko) 2001-08-22
RU2201639C1 (ru) 2003-03-27
AU764850B2 (en) 2003-09-04
KR100437925B1 (ko) 2004-06-30
JP2002533928A (ja) 2002-10-08
CN1334963A (zh) 2002-02-06
WO2000038234A1 (en) 2000-06-29
CA2353496A1 (en) 2000-06-29
JP3825257B2 (ja) 2006-09-27
US6541869B1 (en) 2003-04-01
AU1699200A (en) 2000-07-12
HK1041982B (zh) 2005-04-29
CA2353496C (en) 2007-11-13
EP1135807A1 (en) 2001-09-26
HK1041982A1 (en) 2002-07-26

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